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CGA2B2C0G1H090D050BA
TDK Corporation
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$0.0225 | Yes | Yes | Active | 9 pF | 50 V | 5.5556 % | 0402 | C0G | 5.5556 % | SURFACE MOUNT | Yes | CERAMIC | CERAMIC CAPACITOR | 30ppm/Cel ppm/°C | e3 | AEC-Q200 | 125 °C | -55 °C | 2 | RECTANGULAR PACKAGE | SMT | TR, 7 INCH | YES | MATTE TIN OVER NICKEL | WRAPAROUND | 500 µm | 1 mm | 500 µm | TDK CORP | CHIP | compliant | EAR99 | 8532.24.00.20 | TDK | ||
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CGA2B2C0G1H090DT
TDK Corporation
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Check for Price | Yes | Active | 9 pF | 50 V | 5.56 % | 0402 | C0G | 5.56 % | SURFACE MOUNT | Yes | CERAMIC | CERAMIC CAPACITOR | 30ppm/Cel ppm/°C | e3 | AEC-Q200 | 125 °C | -55 °C | 2 | RECTANGULAR PACKAGE | TR, PAPER, 7/13 INCH | YES | MATTE TIN OVER NICKEL | WRAPAROUND | TDK CORP | CHIP | compliant | EAR99 | 8532.24.00.20 | ||||||||
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CGA2B2C0G1H090D050BD
TDK Corporation
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Check for Price | Yes | Yes | Active | 9 pF | 50 V | 5.556 % | 0402 | C0G | 5.556 % | SURFACE MOUNT | Yes | CERAMIC | CERAMIC CAPACITOR | 30ppm/Cel ppm/°C | AEC-Q200 | 125 °C | -55 °C | 2 | RECTANGULAR PACKAGE | SMT | TR, 7 INCH | YES | SILVER PALLADIUM COPPER | WRAPAROUND | 500 µm | 1 mm | 500 µm | TDK CORP | CHIP | compliant | EAR99 | 8532.24.00.20 | TDK | |||
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CGA2B2C0G1H090D
TDK Corporation
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Check for Price | Yes | Obsolete | 9 pF | 50 V | 5.5556 % | 0402 | C0G | 5.5556 % | SURFACE MOUNT | Yes | CERAMIC | CERAMIC CAPACITOR | 30ppm/Cel ppm/°C | e3 | AEC-Q200 | 125 °C | -55 °C | 2 | SMT | YES | Matte Tin (Sn) - with Nickel (Ni) barrier | WRAPAROUND | 500 µm | 1 mm | 500 µm | TDK CORP | CHIP | compliant | EAR99 | 8532.24.00.20 |