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S29GL512P11TFI010
Spansion
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$4.6435 | Yes | Yes | Transferred | 536.8709 Mbit | 1 | 128K | 512MX1 | 3 V | 110 ns | FLASH | 8 | YES | YES | YES | 1 | 512 | 512000000 | 536.8709 M | ASYNCHRONOUS | 8/16 words | PARALLEL | 3 V | YES | 5 µA | 110 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | YES | NOR TYPE | R-PDSO-G56 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 260 | 40 | 56 | PLASTIC/EPOXY | HTSSOP | TSSOP56,.8,20 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH | YES | MATTE TIN | GULL WING | 500 µm | DUAL | 1.2 mm | 18.4 mm | 14 mm | SPANSION INC | TSOP1 | 20 X 14 MM, LEAD FREE, MO-142EC, TSOP-56 | 56 | compliant | 3A991.B.1.A | 8542.32.00.51 | Spansion | |||
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S29GL512P11TFI010
Cypress Semiconductor
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Check for Price | Yes | Obsolete | 536.8709 Mbit | 8 | 128K | 64MX8 | 3 V | 110 ns | FLASH | 1 | BOTTOM/TOP | YES | YES | YES | 1 | 512 | 64000000 | 67.1089 M | ASYNCHRONOUS | 8/16 words | PARALLEL | 3 V | YES | 5 µA | 110 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | YES | NOR TYPE | R-PDSO-G56 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 260 | 40 | 56 | PLASTIC/EPOXY | HTSSOP | TSSOP56,.8,20 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH | YES | MATTE TIN | GULL WING | 500 µm | DUAL | 1.2 mm | 18.4 mm | 14 mm | CYPRESS SEMICONDUCTOR CORP | TSOP-56 | compliant | EAR99 | 8542.32.00.51 | ||||||
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S29GL512P11TFI010
AMD
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Check for Price | Yes | Transferred | 536.8709 Mbit | 16 | 128K | 32MX16 | 110 ns | FLASH | 8 | YES | YES | YES | 512 | 32000000 | 33.5544 M | 8/16 words | PARALLEL | YES | 5 µA | 80 µA | CMOS | INDUSTRIAL | YES | NOR TYPE | R-PDSO-G56 | Not Qualified | 85 °C | -40 °C | 56 | PLASTIC/EPOXY | TSSOP | TSSOP56,.8,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | GULL WING | 500 µm | DUAL | ADVANCED MICRO DEVICES INC | unknown | EAR99 | 8542.32.00.51 |