Findchips: Parametric Search Results for s29gl256p11ffi023


Select Parts		Part Number

		S29GL256P11FFI023 Infineon Technologies AG
		S29GL256P11FFI023 AMD
		S29GL256P11FFI023 Cypress Semiconductor
		S29GL256P11FFI023 Spansion

				Most Relevant						Technical																								Compliance			Operating Conditions					Physical											Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Memory Density	Memory Width	Sector Size	Organization	Supply Voltage-Nom (Vsup)	Access Time-Max	Memory IC Type	Alternate Memory Width	Boot Block	Command User Interface	Common Flash Interface	Data Polling	Number of Functions	Number of Sectors/Size	Number of Words Code	Number of Words	Operating Mode	Output Characteristics	Page Size	Parallel/Serial	Programming Voltage	Ready/Busy	Standby Current-Max	Supply Current-Max	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Technology	Temperature Grade	Toggle Bit	Type	JESD-30 Code	Qualification Status	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Length	Width	Ihs Manufacturer	Package Description	Reach Compliance Code	ECCN Code	HTS Code	Part Package Code	Pin Count

Check for Price

Yes

Obsolete

268.4355 Mbit

128K

32MX8

3 V

110 ns

FLASH

BOTTOM/TOP

YES

256

32000000

33.5544 M

ASYNCHRONOUS

3-STATE

8/16 words

PARALLEL

3 V

YES

5 µA

110 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PBGA-B64

Not Qualified

85 °C

-40 °C

260

PLASTIC/EPOXY

LBGA

BGA64,8X8,40

RECTANGULAR

GRID ARRAY, LOW PROFILE

YES

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

1 mm

BOTTOM

1.4 mm

13 mm

11 mm

INFINEON TECHNOLOGIES AG

FBGA-64

compliant

Check for Price

Yes

Transferred

268.4355 Mbit

128K

16MX16

110 ns

FLASH

YES

256

16000000

16.7772 M

ASYNCHRONOUS

3-STATE

8/16 words

PARALLEL

YES

5 µA

80 µA

CMOS

INDUSTRIAL

YES

NOR TYPE

S-PBGA-B64

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

BGA

BGA64,8X8,40

SQUARE

GRID ARRAY

YES

BALL

1 mm

BOTTOM

ADVANCED MICRO DEVICES INC

FBGA-64

unknown

EAR99

8542.32.00.51

Check for Price

Yes

Transferred

268.4355 Mbit

128K

32MX8

3 V

110 ns

FLASH

BOTTOM/TOP

YES

256

32000000

33.5544 M

ASYNCHRONOUS

3-STATE

8/16 words

PARALLEL

3 V

YES

5 µA

110 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PBGA-B64

Not Qualified

85 °C

-40 °C

260

PLASTIC/EPOXY

LBGA

BGA64,8X8,40

RECTANGULAR

GRID ARRAY, LOW PROFILE

YES

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

1 mm

BOTTOM

1.4 mm

13 mm

11 mm

CYPRESS SEMICONDUCTOR CORP

FBGA-64

compliant

3A991.B.1.A

8542.32.00.51

Check for Price

Yes

Transferred

268.4355 Mbit

128K

16MX16

3 V

110 ns

FLASH

YES

256

16000000

16.7772 M

ASYNCHRONOUS

3-STATE

8/16 words

PARALLEL

3 V

YES

5 µA

110 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PBGA-B64

Not Qualified

85 °C

-40 °C

260

PLASTIC/EPOXY

LBGA

BGA64,8X8,40

RECTANGULAR

GRID ARRAY, LOW PROFILE

YES

TIN SILVER COPPER

BALL

1 mm

BOTTOM

1.4 mm

13 mm

11 mm

SPANSION INC

FBGA-64

compliant

EAR99

8542.32.00.51

BGA

Compare

S29GL256P11FFI023

Infineon Technologies AG

Check for Price

Yes

Obsolete

268.4355 Mbit

128K

32MX8

3 V

110 ns

FLASH

BOTTOM/TOP

YES

256

32000000

33.5544 M

ASYNCHRONOUS

3-STATE

8/16 words

PARALLEL

3 V

YES

5 µA

110 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PBGA-B64

Not Qualified

85 °C

-40 °C

260

PLASTIC/EPOXY

LBGA

BGA64,8X8,40

RECTANGULAR

GRID ARRAY, LOW PROFILE

YES

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

1 mm

BOTTOM

1.4 mm

13 mm

11 mm

INFINEON TECHNOLOGIES AG

FBGA-64

compliant

S29GL256P11FFI023

AMD

Check for Price

Yes

Transferred

268.4355 Mbit

128K

16MX16

110 ns

FLASH

YES

256

16000000

16.7772 M

ASYNCHRONOUS

3-STATE

8/16 words

PARALLEL

YES

5 µA

80 µA

CMOS

INDUSTRIAL

YES

NOR TYPE

S-PBGA-B64

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

BGA

BGA64,8X8,40

SQUARE

GRID ARRAY

YES

BALL

1 mm

BOTTOM

ADVANCED MICRO DEVICES INC

FBGA-64

unknown

EAR99

8542.32.00.51

S29GL256P11FFI023

Cypress Semiconductor

Check for Price

Yes

Transferred

268.4355 Mbit

128K

32MX8

3 V

110 ns

FLASH

BOTTOM/TOP

YES

256

32000000

33.5544 M

ASYNCHRONOUS

3-STATE

8/16 words

PARALLEL

3 V

YES

5 µA

110 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PBGA-B64

Not Qualified

85 °C

-40 °C

260

PLASTIC/EPOXY

LBGA

BGA64,8X8,40

RECTANGULAR

GRID ARRAY, LOW PROFILE

YES

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

1 mm

BOTTOM

1.4 mm

13 mm

11 mm

CYPRESS SEMICONDUCTOR CORP

FBGA-64

compliant

3A991.B.1.A

8542.32.00.51

S29GL256P11FFI023

Spansion

Check for Price

Yes

Transferred

268.4355 Mbit

128K

16MX16

3 V

110 ns

FLASH

YES

256

16000000

16.7772 M

ASYNCHRONOUS

3-STATE

8/16 words

PARALLEL

3 V

YES

5 µA

110 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PBGA-B64

Not Qualified

85 °C

-40 °C

260

PLASTIC/EPOXY

LBGA

BGA64,8X8,40

RECTANGULAR

GRID ARRAY, LOW PROFILE

YES

TIN SILVER COPPER

BALL

1 mm

BOTTOM

1.4 mm

13 mm

11 mm

SPANSION INC

FBGA-64

compliant

EAR99

8542.32.00.51

BGA

Parametric results for: s29gl256p11ffi023 under Flash Memories