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UXN40M7K/TR
Microchip Technology Inc
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$454.3300 | Active | 3.3 V | YES | 39.5 GHz | ANALOG MULTIPLIER OR DIVIDER | 1 | INDUSTRIAL | S-CQCC-N24 | 85 °C | -40 °C | 24 | CERAMIC, METAL-SEALED COFIRED | HVQCCN | LCC24,.16SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | NO LEAD | 500 µm | QUAD | 3.9 mm | 900 µm | 3.9 mm | MICROCHIP TECHNOLOGY INC | PACKAGE-24 | compliant | Microchip | |||||
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UXN40M7K
Microchip Technology Inc
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$456.2172 | Active | 3.3 V | YES | 39.5 GHz | ANALOG MULTIPLIER OR DIVIDER | 1 | INDUSTRIAL | S-CQCC-N24 | 85 °C | -40 °C | 24 | CERAMIC, METAL-SEALED COFIRED | HVQCCN | LCC24,.16SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | NO LEAD | 500 µm | QUAD | 3.9 mm | 900 µm | 3.9 mm | MICROCHIP TECHNOLOGY INC | compliant | Microchip | ||||||
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UXN40M7K
Microsemi Corporation
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Check for Price | Yes | Transferred | 3.3 V | YES | 49.5 GHz | ANALOG MULTIPLIER OR DIVIDER | 1 | INDUSTRIAL | S-CQCC-N24 | 85 °C | -40 °C | 24 | CERAMIC, METAL-SEALED COFIRED | HVQCCN | LCC24,.16SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | NO LEAD | 500 µm | QUAD | 3.9 mm | 900 µm | 3.9 mm | MICROSEMI CORP | PACKAGE-24 | compliant | Microsemi Corporation | EAR99 | 8542.39.00.01 |