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Parametric results for: um7512cr under PIN Diodes

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Select Parts		Part Number

		UM7512CRE3 Microchip Technology Inc
		UM7512CR Microsemi Corporation
		UM7512CRE3 Microsemi Corporation
		UM7512CR Microchip Technology Inc

				Most Relevant										Technical			Compliance			Physical								Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Diode Capacitance-Max	Power Dissipation-Max	Diode Forward Resistance-Max	Diode Element Material	Breakdown Voltage-Min	Diode Type	Configuration	Surface Mount	Number of Elements	Technology	Additional Feature	Application	Minority Carrier Lifetime-Nom	Qualification Status	JESD-30 Code	JESD-609 Code	Case Connection	Number of Terminals	Package Body Material	Package Shape	Package Style	Terminal Finish	Terminal Form	Terminal Position	Ihs Manufacturer	Package Description	Reach Compliance Code	ECCN Code	HTS Code	Pin Count

Check for Price Buy

Active

1 pF

10 W

1 Ω

SILICON

1.2 kV

PIN DIODE

SINGLE

NO

1

POSITIVE-INTRINSIC-NEGATIVE

LOW DISTORTION, METALLURGICALLY BONDED

ATTENUATOR; SWITCHING

3.5 µs

O-XUPM-N1

ISOLATED

1

UNSPECIFIED

ROUND

POST/STUD MOUNT

NO LEAD

UPPER

MICROCHIP TECHNOLOGY INC

HERMETIC SEALED PACKAGE-1

compliant

EAR99

8541.10.00.80

Check for Price Buy

No

No

Transferred

1 pF

10 W

1 Ω

SILICON

PIN DIODE

SINGLE

NO

1

POSITIVE-INTRINSIC-NEGATIVE

LOW DISTORTION, METALLURGICALLY BONDED

ATTENUATOR; SWITCHING

3.5 µs

Not Qualified

O-XUPM-N1

e0

ANODE

1

UNSPECIFIED

ROUND

POST/STUD MOUNT

TIN LEAD

NO LEAD

UPPER

MICROSEMI CORP

HERMETIC SEALED PACKAGE-1

compliant

EAR99

8541.10.00.80

1

Check for Price Buy

Transferred

1 pF

10 W

1 Ω

SILICON

PIN DIODE

SINGLE

NO

1

POSITIVE-INTRINSIC-NEGATIVE

LOW DISTORTION, METALLURGICALLY BONDED

ATTENUATOR; SWITCHING

3.5 µs

O-XUPM-N1

ANODE

1

UNSPECIFIED

ROUND

POST/STUD MOUNT

NO LEAD

UPPER

MICROSEMI CORP

HERMETIC SEALED PACKAGE-1

compliant

EAR99

8541.10.00.80

Check for Price Buy

No

Active

1 pF

10 W

1 Ω

SILICON

1.2 kV

PIN DIODE

SINGLE

NO

1

POSITIVE-INTRINSIC-NEGATIVE

LOW DISTORTION, METALLURGICALLY BONDED

ATTENUATOR; SWITCHING

3.5 µs

Not Qualified

O-XUPM-N1

e0

ISOLATED

1

UNSPECIFIED

ROUND

POST/STUD MOUNT

TIN LEAD

NO LEAD

UPPER

MICROCHIP TECHNOLOGY INC

HERMETIC SEALED PACKAGE-1

compliant

EAR99

8541.10.00.60

Compare

Microchip Technology Inc

Check for Price Buy

Active

1 pF

10 W

1 Ω

SILICON

1.2 kV

PIN DIODE

SINGLE

NO

1

POSITIVE-INTRINSIC-NEGATIVE

LOW DISTORTION, METALLURGICALLY BONDED

ATTENUATOR; SWITCHING

3.5 µs

O-XUPM-N1

ISOLATED

1

UNSPECIFIED

ROUND

POST/STUD MOUNT

NO LEAD

UPPER

MICROCHIP TECHNOLOGY INC

HERMETIC SEALED PACKAGE-1

compliant

EAR99

8541.10.00.80

Microsemi Corporation

Check for Price Buy

No

No

Transferred

1 pF

10 W

1 Ω

SILICON

PIN DIODE

SINGLE

NO

1

POSITIVE-INTRINSIC-NEGATIVE

LOW DISTORTION, METALLURGICALLY BONDED

ATTENUATOR; SWITCHING

3.5 µs

Not Qualified

O-XUPM-N1

e0

ANODE

1

UNSPECIFIED

ROUND

POST/STUD MOUNT

TIN LEAD

NO LEAD

UPPER

MICROSEMI CORP

HERMETIC SEALED PACKAGE-1

compliant

EAR99

8541.10.00.80

1

Microsemi Corporation

Check for Price Buy

Transferred

1 pF

10 W

1 Ω

SILICON

PIN DIODE

SINGLE

NO

1

POSITIVE-INTRINSIC-NEGATIVE

LOW DISTORTION, METALLURGICALLY BONDED

ATTENUATOR; SWITCHING

3.5 µs

O-XUPM-N1

ANODE

1

UNSPECIFIED

ROUND

POST/STUD MOUNT

NO LEAD

UPPER

MICROSEMI CORP

HERMETIC SEALED PACKAGE-1

compliant

EAR99

8541.10.00.80

Microchip Technology Inc

Check for Price Buy

No

Active

1 pF

10 W

1 Ω

SILICON

1.2 kV

PIN DIODE

SINGLE

NO

1

POSITIVE-INTRINSIC-NEGATIVE

LOW DISTORTION, METALLURGICALLY BONDED

ATTENUATOR; SWITCHING

3.5 µs

Not Qualified

O-XUPM-N1

e0

ISOLATED

1

UNSPECIFIED

ROUND

POST/STUD MOUNT

TIN LEAD

NO LEAD

UPPER

MICROCHIP TECHNOLOGY INC

HERMETIC SEALED PACKAGE-1

compliant

EAR99

8541.10.00.60