Findchips: Parametric Search Results for MC7447RX733NB


Select Parts		Part Number

		MC7447RX733NB NXP Semiconductors
		MC7447RX733NB Freescale Semiconductor
		MC7447RX733NB Motorola Semiconductor Products
		MC7447RX733NB Rochester Electronics LLC
		MC7447RX733NB Motorola Mobility LLC

				Most Relevant						Technical								Compliance			Operating Conditions			Physical										Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Bit Size	Speed	External Data Bus Width	Address Bus Width	Surface Mount	Supply Voltage-Nom	uPs/uCs/Peripheral ICs Type	Technology	Boundary Scan	Format	Integrated Cache	Low Power Mode	Supply Voltage-Max	Supply Voltage-Min	JESD-30 Code	Qualification Status	JESD-609 Code	Moisture Sensitivity Level	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Width	Length	Ihs Manufacturer	Reach Compliance Code	HTS Code	Package Description	Part Package Code	Pin Count

Check for Price Buy

Active

MICROPROCESSOR, RISC

NXP SEMICONDUCTORS

unknown

8542.31.00.01

Check for Price Buy

Transferred

733 MHz

YES

MICROPROCESSOR, RISC

CMOS

S-CBGA-B360

Not Qualified

220

360

CERAMIC, METAL-SEALED COFIRED

BGA

BGA360,19X19,50

SQUARE

GRID ARRAY

TIN LEAD

BALL

1.27 mm

BOTTOM

FREESCALE SEMICONDUCTOR INC

not_compliant

8542.31.00.01

Check for Price Buy

Obsolete

733 MHz

YES

1.1 V

MICROPROCESSOR, RISC

CMOS

YES

FLOATING POINT

YES

1.15 V

1.05 V

S-CBGA-B360

Not Qualified

360

CERAMIC, METAL-SEALED COFIRED

BGA

BGA360,19X19,50

SQUARE

GRID ARRAY

BALL

1.27 mm

BOTTOM

3.2 mm

25 mm

MOTOROLA INC

unknown

8542.31.00.01

25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, FLIP CHIP, BGA-360

Check for Price Buy

Active

733 MHz

YES

1.1 V

MICROPROCESSOR, RISC

CMOS

YES

FLOATING POINT

YES

1.15 V

1.05 V

S-CBGA-B360

COMMERCIAL

225

NOT SPECIFIED

360

CERAMIC, METAL-SEALED COFIRED

BGA

SQUARE

GRID ARRAY

NOT SPECIFIED

BALL

1.27 mm

BOTTOM

3.2 mm

25 mm

ROCHESTER ELECTRONICS LLC

unknown

25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, FLIP CHIP, BGA-360

BGA

360

Check for Price Buy

Obsolete

733 MHz

YES

1.1 V

MICROPROCESSOR, RISC

CMOS

YES

FLOATING POINT

YES

1.15 V

1.05 V

S-CBGA-B360

Not Qualified

360

CERAMIC, METAL-SEALED COFIRED

BGA

BGA360,19X19,50

SQUARE

GRID ARRAY

BALL

1.27 mm

BOTTOM

3.2 mm

25 mm

MOTOROLA INC

unknown

8542.31.00.01

BGA, BGA360,19X19,50

BGA

360

Compare

MC7447RX733NB

NXP Semiconductors

Check for Price Buy

Active

MICROPROCESSOR, RISC

NXP SEMICONDUCTORS

unknown

8542.31.00.01

MC7447RX733NB

Freescale Semiconductor

Check for Price Buy

Transferred

733 MHz

YES

MICROPROCESSOR, RISC

CMOS

S-CBGA-B360

Not Qualified

220

360

CERAMIC, METAL-SEALED COFIRED

BGA

BGA360,19X19,50

SQUARE

GRID ARRAY

TIN LEAD

BALL

1.27 mm

BOTTOM

FREESCALE SEMICONDUCTOR INC

not_compliant

8542.31.00.01

MC7447RX733NB

Motorola Semiconductor Products

Check for Price Buy

Obsolete

733 MHz

YES

1.1 V

MICROPROCESSOR, RISC

CMOS

YES

FLOATING POINT

YES

1.15 V

1.05 V

S-CBGA-B360

Not Qualified

360

CERAMIC, METAL-SEALED COFIRED

BGA

BGA360,19X19,50

SQUARE

GRID ARRAY

BALL

1.27 mm

BOTTOM

3.2 mm

25 mm

MOTOROLA INC

unknown

8542.31.00.01

25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, FLIP CHIP, BGA-360

MC7447RX733NB

Rochester Electronics LLC

Check for Price Buy

Active

733 MHz

YES

1.1 V

MICROPROCESSOR, RISC

CMOS

YES

FLOATING POINT

YES

1.15 V

1.05 V

S-CBGA-B360

COMMERCIAL

225

NOT SPECIFIED

360

CERAMIC, METAL-SEALED COFIRED

BGA

SQUARE

GRID ARRAY

NOT SPECIFIED

BALL

1.27 mm

BOTTOM

3.2 mm

25 mm

ROCHESTER ELECTRONICS LLC

unknown

25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, FLIP CHIP, BGA-360

BGA

360

MC7447RX733NB

Motorola Mobility LLC

Check for Price Buy

Obsolete

733 MHz

YES

1.1 V

MICROPROCESSOR, RISC

CMOS

YES

FLOATING POINT

YES

1.15 V

1.05 V

S-CBGA-B360

Not Qualified

360

CERAMIC, METAL-SEALED COFIRED

BGA

BGA360,19X19,50

SQUARE

GRID ARRAY

BALL

1.27 mm

BOTTOM

3.2 mm

25 mm

MOTOROLA INC

unknown

8542.31.00.01

BGA, BGA360,19X19,50

BGA

360

Parametric results for: MC7447RX733NB under Microprocessors