Part Details for ISL32453EIBZ-T7A by Intersil Corporation
Results Overview of ISL32453EIBZ-T7A by Intersil Corporation
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- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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ISL32453EIBZ-T7A Information
ISL32453EIBZ-T7A by Intersil Corporation is a Line Driver or Receiver.
Line Driver or Receivers are under the broader part category of Drivers And Interfaces.
A driver controls the current or voltage delivered to components like LCDs or motors, while an interface component connects systems for data transfer and control. Read more about Drivers And Interfaces on our Drivers And Interfaces part category page.
Part Details for ISL32453EIBZ-T7A
ISL32453EIBZ-T7A CAD Models
ISL32453EIBZ-T7A Part Data Attributes
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ISL32453EIBZ-T7A
Intersil Corporation
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Datasheet
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ISL32453EIBZ-T7A
Intersil Corporation
±60V Fault Protected, 3.3V to 5V, ±20V CMR, 1Mbps Full-Duplex RS-485/RS-422, ±15kV ESD; MSOP10, SOIC14; Temp Range: -40° to 85°C
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| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | INTERSIL CORP | |
| Part Package Code | MSOP, SOIC | |
| Package Description | SOIC-14 | |
| Pin Count | 10, 14 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.39.00.01 | |
| Additional Feature | ALSO OPERATES IN VCC 4.5 TO 5.5 V | |
| Differential Output | YES | |
| Driver Number of Bits | 1 | |
| Input Characteristics | DIFFERENTIAL SCHMITT TRIGGER | |
| Interface IC Type | LINE TRANSCEIVER | |
| Interface Standard | EIA-422; EIA-485 | |
| JESD-30 Code | R-PDSO-G14 | |
| JESD-609 Code | e3 | |
| Length | 8.65 mm | |
| Moisture Sensitivity Level | 2 | |
| Number of Functions | 1 | |
| Number of Terminals | 14 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Out Swing-Min | 1.1 V | |
| Output Low Current-Max | 0.005 A | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | SOP | |
| Package Equivalence Code | SOP14,.25 | |
| Package Shape | RECTANGULAR | |
| Package Style | SMALL OUTLINE | |
| Peak Reflow Temperature (Cel) | 260 | |
| Qualification Status | Not Qualified | |
| Receive Delay-Max | 200 ns | |
| Receiver Number of Bits | 1 | |
| Seated Height-Max | 1.75 mm | |
| Supply Current-Max | 4.5 mA | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 3 V | |
| Supply Voltage-Nom | 3.3 V | |
| Surface Mount | YES | |
| Technology | BICMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | MATTE TIN | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | DUAL | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Transmit Delay-Max | 200 ns | |
| Width | 3.9 mm |
ISL32453EIBZ-T7A Frequently Asked Questions (FAQ)
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A good PCB layout for the ISL32453EIBZ-T7A involves keeping the analog and digital grounds separate, using a solid ground plane, and minimizing trace lengths and loops. It's also recommended to place the device close to the signal sources and to use a low-ESR capacitor for power decoupling.
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To ensure reliable operation over the full temperature range, it's essential to follow proper PCB design and layout guidelines, use a suitable thermal interface material, and ensure good airflow around the device. Additionally, consider using a thermally conductive package or a heat sink if the device will be operating in high-temperature environments.
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Operating the ISL32453EIBZ-T7A at a lower supply voltage than recommended may result in reduced performance, increased power consumption, and potential reliability issues. Operating at a higher supply voltage than recommended may cause the device to exceed its maximum ratings, leading to permanent damage or failure.
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To troubleshoot common issues, start by verifying the PCB layout and design, checking for proper power supply decoupling, and ensuring that the input and output capacitors are correctly sized. Use an oscilloscope to measure the output voltage and check for noise or oscillations. Consult the datasheet and application notes for guidance on troubleshooting specific issues.
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Yes, the ISL32453EIBZ-T7A is a high-frequency device, and proper EMI/EMC design considerations are essential. Use a shielded enclosure, keep the device away from other noise sources, and ensure that the PCB layout is designed to minimize radiation. Follow proper grounding and shielding techniques, and consider using EMI filters or absorbers if necessary.