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Manufacturer Part Number: omap3525ecusa

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	Part Number

OMAP3525ECUSA

Texas Instruments

				Most Relevant		Technical			Compliance			Operating Conditions					Physical										Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Speed	Surface Mount	uPs/uCs/Peripheral ICs Type	Technology	Temperature Grade	JESD-30 Code	Qualification Status	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Width	Length	Ihs Manufacturer	Part Package Code	Pin Count	Reach Compliance Code	ECCN Code	HTS Code	Samacsys Manufacturer

Check for Price

Yes

Active

600 MHz

YES

MICROPROCESSOR, RISC

CMOS

INDUSTRIAL

S-PBGA-B423

Not Qualified

105 °C

-40 °C

260

423

PLASTIC/EPOXY

LFBGA

BGA423,24X24,25

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

650 µm

BOTTOM

1.4 mm

16 mm

TEXAS INSTRUMENTS INC

BGA

423

compliant

5A992.C

8542.31.00.01

Texas Instruments

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OMAP3525ECUSA

Texas Instruments

Check for Price

Yes

Active

600 MHz

YES

MICROPROCESSOR, RISC

CMOS

INDUSTRIAL

S-PBGA-B423

Not Qualified

105 °C

-40 °C

260

423

PLASTIC/EPOXY

LFBGA

BGA423,24X24,25

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

650 µm

BOTTOM

1.4 mm

16 mm

TEXAS INSTRUMENTS INC

BGA

423

compliant

5A992.C

8542.31.00.01

Texas Instruments