Findchips: Parametric Search Results for MC7448HX1267ND


Select Parts		Part Number

		MC7448HX1267ND NXP Semiconductors
		MC7448HX1267ND Freescale Semiconductor

				Most Relevant					Technical									Compliance			Operating Conditions				Physical										Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Bit Size	Speed	Clock Frequency-Max	Surface Mount	Supply Voltage-Nom	uPs/uCs/Peripheral ICs Type	Technology	Boundary Scan	Format	Integrated Cache	Low Power Mode	Supply Voltage-Max	Supply Voltage-Min	Temperature Grade	JESD-30 Code	Qualification Status	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Width	Length	Ihs Manufacturer	Package Description	Reach Compliance Code	ECCN Code	HTS Code	Samacsys Manufacturer	Part Package Code	Pin Count

$432.9790

Obsolete

1.267 GHz

YES

1.05 V

MICROPROCESSOR, RISC

CMOS

FIXED POINT

YES

1.1 V

1 V

OTHER

S-CBGA-B360

Not Qualified

105 °C

260

360

CERAMIC, METAL-SEALED COFIRED

BGA

BGA360,19X19,50

SQUARE

GRID ARRAY

Tin/Lead (Sn/Pb)

BALL

1.27 mm

BOTTOM

2.8 mm

25 mm

NXP SEMICONDUCTORS

25 X 25 MM, 2.20 MM HEIGHT, 1.27 MM PITCH, HCTE, CERAMIC, BGA-360

unknown

3A991.A.1

8542.31.00.01

NXP

Check for Price

Transferred

1.267 GHz

YES

1.05 V

MICROPROCESSOR, RISC

CMOS

FIXED POINT

YES

1.1 V

1 V

OTHER

S-CBGA-B360

Not Qualified

105 °C

260

360

CERAMIC, METAL-SEALED COFIRED

BGA

BGA360,19X19,50

SQUARE

GRID ARRAY

Tin/Lead (Sn/Pb)

BALL

1.27 mm

BOTTOM

2.8 mm

25 mm

FREESCALE SEMICONDUCTOR INC

25 X 25 MM, 2.20 MM HEIGHT, 1.27 MM PITCH, HCTE, CERAMIC, BGA-360

not_compliant

3A991.A.1

8542.31.00.01

BGA

360

Compare

MC7448HX1267ND

NXP Semiconductors

$432.9790

Obsolete

1.267 GHz

YES

1.05 V

MICROPROCESSOR, RISC

CMOS

FIXED POINT

YES

1.1 V

1 V

OTHER

S-CBGA-B360

Not Qualified

105 °C

260

360

CERAMIC, METAL-SEALED COFIRED

BGA

BGA360,19X19,50

SQUARE

GRID ARRAY

Tin/Lead (Sn/Pb)

BALL

1.27 mm

BOTTOM

2.8 mm

25 mm

NXP SEMICONDUCTORS

25 X 25 MM, 2.20 MM HEIGHT, 1.27 MM PITCH, HCTE, CERAMIC, BGA-360

unknown

3A991.A.1

8542.31.00.01

NXP

MC7448HX1267ND

Freescale Semiconductor

Check for Price

Transferred

1.267 GHz

YES

1.05 V

MICROPROCESSOR, RISC

CMOS

FIXED POINT

YES

1.1 V

1 V

OTHER

S-CBGA-B360

Not Qualified

105 °C

260

360

CERAMIC, METAL-SEALED COFIRED

BGA

BGA360,19X19,50

SQUARE

GRID ARRAY

Tin/Lead (Sn/Pb)

BALL

1.27 mm

BOTTOM

2.8 mm

25 mm

FREESCALE SEMICONDUCTOR INC

25 X 25 MM, 2.20 MM HEIGHT, 1.27 MM PITCH, HCTE, CERAMIC, BGA-360

not_compliant

3A991.A.1

8542.31.00.01

BGA

360

Parametric results for: MC7448HX1267ND under Microprocessors