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Parametric results for: stbc02bjr under Power Management Circuits

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	Part Number

STMicroelectronics

			Most Relevant						Technical				Compliance	Operating Conditions				Physical									Dimensions			Other
Composite Price	Rohs Code	Part Life Cycle Code	Supply Voltage-Nom (Vsup)	Supply Voltage-Min (Vsup)	Supply Voltage-Max (Vsup)	Number of Channels	Surface Mount	Adjustable Threshold	Additional Feature	Analog IC - Other Type	Number of Functions	Temperature Grade	JESD-30 Code	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Shape	Package Style	Surface Mount	Terminal Form	Terminal Pitch	Terminal Position	Width	Length	Seated Height-Max	Ihs Manufacturer	Package Description	Manufacturer Package Code	Reach Compliance Code	ECCN Code	HTS Code	Samacsys Manufacturer

Check for Price Buy

Yes

Active

5 V

4.55 V

5.4 V

2

YES

YES

OTHER SUPPLY VOLTAGE= 4.75 V TO 5.4 V

POWER SUPPLY MANAGEMENT CIRCUIT

1

INDUSTRIAL

R-PBGA-B30

85 °C

-40 °C

NOT SPECIFIED

NOT SPECIFIED

30

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

BALL

400 µm

BOTTOM

2.25 mm

2.59 mm

600 µm

STMICROELECTRONICS

FLIP CHIP-30

Chip Scale Package 0.4mm pitch

compliant

EAR99

8542.39.00.01

STMicroelectronics

Compare

STMicroelectronics

Check for Price Buy

Yes

Active

5 V

4.55 V

5.4 V

2

YES

YES

OTHER SUPPLY VOLTAGE= 4.75 V TO 5.4 V

POWER SUPPLY MANAGEMENT CIRCUIT

1

INDUSTRIAL

R-PBGA-B30

85 °C

-40 °C

NOT SPECIFIED

NOT SPECIFIED

30

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

BALL

400 µm

BOTTOM

2.25 mm

2.59 mm

600 µm

STMICROELECTRONICS

FLIP CHIP-30

Chip Scale Package 0.4mm pitch

compliant

EAR99

8542.39.00.01

STMicroelectronics