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Manufacturer Part Number: stm32w108hbu64

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	Part Number

STM32W108HBU64

STMicroelectronics

			Most Relevant								Technical						Compliance			Operating Conditions					Physical										Dimensions			Other
Composite Price	Rohs Code	Part Life Cycle Code	Bit Size	Speed	ROM (words)	RAM (bytes)	CPU Family	Surface Mount	Supply Voltage-Nom	uPs/uCs/Peripheral ICs Type	Technology	ROM Programmability	Supply Current-Max	Supply Voltage-Max	Supply Voltage-Min	Temperature Grade	JESD-30 Code	Qualification Status	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Width	Length	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Manufacturer Package Code	Reach Compliance Code	HTS Code

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Yes

Obsolete

24 MHz

131072

8192

CORTEX-M3

YES

1.25 V

Bluetooth SoC

CMOS

FLASH

150 mA

1.32 V

1.18 V

INDUSTRIAL

S-XQCC-N40

Not Qualified

85 °C

-40 °C

260

UNSPECIFIED

HVQCCN

LCC40,.24SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

MATTE TIN

NO LEAD

500 µm

QUAD

1 mm

6 mm

STMICROELECTRONICS

QFN

6 X 6 MM, 0.50 MM PITCH, ROHS COMPLIANT, VFQFPN-40

VFQFPN

compliant

8542.31.00.01