Parametric results for: MPC885VR66 under Microprocessors

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Manufacturer Part Number: mpc885vr66
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MPC885VR66
Rochester Electronics LLC
Check for Price Yes Yes Active 32 66 MHz 32 32 YES 1.8 V MICROPROCESSOR, RISC YES FIXED POINT YES YES 1.9 V 1.7 V S-PBGA-B357 COMMERCIAL e1 3 260 40 357 PLASTIC/EPOXY BGA SQUARE GRID ARRAY TIN SILVER COPPER BALL 1.27 mm BOTTOM 2.52 mm 25 mm 25 mm ROCHESTER ELECTRONICS LLC BGA LEAD FREE, PLASTIC, BGA-357 357 unknown
MPC885VR66
Freescale Semiconductor
Check for Price Yes Yes Transferred 32 66 MHz 32 32 YES 1.8 V MICROPROCESSOR, RISC CMOS YES FIXED POINT YES YES 1.9 V 1.7 V S-PBGA-B357 Not Qualified e1 3 260 40 357 PLASTIC/EPOXY BGA BGA357,19X19,50 SQUARE GRID ARRAY TIN SILVER COPPER BALL 1.27 mm BOTTOM 2.52 mm 25 mm 25 mm FREESCALE SEMICONDUCTOR INC BGA LEAD FREE, PLASTIC, BGA-357 357 compliant 5A002 8542.31.00.01
KMPC885VR66
Freescale Semiconductor
Check for Price Yes Obsolete 32 66 MHz 32 32 YES 1.8 V MICROPROCESSOR, RISC CMOS YES FIXED POINT YES YES 1.9 V 1.7 V S-PBGA-B357 Not Qualified e1 3 260 40 357 PLASTIC/EPOXY BGA BGA357,19X19,50 SQUARE GRID ARRAY TIN SILVER COPPER BALL 1.27 mm BOTTOM 2.52 mm 25 mm 25 mm FREESCALE SEMICONDUCTOR INC BGA LEAD FREE, PLASTIC, BGA-357 357 compliant 5A002 8542.31.00.01
MPC885VR66
NXP Semiconductors
Check for Price Yes Obsolete 32 66 MHz 32 32 YES 1.8 V MICROPROCESSOR, RISC CMOS YES FIXED POINT YES YES 1.9 V 1.7 V S-PBGA-B357 Not Qualified e1 3 260 40 357 PLASTIC/EPOXY BGA BGA357,19X19,50 SQUARE GRID ARRAY Tin/Silver/Copper (Sn/Ag/Cu) BALL 1.27 mm BOTTOM 2.52 mm 25 mm 25 mm NXP SEMICONDUCTORS LEAD FREE, PLASTIC, BGA-357 compliant 5A002.A.1 8542.31.00.01 NXP