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Parametric results for: SAM9X60-V/DWB under Microprocessors

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Select Parts		Part Number

		SAM9X60-V/DWB Microchip Technology Inc
		SAM9X60-V/DWBVAO Microchip Technology Inc
		SAM9X60V/DWB Microchip Technology Inc

		Most Relevant								Technical												Compliance	Operating Conditions			Physical									Dimensions			Other
Composite Price	Part Life Cycle Code	Bit Size	Speed	RAM (words)	External Data Bus Width	Address Bus Width	Clock Frequency-Max	Surface Mount	Supply Voltage-Nom	uPs/uCs/Peripheral ICs Type	Technology	Boundary Scan	Format	Integrated Cache	Low Power Mode	Number of DMA Channels	Number of External Interrupts	On Chip Data RAM Width	Supply Voltage-Max	Supply Voltage-Min	Temperature Grade	JESD-30 Code	Operating Temperature-Max	Operating Temperature-Min	Screening Level	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Width	Length	Ihs Manufacturer	Reach Compliance Code	ECCN Code	HTS Code	Date Of Intro	Samacsys Manufacturer	Package Description

$5.0364

Active

32

600 MHz

69632

32

26

48 MHz

YES

1.15 V

MICROPROCESSOR, RISC

CMOS

YES

FIXED POINT

YES

YES

16

1

8

1.21 V

1.12 V

INDUSTRIAL

S-PBGA-B228

105 °C

-40 °C

228

PLASTIC/EPOXY

TFBGA

BGA228,16X16,26

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

BALL

650 µm

BOTTOM

1.2 mm

11 mm

11 mm

MICROCHIP TECHNOLOGY INC

compliant

5A992.C

8542.31.00.01

2019-09-24

Microchip

Check for Price

Active

32

600 MHz

69632

32

26

48 MHz

YES

1.15 V

MICROPROCESSOR, RISC

CMOS

YES

FIXED POINT

YES

YES

16

1

8

1.21 V

1.12 V

INDUSTRIAL

S-PBGA-B228

105 °C

-40 °C

AEC-Q100

228

PLASTIC/EPOXY

TFBGA

BGA228,16X16,26

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

BALL

650 µm

BOTTOM

1.2 mm

11 mm

11 mm

MICROCHIP TECHNOLOGY INC

compliant

Check for Price

Active

32

600 MHz

69632

32

26

48 MHz

YES

1.15 V

MICROPROCESSOR, RISC

CMOS

YES

FIXED POINT

YES

YES

16

1

8

1.21 V

1.12 V

INDUSTRIAL

S-PBGA-B228

105 °C

-40 °C

228

PLASTIC/EPOXY

TFBGA

BGA228,16X16,26

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

BALL

650 µm

BOTTOM

1.2 mm

11 mm

11 mm

MICROCHIP TECHNOLOGY INC

compliant

5A992.C

8542.31.00.01

TFBGA,

Compare

Microchip Technology Inc

Active

32

600 MHz

69632

32

26

48 MHz

YES

1.15 V

MICROPROCESSOR, RISC

CMOS

YES

FIXED POINT

YES

YES

16

1

8

1.21 V

1.12 V

INDUSTRIAL

S-PBGA-B228

105 °C

-40 °C

228

PLASTIC/EPOXY

TFBGA

BGA228,16X16,26

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

BALL

650 µm

BOTTOM

1.2 mm

11 mm

11 mm

MICROCHIP TECHNOLOGY INC

compliant

5A992.C

8542.31.00.01

2019-09-24

Microchip

SAM9X60-V/DWBVAO

Microchip Technology Inc

Check for Price

Active

32

600 MHz

69632

32

26

48 MHz

YES

1.15 V

MICROPROCESSOR, RISC

CMOS

YES

FIXED POINT

YES

YES

16

1

8

1.21 V

1.12 V

INDUSTRIAL

S-PBGA-B228

105 °C

-40 °C

AEC-Q100

228

PLASTIC/EPOXY

TFBGA

BGA228,16X16,26

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

BALL

650 µm

BOTTOM

1.2 mm

11 mm

11 mm

MICROCHIP TECHNOLOGY INC

compliant

Microchip Technology Inc

Check for Price

Active

32

600 MHz

69632

32

26

48 MHz

YES

1.15 V

MICROPROCESSOR, RISC

CMOS

YES

FIXED POINT

YES

YES

16

1

8

1.21 V

1.12 V

INDUSTRIAL

S-PBGA-B228

105 °C

-40 °C

228

PLASTIC/EPOXY

TFBGA

BGA228,16X16,26

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

BALL

650 µm

BOTTOM

1.2 mm

11 mm

11 mm

MICROCHIP TECHNOLOGY INC

compliant

5A992.C

8542.31.00.01

TFBGA,