Findchips: Parametric Search Results for MPC8358EVRAGDGA


Select Parts		Part Number

		MPC8358EVRAGDGA NXP Semiconductors
		MPC8358EVRAGDGA Freescale Semiconductor

				Most Relevant							Technical								Compliance			Operating Conditions				Physical									Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Bit Size	Speed	External Data Bus Width	Address Bus Width	Clock Frequency-Max	Surface Mount	Supply Voltage-Nom	uPs/uCs/Peripheral ICs Type	Technology	Boundary Scan	Format	Integrated Cache	Low Power Mode	Supply Voltage-Max	Supply Voltage-Min	JESD-30 Code	Qualification Status	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Shape	Package Style	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Width	Length	Ihs Manufacturer	Package Description	Reach Compliance Code	ECCN Code	HTS Code	Samacsys Manufacturer	Part Package Code	Pin Count

$103.6225

Yes

Not Recommended

400 MHz

66.67 MHz

YES

1.2 V

MICROPROCESSOR, RISC

CMOS

YES

FLOATING POINT

YES

1.26 V

1.14 V

S-PBGA-B668

Not Qualified

105 °C

260

668

PLASTIC/EPOXY

HBGA

SQUARE

GRID ARRAY, HEAT SINK/SLUG

Tin/Silver (Sn/Ag)

BALL

1 mm

BOTTOM

2.46 mm

29 mm

NXP SEMICONDUCTORS

29 X 29 MM, 1.46 MM HEIGHT, 1 MM PITCH, LEAD FREE, PLASTIC, BGA-668

compliant

5A002.A.1

8542.31.00.01

NXP

Check for Price

Yes

Transferred

400 MHz

66.67 MHz

YES

1.2 V

MICROPROCESSOR, RISC

CMOS

YES

FLOATING POINT

YES

1.26 V

1.14 V

S-PBGA-B668

Not Qualified

260

668

PLASTIC/EPOXY

HBGA

SQUARE

GRID ARRAY, HEAT SINK/SLUG

TIN SILVER

BALL

1 mm

BOTTOM

2.46 mm

29 mm

FREESCALE SEMICONDUCTOR INC

29 X 29 MM, 1.46 MM HEIGHT, 1 MM PITCH, LEAD FREE, PLASTIC, BGA-668

compliant

5A002

8542.31.00.01

BGA

668

Compare

MPC8358EVRAGDGA

NXP Semiconductors

$103.6225

Yes

Not Recommended

400 MHz

66.67 MHz

YES

1.2 V

MICROPROCESSOR, RISC

CMOS

YES

FLOATING POINT

YES

1.26 V

1.14 V

S-PBGA-B668

Not Qualified

105 °C

260

668

PLASTIC/EPOXY

HBGA

SQUARE

GRID ARRAY, HEAT SINK/SLUG

Tin/Silver (Sn/Ag)

BALL

1 mm

BOTTOM

2.46 mm

29 mm

NXP SEMICONDUCTORS

29 X 29 MM, 1.46 MM HEIGHT, 1 MM PITCH, LEAD FREE, PLASTIC, BGA-668

compliant

5A002.A.1

8542.31.00.01

NXP

MPC8358EVRAGDGA

Freescale Semiconductor

Check for Price

Yes

Transferred

400 MHz

66.67 MHz

YES

1.2 V

MICROPROCESSOR, RISC

CMOS

YES

FLOATING POINT

YES

1.26 V

1.14 V

S-PBGA-B668

Not Qualified

260

668

PLASTIC/EPOXY

HBGA

SQUARE

GRID ARRAY, HEAT SINK/SLUG

TIN SILVER

BALL

1 mm

BOTTOM

2.46 mm

29 mm

FREESCALE SEMICONDUCTOR INC

29 X 29 MM, 1.46 MM HEIGHT, 1 MM PITCH, LEAD FREE, PLASTIC, BGA-668

compliant

5A002

8542.31.00.01

BGA

668

Parametric results for: MPC8358EVRAGDGA under Microprocessors