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Parametric results for: MPC8313CVRAGDC under Microprocessors

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Manufacturer Part Number: mpc8313cvragdc

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Select Parts		Part Number

		MPC8313CVRAGDC NXP Semiconductors
		MPC8313CVRAGDC Freescale Semiconductor

				Most Relevant					Technical									Compliance		Operating Conditions					Physical									Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Speed	External Data Bus Width	Address Bus Width	Surface Mount	Supply Voltage-Nom	uPs/uCs/Peripheral ICs Type	Technology	Boundary Scan	Format	Integrated Cache	Low Power Mode	Supply Voltage-Max	Supply Voltage-Min	Temperature Grade	JESD-30 Code	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Shape	Package Style	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Width	Length	Ihs Manufacturer	Package Description	Reach Compliance Code	ECCN Code	HTS Code	Samacsys Manufacturer

$48.1574

Yes

Not Recommended

400 MHz

32

15

YES

1 V

MICROPROCESSOR, RISC

CMOS

YES

FLOATING POINT

YES

YES

1.05 V

950 mV

INDUSTRIAL

S-PBGA-B516

e2

3

105 °C

-40 °C

260

40

516

PLASTIC/EPOXY

HBGA

SQUARE

GRID ARRAY, HEAT SINK/SLUG

Tin/Silver (Sn/Ag)

BALL

1 mm

BOTTOM

2.55 mm

27 mm

27 mm

NXP SEMICONDUCTORS

TEBGAII-516

compliant

3A991.A.2

8542.31.00.01

NXP

Check for Price

Yes

Yes

Transferred

400 MHz

32

15

YES

1 V

MICROPROCESSOR, RISC

CMOS

YES

FLOATING POINT

YES

YES

1.05 V

950 mV

INDUSTRIAL

S-PBGA-B516

e2

3

105 °C

-40 °C

260

40

516

PLASTIC/EPOXY

HBGA

SQUARE

GRID ARRAY, HEAT SINK/SLUG

Tin/Silver (Sn/Ag)

BALL

1 mm

BOTTOM

2.55 mm

27 mm

27 mm

FREESCALE SEMICONDUCTOR INC

TEBGAII-516

compliant

3A991.A.2

8542.31.00.01

Compare

NXP Semiconductors

Yes

Not Recommended

400 MHz

32

15

YES

1 V

MICROPROCESSOR, RISC

CMOS

YES

FLOATING POINT

YES

YES

1.05 V

950 mV

INDUSTRIAL

S-PBGA-B516

e2

3

105 °C

-40 °C

260

40

516

PLASTIC/EPOXY

HBGA

SQUARE

GRID ARRAY, HEAT SINK/SLUG

Tin/Silver (Sn/Ag)

BALL

1 mm

BOTTOM

2.55 mm

27 mm

27 mm

NXP SEMICONDUCTORS

TEBGAII-516

compliant

3A991.A.2

8542.31.00.01

NXP

Microcontrollers and Processors

Freescale Semiconductor

Check for Price

Yes

Yes

Transferred

400 MHz

32

15

YES

1 V

MICROPROCESSOR, RISC

CMOS

YES

FLOATING POINT

YES

YES

1.05 V

950 mV

INDUSTRIAL

S-PBGA-B516

e2

3

105 °C

-40 °C

260

40

516

PLASTIC/EPOXY

HBGA

SQUARE

GRID ARRAY, HEAT SINK/SLUG

Tin/Silver (Sn/Ag)

BALL

1 mm

BOTTOM

2.55 mm

27 mm

27 mm

FREESCALE SEMICONDUCTOR INC

TEBGAII-516

compliant

3A991.A.2

8542.31.00.01