Parametric results for: max16057att17+ under Power Management Circuits
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MAX16057ATT17+T
Maxim Integrated Products
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$3.3559 | Yes | Yes | Transferred | 1.8 V | 1.1 V | 5.5 V | 15 µA | +1.665V | 1 | YES | YES | BAT BUP SW:N;MNL RST:Y;OV DET:N;PW FL IP... more | VOLTAGE SUPERVISOR/RESET IC | 1 | BICMOS | AUTOMOTIVE | S-XQCC-N6 | e3 | Not Qualified | 1 | 125 °C | -40 °C | 260 | 30 | 6 | UNSPECIFIED | HVQCCN | SOLCC6,.12,38 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | MATTE TIN | NO LEAD | 950 µm | QUAD | 3 mm | 3 mm | 800 µm | MAXIM INTEGRATED PRODUCTS INC | DFN | 6 | compliant | EAR99 | 8542.39.00.01 | ||||||
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MAX16057ATT17+
Maxim Integrated Products
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$3.7566 | Yes | Yes | Transferred | 3.3 V | 1.1 V | 5.5 V | 15 µA | +1.665V | 1 | YES | NO | BAT BUP SW:N;MNL RST:Y;OV DET:N;PW FL IP... more | VOLTAGE SUPERVISOR/RESET IC | 1 | BICMOS | AUTOMOTIVE | S-XDSO-N6 | e3 | Not Qualified | 1 | 125 °C | -40 °C | 260 | 30 | 6 | UNSPECIFIED | HVSON | SOLCC6,.12,38 | SQUARE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | YES | MATTE TIN | NO LEAD | 950 µm | DUAL | 3 mm | 3 mm | 800 µm | MAXIM INTEGRATED PRODUCTS INC | DFN | 6 | compliant | EAR99 | 8542.39.00.01 | HVSON, SOLCC6,.12,38 | |||||
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MAX16057ATT17+
Analog Devices Inc
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Check for Price | Yes | Active | 3.3 V | 1.1 V | 5.5 V | 15 µA | +1.665V | 1 | YES | NO | BAT BUP SW:N;MNL RST:Y;OV DET:N;PW FL IP... more | VOLTAGE SUPERVISOR/RESET IC | 1 | BICMOS | AUTOMOTIVE | S-XDSO-N6 | e3 | Not Qualified | 1 | 125 °C | -40 °C | 260 | 30 | 6 | UNSPECIFIED | HVSON | SOLCC6,.12,38 | SQUARE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | YES | Matte Tin (Sn) | NO LEAD | 950 µm | DUAL | 3 mm | 3 mm | 800 µm | ANALOG DEVICES INC | 6-LFCSP-3X3X0.75 | 6 | 6-LFCSP-3X3X0.75 | 2009-08-14 | Analog Devices | |||||||
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MAX16057ATT17+T
Analog Devices Inc
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Check for Price | Yes | Active | 1.8 V | 1.1 V | 5.5 V | 15 µA | +1.665V | 1 | YES | YES | BAT BUP SW:N;MNL RST:Y;OV DET:N;PW FL IP... more | VOLTAGE SUPERVISOR/RESET IC | 1 | BICMOS | AUTOMOTIVE | S-XQCC-N6 | e3 | Not Qualified | 1 | 125 °C | -40 °C | 260 | 30 | 6 | UNSPECIFIED | HVQCCN | SOLCC6,.12,38 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | YES | Matte Tin (Sn) | NO LEAD | 950 µm | QUAD | 3 mm | 3 mm | 800 µm | ANALOG DEVICES INC | 6-LFCSP-3X3X0.75 | 6 | compliant | TDFN-EP-6 | 6-LFCSP-3X3X0.75 | 2009-08-14 | Analog Devices |