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NC7SP08L6X
Rochester Electronics LLC
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Check for Price | Yes | Yes | Active | 1.1 V | 46.3 ns | 1 | 2 | YES | VSON | P | AND GATE | CMOS | 3.6 V | 900 mV | INDUSTRIAL | R-PDSO-N6 | e4 | 1 | 85 °C | -40 °C | 260 | 30 | 6 | PLASTIC/EPOXY | RECTANGULAR | SMALL OUTLINE, VERY THIN PROFILE | NICKEL GOLD | NO LEAD | 500 µm | DUAL | 550 µm | 1 mm | 1.45 mm | ROCHESTER ELECTRONICS INC | SON | VSON, | 6 | unknown | |||||||||||||
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NC7SP08L6X
Fairchild Semiconductor Corporation
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Check for Price | Yes | Yes | Transferred | 1.1 V | 46.3 ns | 46.3 ns | 1 | 2 | YES | VSON | 30 pF | NO | P | AND GATE | CMOS | 500 µA | 3.6 V | 900 mV | INDUSTRIAL | R-PDSO-N6 | Not Qualified | e4 | 1 | 85 °C | -40 °C | 260 | 30 | 6 | PLASTIC/EPOXY | SOLCC6,.04,20 | RECTANGULAR | SMALL OUTLINE, VERY THIN PROFILE | TR | NICKEL PALLADIUM GOLD | NO LEAD | 500 µm | DUAL | 550 µm | 1 mm | 1.45 mm | FAIRCHILD SEMICONDUCTOR CORP | MICROPAK MLP | 1 MM, MO-252UAAD, MICROPAK-6 | 6 | unknown | 6LD, MICROPAK, JEDEC MO-252, 1.0MM WIDE - MLP (PREMOLDED) | EAR99 | 8542.39.00.01 | |||
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NC7SP08L6X
onsemi
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Check for Price | Yes | Yes | Active | 1.1 V | 46.3 ns | 46.3 ns | 1 | 2 | YES | VSON | 30 pF | NO | P | AND GATE | CMOS | 500 µA | 3.6 V | 900 mV | INDUSTRIAL | R-PDSO-N6 | Not Qualified | e4 | 1 | 85 °C | -40 °C | 260 | 30 | 6 | PLASTIC/EPOXY | SOLCC6,.04,20 | RECTANGULAR | SMALL OUTLINE, VERY THIN PROFILE | TR | Nickel/Palladium/Gold (Ni/Pd/Au) | NO LEAD | 500 µm | DUAL | 550 µm | 1 mm | 1.45 mm | ONSEMI | SIP-6 | compliant | 127EB | 8542.39.00.01 | onsemi |