Findchips: Parametric Search Results for mc7447athx1167nb


Select Parts		Part Number

		MC7447ATHX1167NB NXP Semiconductors
		MC7447ATHX1167NB Freescale Semiconductor
		MC7447ATHX1167NB Rochester Electronics LLC

				Most Relevant							Technical									Compliance			Operating Conditions			Physical									Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Bit Size	Speed	External Data Bus Width	Address Bus Width	Clock Frequency-Max	Surface Mount	Supply Voltage-Nom	uPs/uCs/Peripheral ICs Type	Technology	Additional Feature	Boundary Scan	Format	Integrated Cache	Low Power Mode	Supply Voltage-Max	Supply Voltage-Min	JESD-30 Code	Qualification Status	JESD-609 Code	Moisture Sensitivity Level	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Shape	Package Style	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Width	Length	Ihs Manufacturer	Package Description	Reach Compliance Code	ECCN Code	HTS Code	Samacsys Manufacturer	Part Package Code	Pin Count

$1,224.3500 Buy

Obsolete

1.167 GHz

167 MHz

YES

1.3 V

MICROPROCESSOR, RISC

CMOS

ALSO REQUIRES 1.8V OR 2.5V SUPPLY

YES

FLOATING POINT

YES

1.35 V

1.25 V

S-CBGA-B360

Not Qualified

260

360

CERAMIC, METAL-SEALED COFIRED

BGA

SQUARE

GRID ARRAY

Tin/Lead (Sn/Pb)

BALL

1.27 mm

BOTTOM

3.24 mm

25 mm

NXP SEMICONDUCTORS

25 X 25 MM, 3.24 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360

unknown

3A991.A.1

8542.31.00.01

NXP

Check for Price Buy

Transferred

1.167 GHz

167 MHz

YES

1.3 V

MICROPROCESSOR, RISC

CMOS

ALSO REQUIRES 1.8V OR 2.5V SUPPLY

YES

FLOATING POINT

YES

1.35 V

1.25 V

S-CBGA-B360

Not Qualified

260

360

CERAMIC, METAL-SEALED COFIRED

BGA

SQUARE

GRID ARRAY

Tin/Lead (Sn/Pb)

BALL

1.27 mm

BOTTOM

3.24 mm

25 mm

FREESCALE SEMICONDUCTOR INC

25 X 25 MM, 3.24 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360

not_compliant

3A991.A.1

8542.31.00.01

BGA

360

Check for Price Buy

Active

1.167 GHz

167 MHz

YES

1.3 V

MICROPROCESSOR, RISC

CMOS

ALSO REQUIRES 1.8V OR 2.5V SUPPLY

YES

FLOATING POINT

YES

1.35 V

1.25 V

S-CBGA-B360

COMMERCIAL

260

360

CERAMIC, METAL-SEALED COFIRED

BGA

SQUARE

GRID ARRAY

TIN LEAD

BALL

1.27 mm

BOTTOM

3.24 mm

25 mm

ROCHESTER ELECTRONICS LLC

25 X 25 MM, 3.24 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360

unknown

BGA

360

Compare

MC7447ATHX1167NB

NXP Semiconductors

$1,224.3500 Buy

Obsolete

1.167 GHz

167 MHz

YES

1.3 V

MICROPROCESSOR, RISC

CMOS

ALSO REQUIRES 1.8V OR 2.5V SUPPLY

YES

FLOATING POINT

YES

1.35 V

1.25 V

S-CBGA-B360

Not Qualified

260

360

CERAMIC, METAL-SEALED COFIRED

BGA

SQUARE

GRID ARRAY

Tin/Lead (Sn/Pb)

BALL

1.27 mm

BOTTOM

3.24 mm

25 mm

NXP SEMICONDUCTORS

25 X 25 MM, 3.24 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360

unknown

3A991.A.1

8542.31.00.01

NXP

MC7447ATHX1167NB

Freescale Semiconductor

Check for Price Buy

Transferred

1.167 GHz

167 MHz

YES

1.3 V

MICROPROCESSOR, RISC

CMOS

ALSO REQUIRES 1.8V OR 2.5V SUPPLY

YES

FLOATING POINT

YES

1.35 V

1.25 V

S-CBGA-B360

Not Qualified

260

360

CERAMIC, METAL-SEALED COFIRED

BGA

SQUARE

GRID ARRAY

Tin/Lead (Sn/Pb)

BALL

1.27 mm

BOTTOM

3.24 mm

25 mm

FREESCALE SEMICONDUCTOR INC

25 X 25 MM, 3.24 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360

not_compliant

3A991.A.1

8542.31.00.01

BGA

360

MC7447ATHX1167NB

Rochester Electronics LLC

Check for Price Buy

Active

1.167 GHz

167 MHz

YES

1.3 V

MICROPROCESSOR, RISC

CMOS

ALSO REQUIRES 1.8V OR 2.5V SUPPLY

YES

FLOATING POINT

YES

1.35 V

1.25 V

S-CBGA-B360

COMMERCIAL

260

360

CERAMIC, METAL-SEALED COFIRED

BGA

SQUARE

GRID ARRAY

TIN LEAD

BALL

1.27 mm

BOTTOM

3.24 mm

25 mm

ROCHESTER ELECTRONICS LLC

25 X 25 MM, 3.24 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360

unknown

BGA

360

Parametric results for: mc7447athx1167nb under Microprocessors