Findchips: Parametric Search Results for MAX14745KEWX+


Select Parts		Part Number

		MAX14745KEWX+T Maxim Integrated Products
		MAX14745KEWX Maxim Integrated Products
		MAX14745KEWX+T Analog Devices Inc
		MAX14745KEWX+ Analog Devices Inc
		MAX14745KEWX+ Maxim Integrated Products

			Most Relevant					Technical				Compliance		Operating Conditions					Physical											Dimensions			Other
Composite Price	Rohs Code	Part Life Cycle Code	Supply Voltage-Nom (Vsup)	Supply Voltage-Max (Vsup)	Number of Channels	Surface Mount	Adjustable Threshold	Analog IC - Other Type	Number of Functions	Technology	Temperature Grade	JESD-30 Code	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Width	Length	Seated Height-Max	Ihs Manufacturer	Package Description	Reach Compliance Code	Date Of Intro	ECCN Code	HTS Code	Part Package Code	Pin Count	Manufacturer Package Code	Samacsys Manufacturer

Check for Price

Yes

Transferred

5 V

28 V

YES

INTEGRATED POWER MANAGEMENT UNIT

BICMOS

INDUSTRIAL

R-PBGA-B36

85 °C

-40 °C

260

PLASTIC/EPOXY

VFBGA

BGA36,6X6,16

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER NICKEL

BALL

400 µm

BOTTOM

2.437 mm

2.688 mm

690 µm

MAXIM INTEGRATED PRODUCTS INC

VFBGA, BGA36,6X6,16

compliant

2018-03-20

Check for Price

Yes

Transferred

5 V

28 V

YES

POWER SUPPLY SUPPORT CIRCUIT

BICMOS

INDUSTRIAL

R-PBGA-B36

85 °C

-40 °C

NOT SPECIFIED

PLASTIC/EPOXY

VFBGA

BGA36,6X6,16

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

BALL

400 µm

BOTTOM

2.437 mm

2.688 mm

690 µm

MAXIM INTEGRATED PRODUCTS INC

VFBGA, BGA36,6X6,16

unknown

EAR99

8542.39.00.01

Check for Price

Yes

Obsolete

5 V

28 V

YES

BATTERY MONITOR/RESET IC

BICMOS

INDUSTRIAL

R-PBGA-B36

85 °C

-40 °C

260

PLASTIC/EPOXY

VFBGA

BGA36,6X6,16

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni)

BALL

400 µm

BOTTOM

2.437 mm

2.688 mm

690 µm

ANALOG DEVICES INC

2016-10-13

36-WLCSP-N/A

Analog Devices

Check for Price

Yes

Obsolete

5 V

28 V

YES

BATTERY MONITOR/RESET IC

BICMOS

INDUSTRIAL

R-PBGA-B36

85 °C

-40 °C

260

PLASTIC/EPOXY

VFBGA

BGA36,6X6,16

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni)

BALL

400 µm

BOTTOM

2.437 mm

2.688 mm

690 µm

ANALOG DEVICES INC

2016-10-13

36-WLCSP-N/A

Analog Devices

Check for Price

Yes

Transferred

5 V

28 V

YES

INTEGRATED POWER MANAGEMENT UNIT

BICMOS

INDUSTRIAL

R-PBGA-B36

85 °C

-40 °C

260

PLASTIC/EPOXY

VFBGA

BGA36,6X6,16

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER NICKEL

BALL

400 µm

BOTTOM

2.437 mm

2.688 mm

690 µm

MAXIM INTEGRATED PRODUCTS INC

VFBGA, BGA36,6X6,16

compliant

2018-03-20

EAR99

8542.39.00.01

Compare

MAX14745KEWX+T

Maxim Integrated Products

Check for Price

Yes

Transferred

5 V

28 V

YES

INTEGRATED POWER MANAGEMENT UNIT

BICMOS

INDUSTRIAL

R-PBGA-B36

85 °C

-40 °C

260

PLASTIC/EPOXY

VFBGA

BGA36,6X6,16

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER NICKEL

BALL

400 µm

BOTTOM

2.437 mm

2.688 mm

690 µm

MAXIM INTEGRATED PRODUCTS INC

VFBGA, BGA36,6X6,16

compliant

2018-03-20

MAX14745KEWX

Maxim Integrated Products

Check for Price

Yes

Transferred

5 V

28 V

YES

POWER SUPPLY SUPPORT CIRCUIT

BICMOS

INDUSTRIAL

R-PBGA-B36

85 °C

-40 °C

NOT SPECIFIED

PLASTIC/EPOXY

VFBGA

BGA36,6X6,16

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

BALL

400 µm

BOTTOM

2.437 mm

2.688 mm

690 µm

MAXIM INTEGRATED PRODUCTS INC

VFBGA, BGA36,6X6,16

unknown

EAR99

8542.39.00.01

MAX14745KEWX+T

Analog Devices Inc

Check for Price

Yes

Obsolete

5 V

28 V

YES

BATTERY MONITOR/RESET IC

BICMOS

INDUSTRIAL

R-PBGA-B36

85 °C

-40 °C

260

PLASTIC/EPOXY

VFBGA

BGA36,6X6,16

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni)

BALL

400 µm

BOTTOM

2.437 mm

2.688 mm

690 µm

ANALOG DEVICES INC

2016-10-13

36-WLCSP-N/A

Analog Devices

MAX14745KEWX+

Analog Devices Inc

Check for Price

Yes

Obsolete

5 V

28 V

YES

BATTERY MONITOR/RESET IC

BICMOS

INDUSTRIAL

R-PBGA-B36

85 °C

-40 °C

260

PLASTIC/EPOXY

VFBGA

BGA36,6X6,16

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni)

BALL

400 µm

BOTTOM

2.437 mm

2.688 mm

690 µm

ANALOG DEVICES INC

2016-10-13

36-WLCSP-N/A

Analog Devices

MAX14745KEWX+

Maxim Integrated Products

Check for Price

Yes

Transferred

5 V

28 V

YES

INTEGRATED POWER MANAGEMENT UNIT

BICMOS

INDUSTRIAL

R-PBGA-B36

85 °C

-40 °C

260

PLASTIC/EPOXY

VFBGA

BGA36,6X6,16

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER NICKEL

BALL

400 µm

BOTTOM

2.437 mm

2.688 mm

690 µm

MAXIM INTEGRATED PRODUCTS INC

VFBGA, BGA36,6X6,16

compliant

2018-03-20

EAR99

8542.39.00.01

Parametric results for: MAX14745KEWX+ under Power Management Circuits