Findchips: Parametric Search Results for TEA1118AT


Select Parts		Part Number

		TEA1118AT Philips Semiconductors
		TEA1118AT NXP Semiconductors
		TEA1118ATD-T NXP Semiconductors
		TEA1118AT/C1 NXP Semiconductors
		TEA1118ATD-T Philips Semiconductors
		TEA1118ATD NXP Semiconductors
		TEA1118AT-T NXP Semiconductors

			Most Relevant		Technical				Compliance			Operating Conditions		Physical											Dimensions			Other
Composite Price	Rohs Code	Part Life Cycle Code	Supply Voltage-Nom	Technology	Telecom IC Type	Number of Functions	Supply Current-Max	Temperature Grade	JESD-30 Code	JESD-609 Code	Qualification Status	Operating Temperature-Max	Operating Temperature-Min	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Width	Length	Seated Height-Max	Ihs Manufacturer	Package Description	Reach Compliance Code	HTS Code	Part Package Code	Pin Count

Check for Price Buy

Transferred

2.9 V

BIPOLAR

1.4 mA

OTHER

R-PDSO-G14

Not Qualified

70 °C

-25 °C

PLASTIC/EPOXY

SOP

SOP14,.25

RECTANGULAR

SMALL OUTLINE

YES

Tin/Lead (Sn/Pb)

GULL WING

1.27 mm

DUAL

PHILIPS SEMICONDUCTORS

SOP, SOP14,.25

unknown

8542.39.00.01

Check for Price Buy

Obsolete

2.9 V

BIPOLAR

CORDLESS TELEPHONE BASEBAND CIRCUIT

1.4 mA

COMMERCIAL EXTENDED

R-PDSO-G14

Not Qualified

75 °C

-25 °C

PLASTIC/EPOXY

SOP

SOP14,.25

RECTANGULAR

SMALL OUTLINE

YES

Nickel/Palladium/Gold (Ni/Pd/Au)

GULL WING

1.27 mm

DUAL

3.9 mm

8.65 mm

1.75 mm

NXP SEMICONDUCTORS

SOP, SOP14,.25

unknown

8542.39.00.01

SOIC

Check for Price Buy

Obsolete

2.9 V

BIPOLAR

CORDLESS TELEPHONE BASEBAND CIRCUIT

1.4 mA

COMMERCIAL EXTENDED

R-PDSO-G14

Not Qualified

75 °C

-25 °C

PLASTIC/EPOXY

SOP

RECTANGULAR

SMALL OUTLINE

YES

GULL WING

1.27 mm

DUAL

3.9 mm

8.65 mm

1.75 mm

NXP SEMICONDUCTORS

SOP,

unknown

8542.39.00.01

SOIC

Check for Price Buy

Obsolete

2.9 V

BIPOLAR

CORDLESS TELEPHONE BASEBAND CIRCUIT

1.4 mA

COMMERCIAL EXTENDED

R-PDSO-G14

Not Qualified

75 °C

-25 °C

PLASTIC/EPOXY

SOP

RECTANGULAR

SMALL OUTLINE

YES

GULL WING

1.27 mm

DUAL

3.9 mm

8.65 mm

1.75 mm

NXP SEMICONDUCTORS

SOP,

unknown

8542.39.00.01

SOIC

Check for Price Buy

Transferred

2.9 V

BIPOLAR

1.4 mA

OTHER

R-PDSO-G14

Not Qualified

70 °C

-25 °C

PLASTIC/EPOXY

SOP

SOP14,.25

RECTANGULAR

SMALL OUTLINE

YES

Tin/Lead (Sn/Pb)

GULL WING

1.27 mm

DUAL

PHILIPS SEMICONDUCTORS

SOP, SOP14,.25

unknown

8542.39.00.01

Check for Price Buy

Obsolete

2.9 V

BIPOLAR

CORDLESS TELEPHONE BASEBAND CIRCUIT

1.4 mA

COMMERCIAL EXTENDED

R-PDSO-G14

Not Qualified

75 °C

-25 °C

PLASTIC/EPOXY

SOP

RECTANGULAR

SMALL OUTLINE

YES

GULL WING

1.27 mm

DUAL

3.9 mm

8.65 mm

1.75 mm

NXP SEMICONDUCTORS

SOP,

unknown

8542.39.00.01

SOIC

Check for Price Buy

Active

2.9 V

BIPOLAR

CORDLESS TELEPHONE BASEBAND CIRCUIT

1.4 mA

COMMERCIAL EXTENDED

R-PDSO-G14

Not Qualified

75 °C

-25 °C

PLASTIC/EPOXY

SOP

RECTANGULAR

SMALL OUTLINE

YES

NICKEL PALLADIUM GOLD

GULL WING

1.27 mm

DUAL

3.9 mm

8.65 mm

1.75 mm

NXP SEMICONDUCTORS

SOP,

unknown

8542.39.00.01

SOIC

Compare

TEA1118AT

Philips Semiconductors

Check for Price Buy

Transferred

2.9 V

BIPOLAR

1.4 mA

OTHER

R-PDSO-G14

Not Qualified

70 °C

-25 °C

PLASTIC/EPOXY

SOP

SOP14,.25

RECTANGULAR

SMALL OUTLINE

YES

Tin/Lead (Sn/Pb)

GULL WING

1.27 mm

DUAL

PHILIPS SEMICONDUCTORS

SOP, SOP14,.25

unknown

8542.39.00.01

TEA1118AT

NXP Semiconductors

Check for Price Buy

Obsolete

2.9 V

BIPOLAR

CORDLESS TELEPHONE BASEBAND CIRCUIT

1.4 mA

COMMERCIAL EXTENDED

R-PDSO-G14

Not Qualified

75 °C

-25 °C

PLASTIC/EPOXY

SOP

SOP14,.25

RECTANGULAR

SMALL OUTLINE

YES

Nickel/Palladium/Gold (Ni/Pd/Au)

GULL WING

1.27 mm

DUAL

3.9 mm

8.65 mm

1.75 mm

NXP SEMICONDUCTORS

SOP, SOP14,.25

unknown

8542.39.00.01

SOIC

TEA1118ATD-T

NXP Semiconductors

Check for Price Buy

Obsolete

2.9 V

BIPOLAR

CORDLESS TELEPHONE BASEBAND CIRCUIT

1.4 mA

COMMERCIAL EXTENDED

R-PDSO-G14

Not Qualified

75 °C

-25 °C

PLASTIC/EPOXY

SOP

RECTANGULAR

SMALL OUTLINE

YES

GULL WING

1.27 mm

DUAL

3.9 mm

8.65 mm

1.75 mm

NXP SEMICONDUCTORS

SOP,

unknown

8542.39.00.01

SOIC

TEA1118AT/C1

NXP Semiconductors

Check for Price Buy

Obsolete

2.9 V

BIPOLAR

CORDLESS TELEPHONE BASEBAND CIRCUIT

1.4 mA

COMMERCIAL EXTENDED

R-PDSO-G14

Not Qualified

75 °C

-25 °C

PLASTIC/EPOXY

SOP

RECTANGULAR

SMALL OUTLINE

YES

GULL WING

1.27 mm

DUAL

3.9 mm

8.65 mm

1.75 mm

NXP SEMICONDUCTORS

SOP,

unknown

8542.39.00.01

SOIC

TEA1118ATD-T

Philips Semiconductors

Check for Price Buy

Transferred

2.9 V

BIPOLAR

1.4 mA

OTHER

R-PDSO-G14

Not Qualified

70 °C

-25 °C

PLASTIC/EPOXY

SOP

SOP14,.25

RECTANGULAR

SMALL OUTLINE

YES

Tin/Lead (Sn/Pb)

GULL WING

1.27 mm

DUAL

PHILIPS SEMICONDUCTORS

SOP, SOP14,.25

unknown

8542.39.00.01

TEA1118ATD

NXP Semiconductors

Check for Price Buy

Obsolete

2.9 V

BIPOLAR

CORDLESS TELEPHONE BASEBAND CIRCUIT

1.4 mA

COMMERCIAL EXTENDED

R-PDSO-G14

Not Qualified

75 °C

-25 °C

PLASTIC/EPOXY

SOP

RECTANGULAR

SMALL OUTLINE

YES

GULL WING

1.27 mm

DUAL

3.9 mm

8.65 mm

1.75 mm

NXP SEMICONDUCTORS

SOP,

unknown

8542.39.00.01

SOIC

TEA1118AT-T

NXP Semiconductors

Check for Price Buy

Active

2.9 V

BIPOLAR

CORDLESS TELEPHONE BASEBAND CIRCUIT

1.4 mA

COMMERCIAL EXTENDED

R-PDSO-G14

Not Qualified

75 °C

-25 °C

PLASTIC/EPOXY

SOP

RECTANGULAR

SMALL OUTLINE

YES

NICKEL PALLADIUM GOLD

GULL WING

1.27 mm

DUAL

3.9 mm

8.65 mm

1.75 mm

NXP SEMICONDUCTORS

SOP,

unknown

8542.39.00.01

SOIC

Parametric results for: TEA1118AT under Cordless Telephone ICs