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Parametric results for: s70fs01gsdsbhi210 under Flash Memories

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Select Parts		Part Number

		S70FS01GSDSBHI210 Spansion
		S70FS01GSDSBHI210 Infineon Technologies AG
		S70FS01GSDSBHI210 Cypress Semiconductor

			Most Relevant					Technical															Compliance	Operating Conditions					Physical									Dimensions			Other
Composite Price	Rohs Code	Part Life Cycle Code	Memory Density	Memory Width	Organization	Supply Voltage-Nom (Vsup)	Clock Frequency-Max (fCLK)	Memory IC Type	Additional Feature	Alternate Memory Width	Boot Block	Number of Functions	Number of Words Code	Number of Words	Operating Mode	Parallel/Serial	Programming Voltage	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Technology	Temperature Grade	Type	JESD-30 Code	Moisture Sensitivity Level	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Shape	Package Style	Surface Mount	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Length	Width	Ihs Manufacturer	Package Description	Reach Compliance Code	ECCN Code	HTS Code

Check for Price

Transferred

1.0737 Gbit

4

256MX4

1.8 V

80 MHz

FLASH

IT ALSO HAVE MEMORY WIDTH X1

2

BOTTOM

1

256000000

268.4355 M

SYNCHRONOUS

SERIAL

1.8 V

2 V

1.7 V

CMOS

INDUSTRIAL

NOR TYPE

R-PBGA-B24

85 °C

-40 °C

24

PLASTIC/EPOXY

TBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE

YES

BALL

1 mm

BOTTOM

1.2 mm

8 mm

6 mm

SPANSION INC

BGA-24

unknown

EAR99

8542.32.00.51

Check for Price

Yes

Active

1.0737 Gbit

4

256MX4

1.8 V

80 MHz

FLASH

IT ALSO HAVE MEMORY WIDTH X1

2

1

256000000

268.4355 M

SYNCHRONOUS

SERIAL

1.8 V

2 V

1.7 V

CMOS

INDUSTRIAL

R-PBGA-B24

3

85 °C

-40 °C

24

PLASTIC/EPOXY

TBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE

YES

BALL

1 mm

BOTTOM

1.2 mm

8 mm

6 mm

INFINEON TECHNOLOGIES AG

compliant

Check for Price

Yes

Transferred

1.0737 Gbit

4

256MX4

1.8 V

80 MHz

FLASH

IT ALSO HAVE MEMORY WIDTH X1

2

1

256000000

268.4355 M

SYNCHRONOUS

SERIAL

1.8 V

2 V

1.7 V

CMOS

INDUSTRIAL

R-PBGA-B24

85 °C

-40 °C

NOT SPECIFIED

NOT SPECIFIED

24

PLASTIC/EPOXY

TBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE

YES

BALL

1 mm

BOTTOM

1.2 mm

8 mm

6 mm

CYPRESS SEMICONDUCTOR CORP

compliant

3A991.B.1.A

8542.32.00.71

Compare

S70FS01GSDSBHI210

Spansion

Check for Price

Transferred

1.0737 Gbit

4

256MX4

1.8 V

80 MHz

FLASH

IT ALSO HAVE MEMORY WIDTH X1

2

BOTTOM

1

256000000

268.4355 M

SYNCHRONOUS

SERIAL

1.8 V

2 V

1.7 V

CMOS

INDUSTRIAL

NOR TYPE

R-PBGA-B24

85 °C

-40 °C

24

PLASTIC/EPOXY

TBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE

YES

BALL

1 mm

BOTTOM

1.2 mm

8 mm

6 mm

SPANSION INC

BGA-24

unknown

EAR99

8542.32.00.51

S70FS01GSDSBHI210

Infineon Technologies AG

Check for Price

Yes

Active

1.0737 Gbit

4

256MX4

1.8 V

80 MHz

FLASH

IT ALSO HAVE MEMORY WIDTH X1

2

1

256000000

268.4355 M

SYNCHRONOUS

SERIAL

1.8 V

2 V

1.7 V

CMOS

INDUSTRIAL

R-PBGA-B24

3

85 °C

-40 °C

24

PLASTIC/EPOXY

TBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE

YES

BALL

1 mm

BOTTOM

1.2 mm

8 mm

6 mm

INFINEON TECHNOLOGIES AG

compliant

S70FS01GSDSBHI210

Cypress Semiconductor

Check for Price

Yes

Transferred

1.0737 Gbit

4

256MX4

1.8 V

80 MHz

FLASH

IT ALSO HAVE MEMORY WIDTH X1

2

1

256000000

268.4355 M

SYNCHRONOUS

SERIAL

1.8 V

2 V

1.7 V

CMOS

INDUSTRIAL

R-PBGA-B24

85 °C

-40 °C

NOT SPECIFIED

NOT SPECIFIED

24

PLASTIC/EPOXY

TBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE

YES

BALL

1 mm

BOTTOM

1.2 mm

8 mm

6 mm

CYPRESS SEMICONDUCTOR CORP

compliant

3A991.B.1.A

8542.32.00.71