Findchips: Parametric Search Results for TSXPC603RVGU12LC


Select Parts		Part Number

		TSXPC603RVGU12LC Teledyne e2v
		TS(X)PC603RVGU12L(C) Thales Group
		TS(X)PC603RVGU12L(C) Atmel Corporation
		TS(X)PC603RVGU12L(C) Teledyne e2v
		TSXPC603RVGU12LC Atmel Corporation

				Most Relevant							Technical									Compliance			Operating Conditions				Physical										Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Bit Size	Speed	External Data Bus Width	Address Bus Width	Clock Frequency-Max	Surface Mount	Supply Voltage-Nom	uPs/uCs/Peripheral ICs Type	Technology	Boundary Scan	Format	Integrated Cache	Low Power Mode	Supply Voltage-Max	Supply Voltage-Min	Temperature Grade	JESD-30 Code	Qualification Status	JESD-609 Code	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Width	Length	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Reach Compliance Code	ECCN Code	HTS Code

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Obsolete

266 MHz

75 MHz

YES

2.5 V

MICROPROCESSOR, RISC

CMOS

YES

FLOATING POINT

YES

2.625 V

2.375 V

S-CBGA-B255

Not Qualified

255

CERAMIC, METAL-SEALED COFIRED

BGA

SQUARE

GRID ARRAY

TIN LEAD

BALL

1.27 mm

BOTTOM

3 mm

21 mm

TELEDYNE E2V (UK) LTD

BGA

21 X 21 MM, 3 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255

255

compliant

3A991.A.2

8542.31.00.01

Check for Price

Transferred

266 MHz

YES

2.5 V

MICROPROCESSOR, RISC

CMOS

YES

FLOATING POINT

YES

2.625 V

2.375 V

INDUSTRIAL

S-CBGA-B255

Not Qualified

110 °C

-40 °C

255

CERAMIC, METAL-SEALED COFIRED

BGA

SQUARE

GRID ARRAY

BALL

BOTTOM

THOMSON-CSF SEMICONDUCTORS

unknown

3A991.A.2

8542.31.00.01

Check for Price

Transferred

266 MHz

YES

2.5 V

MICROPROCESSOR, RISC

CMOS

YES

FLOATING POINT

YES

2.625 V

2.375 V

INDUSTRIAL

S-CBGA-B255

Not Qualified

110 °C

-40 °C

255

CERAMIC, METAL-SEALED COFIRED

BGA

SQUARE

GRID ARRAY

BALL

1.27 mm

BOTTOM

3 mm

21 mm

ATMEL CORP

BGA

BGA,

255

unknown

Check for Price

Active

266 MHz

YES

2.5 V

MICROPROCESSOR, RISC

CMOS

YES

FLOATING POINT

YES

2.625 V

2.375 V

INDUSTRIAL

S-CBGA-B255

Not Qualified

110 °C

-40 °C

NOT SPECIFIED

255

CERAMIC, METAL-SEALED COFIRED

BGA

SQUARE

GRID ARRAY

TIN LEAD

BALL

1.27 mm

BOTTOM

3 mm

21 mm

E2V TECHNOLOGIES PLC

BGA

BGA,

255

unknown

Check for Price

Transferred

266 MHz

75 MHz

YES

2.5 V

MICROPROCESSOR, RISC

CMOS

YES

FLOATING POINT

YES

2.625 V

2.375 V

S-CBGA-B255

Not Qualified

255

CERAMIC, METAL-SEALED COFIRED

BGA

BGA255,16X16,50

SQUARE

GRID ARRAY

TIN LEAD

BALL

1.27 mm

BOTTOM

3 mm

21 mm

ATMEL CORP

BGA

21 X 21 MM, 3 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255

255

compliant

3A991.A.2

8542.31.00.01

Compare

TSXPC603RVGU12LC

Teledyne e2v

Check for Price

Obsolete

266 MHz

75 MHz

YES

2.5 V

MICROPROCESSOR, RISC

CMOS

YES

FLOATING POINT

YES

2.625 V

2.375 V

S-CBGA-B255

Not Qualified

255

CERAMIC, METAL-SEALED COFIRED

BGA

SQUARE

GRID ARRAY

TIN LEAD

BALL

1.27 mm

BOTTOM

3 mm

21 mm

TELEDYNE E2V (UK) LTD

BGA

21 X 21 MM, 3 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255

255

compliant

3A991.A.2

8542.31.00.01

TS(X)PC603RVGU12L(C)

Thales Group

Check for Price

Transferred

266 MHz

YES

2.5 V

MICROPROCESSOR, RISC

CMOS

YES

FLOATING POINT

YES

2.625 V

2.375 V

INDUSTRIAL

S-CBGA-B255

Not Qualified

110 °C

-40 °C

255

CERAMIC, METAL-SEALED COFIRED

BGA

SQUARE

GRID ARRAY

BALL

BOTTOM

THOMSON-CSF SEMICONDUCTORS

unknown

3A991.A.2

8542.31.00.01

TS(X)PC603RVGU12L(C)

Atmel Corporation

Check for Price

Transferred

266 MHz

YES

2.5 V

MICROPROCESSOR, RISC

CMOS

YES

FLOATING POINT

YES

2.625 V

2.375 V

INDUSTRIAL

S-CBGA-B255

Not Qualified

110 °C

-40 °C

255

CERAMIC, METAL-SEALED COFIRED

BGA

SQUARE

GRID ARRAY

BALL

1.27 mm

BOTTOM

3 mm

21 mm

ATMEL CORP

BGA

BGA,

255

unknown

TS(X)PC603RVGU12L(C)

Teledyne e2v

Check for Price

Active

266 MHz

YES

2.5 V

MICROPROCESSOR, RISC

CMOS

YES

FLOATING POINT

YES

2.625 V

2.375 V

INDUSTRIAL

S-CBGA-B255

Not Qualified

110 °C

-40 °C

NOT SPECIFIED

255

CERAMIC, METAL-SEALED COFIRED

BGA

SQUARE

GRID ARRAY

TIN LEAD

BALL

1.27 mm

BOTTOM

3 mm

21 mm

E2V TECHNOLOGIES PLC

BGA

BGA,

255

unknown

TSXPC603RVGU12LC

Atmel Corporation

Check for Price

Transferred

266 MHz

75 MHz

YES

2.5 V

MICROPROCESSOR, RISC

CMOS

YES

FLOATING POINT

YES

2.625 V

2.375 V

S-CBGA-B255

Not Qualified

255

CERAMIC, METAL-SEALED COFIRED

BGA

BGA255,16X16,50

SQUARE

GRID ARRAY

TIN LEAD

BALL

1.27 mm

BOTTOM

3 mm

21 mm

ATMEL CORP

BGA

21 X 21 MM, 3 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255

255

compliant

3A991.A.2

8542.31.00.01

Parametric results for: TSXPC603RVGU12LC under Microprocessors