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Parametric » Microcontrollers and Processors » Microprocessors

Parametric results for: mpc860enzq50d4 under Microprocessors

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Manufacturer Part Number: mpc860enzq50d4
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MPC860ENZQ50D4
 NXP Semiconductors 		$107.4485 No Obsolete 32 50 MHz 32 32 50 MHz YES 3.3 V MICROPROCESSOR, RISC CMOS YES FIXED POINT YES YES 3.465 V 3.135 V S-PBGA-B357 Not Qualified e0 3 245 30 357 PLASTIC/EPOXY BGA BGA357,19X19,50 SQUARE GRID ARRAY Tin/Lead (Sn/Pb) BALL 1.27 mm BOTTOM 2.52 mm 25 mm 25 mm NXP SEMICONDUCTORS 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 not_compliant 3A991.A.2 8542.31.00.01 NXP
MPC860ENZQ50D4R2
 NXP Semiconductors 		$114.6000 No Obsolete 32 50 MHz 32 32 50 MHz YES 3.3 V MICROPROCESSOR, RISC CMOS YES FIXED POINT YES YES 3.465 V 3.135 V S-PBGA-B357 Not Qualified e0 3 245 30 357 PLASTIC/EPOXY BGA BGA357,19X19,50 SQUARE GRID ARRAY Tin/Lead (Sn/Pb) BALL 1.27 mm BOTTOM 2.52 mm 25 mm 25 mm NXP SEMICONDUCTORS 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 not_compliant 3A991.A.2 8542.31.00.01 NXP
MPC860ENZQ50D4
 Freescale Semiconductor 		Check for Price No No Transferred 32 50 MHz 32 32 50 MHz YES 3.3 V MICROPROCESSOR, RISC CMOS YES FIXED POINT YES YES 3.465 V 3.135 V S-PBGA-B357 Not Qualified e0 3 245 30 357 PLASTIC/EPOXY BGA BGA357,19X19,50 SQUARE GRID ARRAY Tin/Lead (Sn/Pb) BALL 1.27 mm BOTTOM 2.52 mm 25 mm 25 mm FREESCALE SEMICONDUCTOR INC 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 not_compliant 3A991.A.2 8542.31.00.01 BGA 357
MPC860ENZQ50D4R2
 Freescale Semiconductor 		Check for Price No No Transferred 32 50 MHz 32 32 50 MHz YES 3.3 V MICROPROCESSOR, RISC CMOS YES FIXED POINT YES YES 3.465 V 3.135 V S-PBGA-B357 Not Qualified e0 3 245 30 357 PLASTIC/EPOXY BGA BGA357,19X19,50 SQUARE GRID ARRAY Tin/Lead (Sn/Pb) BALL 1.27 mm BOTTOM 2.52 mm 25 mm 25 mm FREESCALE SEMICONDUCTOR INC 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 not_compliant 3A991.A.2 8542.31.00.01 BGA 357
MPC860ENZQ50D4
 Rochester Electronics LLC 		Check for Price No No Obsolete 32 50 MHz 32 32 50 MHz YES 3.3 V MICROPROCESSOR, RISC YES FIXED POINT YES YES 3.465 V 3.135 V S-PBGA-B357 COMMERCIAL e0 3 245 30 357 PLASTIC/EPOXY BGA SQUARE GRID ARRAY TIN LEAD BALL 1.27 mm BOTTOM 2.52 mm 25 mm 25 mm ROCHESTER ELECTRONICS LLC 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 unknown BGA 357
MPC860ENZQ50D4R2
 Rochester Electronics LLC 		Check for Price No No Active 32 50 MHz 32 32 50 MHz YES 3.3 V MICROPROCESSOR, RISC YES FIXED POINT YES YES 3.465 V 3.135 V S-PBGA-B357 COMMERCIAL e0 3 245 30 357 PLASTIC/EPOXY BGA SQUARE GRID ARRAY TIN LEAD BALL 1.27 mm BOTTOM 2.52 mm 25 mm 25 mm ROCHESTER ELECTRONICS LLC 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 unknown BGA 357