Findchips: Parametric Search Results for LTC2217CUP


Select Parts		Part Number

		LTC2217CUP#PBF Analog Devices Inc
		LTC2217CUP#TRPBF Linear Technology
		LTC2217CUP#TRPBF Analog Devices Inc
		LTC2217CUP Analog Devices Inc
		LTC2217CUP#TR Analog Devices Inc
		LTC2217CUP#PBF Linear Technology
		LTC2217CUP#TR Linear Technology
		LTC2217CUP Linear Technology

				Most Relevant							Technical							Compliance			Operating Conditions				Physical										Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Supply Voltage-Nom	Analog Input Voltage-Max	Number of Analog In Channels	Linearity Error-Max (EL)	Number of Bits	Sample Rate	Surface Mount	Converter Type	Number of Functions	Output Bit Code	Sample and Hold / Track and Hold	Technology	Temperature Grade	Output Format	JESD-30 Code	Qualification Status	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Width	Seated Height-Max	Length	Ihs Manufacturer	Package Description	Pin Count	Manufacturer Package Code	Reach Compliance Code	ECCN Code	HTS Code	Samacsys Manufacturer	Part Package Code

$98.2013

Yes

Active

3.3 V

2.75 V

0.0053 %

105 MHz

YES

ADC, PROPRIETARY METHOD

OFFSET BINARY, 2'S COMPLEMENT BINARY

SAMPLE

COMMERCIAL

PARALLEL, WORD

S-PQCC-N64

Not Qualified

70 °C

260

PLASTIC/EPOXY

HVQCCN

LCC64,.35SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Matte Tin (Sn)

NO LEAD

500 µm

QUAD

9 mm

800 µm

9 mm

ANALOG DEVICES INC

9 X 9 MM, LEAD FREE, PLASTIC, MO-220WNJR, QFN-64

05-08-1705

compliant

3A001.A.5.A.5

8542.39.00.01

Analog Devices

Check for Price

Yes

Transferred

3.3 V

2.75 V

0.0053 %

105 MHz

YES

ADC, PROPRIETARY METHOD

OFFSET BINARY, 2'S COMPLEMENT BINARY

SAMPLE

CMOS

COMMERCIAL

PARALLEL, WORD

S-PQCC-N64

Not Qualified

70 °C

260

PLASTIC/EPOXY

HVQCCN

LCC64,.35SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Matte Tin (Sn)

NO LEAD

500 µm

QUAD

9 mm

800 µm

9 mm

LINEAR TECHNOLOGY CORP

9 X 9 MM, LEAD FREE, PLASTIC, MO-220WNJR, QFN-64

compliant

3A991.C.4

8542.39.00.01

QFN

Check for Price

Yes

Active

3.3 V

2.75 V

0.0053 %

105 MHz

YES

ADC, PROPRIETARY METHOD

OFFSET BINARY, 2'S COMPLEMENT BINARY

SAMPLE

COMMERCIAL

PARALLEL, WORD

S-PQCC-N64

Not Qualified

70 °C

260

PLASTIC/EPOXY

HVQCCN

LCC64,.35SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Matte Tin (Sn)

NO LEAD

500 µm

QUAD

9 mm

800 µm

9 mm

ANALOG DEVICES INC

9 X 9 MM, LEAD FREE, PLASTIC, MO-220WNJR, QFN-64

05-08-1705

compliant

3A001.A.5.A.5

8542.39.00.01

Check for Price

Obsolete

3.3 V

2.75 V

0.0053 %

105 MHz

YES

ADC, PROPRIETARY METHOD

OFFSET BINARY, 2'S COMPLEMENT BINARY

SAMPLE

COMMERCIAL

PARALLEL, WORD

S-PQCC-N64

Not Qualified

70 °C

PLASTIC/EPOXY

HVQCCN

LCC64,.35SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Tin/Lead (Sn/Pb)

NO LEAD

500 µm

QUAD

9 mm

800 µm

9 mm

ANALOG DEVICES INC

9 X 9 MM, PLASTIC, MO-220WNJR, QFN-64

not_compliant

3A991.C.4

8542.39.00.01

Check for Price

Obsolete

3.3 V

2.75 V

0.0053 %

105 MHz

YES

ADC, PROPRIETARY METHOD

OFFSET BINARY, 2'S COMPLEMENT BINARY

SAMPLE

COMMERCIAL

PARALLEL, WORD

S-PQCC-N64

Not Qualified

70 °C

PLASTIC/EPOXY

HVQCCN

LCC64,.35SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

TIN LEAD

NO LEAD

500 µm

QUAD

9 mm

800 µm

9 mm

ANALOG DEVICES INC

9 X 9 MM, PLASTIC, MO-220WNJR, QFN-64

not_compliant

3A991.C.4

8542.39.00.01

Check for Price

Yes

Transferred

3.3 V

2.75 V

0.0053 %

105 MHz

YES

ADC, PROPRIETARY METHOD

OFFSET BINARY, 2'S COMPLEMENT BINARY

SAMPLE

CMOS

COMMERCIAL

PARALLEL, WORD

S-PQCC-N64

Not Qualified

70 °C

260

PLASTIC/EPOXY

HVQCCN

LCC64,.35SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Matte Tin (Sn)

NO LEAD

500 µm

QUAD

9 mm

800 µm

9 mm

LINEAR TECHNOLOGY CORP

9 X 9 MM, LEAD FREE, PLASTIC, MO-220WNJR, QFN-64

compliant

3A991.C.4

8542.39.00.01

QFN

Check for Price

Transferred

3.3 V

2.75 V

0.0053 %

105 MHz

YES

ADC, PROPRIETARY METHOD

OFFSET BINARY, 2'S COMPLEMENT BINARY

SAMPLE

CMOS

COMMERCIAL

PARALLEL, WORD

S-PQCC-N64

Not Qualified

70 °C

PLASTIC/EPOXY

HVQCCN

LCC64,.35SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

TIN LEAD

NO LEAD

500 µm

QUAD

9 mm

800 µm

9 mm

LINEAR TECHNOLOGY CORP

HVQCCN, LCC64,.35SQ,20

not_compliant

3A991.C.4

8542.39.00.01

QFN

Check for Price

Transferred

3.3 V

2.75 V

0.0053 %

105 MHz

YES

ADC, PROPRIETARY METHOD

OFFSET BINARY, 2'S COMPLEMENT BINARY

SAMPLE

CMOS

COMMERCIAL

PARALLEL, WORD

S-PQCC-N64

Not Qualified

70 °C

PLASTIC/EPOXY

HVQCCN

LCC64,.35SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

TIN LEAD

NO LEAD

500 µm

QUAD

9 mm

800 µm

9 mm

LINEAR TECHNOLOGY CORP

HVQCCN, LCC64,.35SQ,20

not_compliant

3A991.C.4

8542.39.00.01

QFN

Compare

LTC2217CUP#PBF

Analog Devices Inc

$98.2013

Yes

Active

3.3 V

2.75 V

0.0053 %

105 MHz

YES

ADC, PROPRIETARY METHOD

OFFSET BINARY, 2'S COMPLEMENT BINARY

SAMPLE

COMMERCIAL

PARALLEL, WORD

S-PQCC-N64

Not Qualified

70 °C

260

PLASTIC/EPOXY

HVQCCN

LCC64,.35SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Matte Tin (Sn)

NO LEAD

500 µm

QUAD

9 mm

800 µm

9 mm

ANALOG DEVICES INC

9 X 9 MM, LEAD FREE, PLASTIC, MO-220WNJR, QFN-64

05-08-1705

compliant

3A001.A.5.A.5

8542.39.00.01

Analog Devices

LTC2217CUP#TRPBF

Linear Technology

Check for Price

Yes

Transferred

3.3 V

2.75 V

0.0053 %

105 MHz

YES

ADC, PROPRIETARY METHOD

OFFSET BINARY, 2'S COMPLEMENT BINARY

SAMPLE

CMOS

COMMERCIAL

PARALLEL, WORD

S-PQCC-N64

Not Qualified

70 °C

260

PLASTIC/EPOXY

HVQCCN

LCC64,.35SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Matte Tin (Sn)

NO LEAD

500 µm

QUAD

9 mm

800 µm

9 mm

LINEAR TECHNOLOGY CORP

9 X 9 MM, LEAD FREE, PLASTIC, MO-220WNJR, QFN-64

compliant

3A991.C.4

8542.39.00.01

QFN

LTC2217CUP#TRPBF

Analog Devices Inc

Check for Price

Yes

Active

3.3 V

2.75 V

0.0053 %

105 MHz

YES

ADC, PROPRIETARY METHOD

OFFSET BINARY, 2'S COMPLEMENT BINARY

SAMPLE

COMMERCIAL

PARALLEL, WORD

S-PQCC-N64

Not Qualified

70 °C

260

PLASTIC/EPOXY

HVQCCN

LCC64,.35SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Matte Tin (Sn)

NO LEAD

500 µm

QUAD

9 mm

800 µm

9 mm

ANALOG DEVICES INC

9 X 9 MM, LEAD FREE, PLASTIC, MO-220WNJR, QFN-64

05-08-1705

compliant

3A001.A.5.A.5

8542.39.00.01

LTC2217CUP

Analog Devices Inc

Check for Price

Obsolete

3.3 V

2.75 V

0.0053 %

105 MHz

YES

ADC, PROPRIETARY METHOD

OFFSET BINARY, 2'S COMPLEMENT BINARY

SAMPLE

COMMERCIAL

PARALLEL, WORD

S-PQCC-N64

Not Qualified

70 °C

PLASTIC/EPOXY

HVQCCN

LCC64,.35SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Tin/Lead (Sn/Pb)

NO LEAD

500 µm

QUAD

9 mm

800 µm

9 mm

ANALOG DEVICES INC

9 X 9 MM, PLASTIC, MO-220WNJR, QFN-64

not_compliant

3A991.C.4

8542.39.00.01

LTC2217CUP#TR

Analog Devices Inc

Check for Price

Obsolete

3.3 V

2.75 V

0.0053 %

105 MHz

YES

ADC, PROPRIETARY METHOD

OFFSET BINARY, 2'S COMPLEMENT BINARY

SAMPLE

COMMERCIAL

PARALLEL, WORD

S-PQCC-N64

Not Qualified

70 °C

PLASTIC/EPOXY

HVQCCN

LCC64,.35SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

TIN LEAD

NO LEAD

500 µm

QUAD

9 mm

800 µm

9 mm

ANALOG DEVICES INC

9 X 9 MM, PLASTIC, MO-220WNJR, QFN-64

not_compliant

3A991.C.4

8542.39.00.01

LTC2217CUP#PBF

Linear Technology

Check for Price

Yes

Transferred

3.3 V

2.75 V

0.0053 %

105 MHz

YES

ADC, PROPRIETARY METHOD

OFFSET BINARY, 2'S COMPLEMENT BINARY

SAMPLE

CMOS

COMMERCIAL

PARALLEL, WORD

S-PQCC-N64

Not Qualified

70 °C

260

PLASTIC/EPOXY

HVQCCN

LCC64,.35SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Matte Tin (Sn)

NO LEAD

500 µm

QUAD

9 mm

800 µm

9 mm

LINEAR TECHNOLOGY CORP

9 X 9 MM, LEAD FREE, PLASTIC, MO-220WNJR, QFN-64

compliant

3A991.C.4

8542.39.00.01

QFN

LTC2217CUP#TR

Linear Technology

Check for Price

Transferred

3.3 V

2.75 V

0.0053 %

105 MHz

YES

ADC, PROPRIETARY METHOD

OFFSET BINARY, 2'S COMPLEMENT BINARY

SAMPLE

CMOS

COMMERCIAL

PARALLEL, WORD

S-PQCC-N64

Not Qualified

70 °C

PLASTIC/EPOXY

HVQCCN

LCC64,.35SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

TIN LEAD

NO LEAD

500 µm

QUAD

9 mm

800 µm

9 mm

LINEAR TECHNOLOGY CORP

HVQCCN, LCC64,.35SQ,20

not_compliant

3A991.C.4

8542.39.00.01

QFN

LTC2217CUP

Linear Technology

Check for Price

Transferred

3.3 V

2.75 V

0.0053 %

105 MHz

YES

ADC, PROPRIETARY METHOD

OFFSET BINARY, 2'S COMPLEMENT BINARY

SAMPLE

CMOS

COMMERCIAL

PARALLEL, WORD

S-PQCC-N64

Not Qualified

70 °C

PLASTIC/EPOXY

HVQCCN

LCC64,.35SQ,20

SQUARE

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

TIN LEAD

NO LEAD

500 µm

QUAD

9 mm

800 µm

9 mm

LINEAR TECHNOLOGY CORP

HVQCCN, LCC64,.35SQ,20

not_compliant

3A991.C.4

8542.39.00.01

QFN

Parametric results for: LTC2217CUP under Analog to Digital Converters