Filter Your Search
1 - 10 of 14 results
|
|
JANTX1N6642US/TR
Microchip Technology Inc
|
$7.6673 | Yes | Active | 300 mA | 1.2 V | 5 ns | 500 nA | SILICON | RECTIFIER DIODE | SINGLE | YES | 75 V | 1 | METALLURGICALLY BONDED | GENERAL PURPOSE | 2.5 A | 1 | Qualified | O-XELF-R2 | e0 | MIL-19500/578E | 175 °C | -65 °C | NOT SPECIFIED | NOT SPECIFIED | ISOLATED | 2 | UNSPECIFIED | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | unknown | EAR99 | 8541.10.00.80 | ||||||||
|
|
JANTX1N6642US
Bkc Semiconductors Inc
|
Check for Price | Transferred | 300 mA | 5 ns | 750 mW | SILICON | RECTIFIER DIODE | SINGLE | YES | 1 | HIGH RELIABILITY | GENERAL PURPOSE | 1 | Not Qualified | O-MELF-R2 | MIL-19500/578 | ISOLATED | 2 | METAL | ROUND | LONG FORM | WRAP AROUND | END | BKC SEMICONDUCTORS INC | unknown | ||||||||||||||||||||
|
|
JANTX1N6642US
Cobham Semiconductor Solutions
|
Check for Price | Transferred | 300 mA | 5 ns | 750 mW | SILICON | RECTIFIER DIODE | SINGLE | YES | 75 V | 1 | HIGH RELIABILITY | 1 | Not Qualified | O-LELF-R2 | e0 | MIL-19500/578 | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | AEROFLEX/METELICS INC | unknown | EAR99 | 8541.10.00.70 | HERMETIC SEALED GLASS PACKAGE-2 | 2 | ||||||||||||||
|
|
JANTX1N6642US
Micross Components
|
Check for Price | Active | 300 mA | 5 ns | SILICON | RECTIFIER DIODE | SINGLE | YES | 75 V | 1 | METALLURGICALLY BONDED | 1 | Qualified | O-XELF-R2 | MIL-19500/578E | ISOLATED | 2 | UNSPECIFIED | ROUND | LONG FORM | WRAP AROUND | END | MICROSS COMPONENTS | unknown | SURFACEMOUNT PACKAGE-2 | ||||||||||||||||||||
|
|
JANTX1N6642US
Microsemi Corporation
|
Check for Price | No | No | Transferred | 300 mA | 1.2 V | 5 ns | 500 nA | SILICON | RECTIFIER DIODE | SINGLE | YES | 75 V | 1 | METALLURGICALLY BONDED | GENERAL PURPOSE | 2.5 A | 1 | Not Qualified | O-XELF-R2 | e0 | MIL-19500/578E | 175 °C | -65 °C | ISOLATED | 2 | UNSPECIFIED | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROSEMI CORP | not_compliant | EAR99 | 8541.10.00.70 | SURFACEMOUNT PACKAGE-2 | 2 | Microsemi Corporation | ||||||
|
|
JANTX1N6642US
Defense Logistics Agency
|
Check for Price | Active | 300 mA | 5 ns | SILICON | RECTIFIER DIODE | SINGLE | YES | 75 V | 1 | METALLURGICALLY BONDED | GENERAL PURPOSE | 1 | Qualified | O-XELF-R2 | MIL-19500/578E | ISOLATED | 2 | UNSPECIFIED | ROUND | LONG FORM | WRAP AROUND | END | DEFENSE LOGISTICS AGENCY | unknown | SURFACEMOUNT PACKAGE-2 | |||||||||||||||||||
|
|
JANTX1N6642US
Compensated Devices Inc
|
Check for Price | Transferred | 300 mA | 5 ns | SILICON | RECTIFIER DIODE | SINGLE | YES | 75 V | 1 | METALLURGICALLY BONDED | GENERAL PURPOSE | 1 | Not Qualified | O-XELF-R2 | MIL-19500/578E | ISOLATED | 2 | UNSPECIFIED | ROUND | LONG FORM | WRAP AROUND | END | COMPENSATED DEVICES INC | unknown | SURFACEMOUNT PACKAGE-2 | |||||||||||||||||||
|
|
JANTX1N6642US
VPT Components
|
Check for Price | No | Active | 100 mA | 1.2 V | 5 ns | 500 nA | SILICON | RECTIFIER DIODE | SINGLE | YES | 75 V | 1 | ULTRA FAST RECOVERY | 100 mA | 1 | 75 V | Qualified | O-LELF-R2 | MIL-19500 | 175 °C | -65 °C | NOT SPECIFIED | NOT SPECIFIED | ISOLATED | 2 | GLASS | ROUND | LONG FORM | WRAP AROUND | END | VPT COMPONENTS | compliant | EAR99 | 8541.10.00.70 | MELF-2 | |||||||||
|
|
JANTX1N6642US
Microchip Technology Inc
|
Check for Price | No | Active | 300 mA | 1.2 V | 5 ns | 500 nA | SILICON | RECTIFIER DIODE | SINGLE | YES | 75 V | 1 | METALLURGICALLY BONDED | GENERAL PURPOSE | 2.5 A | 1 | Qualified | O-XELF-R2 | e0 | MIL-19500/578E | 175 °C | -65 °C | ISOLATED | 2 | UNSPECIFIED | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | compliant | Microchip | |||||||||||
|
|
JANTX1N6642US
Vishay HiRel Systems
|
Check for Price | Contact Manufacturer | 300 mA | 1.2 V | RECTIFIER DIODE | SINGLE | YES | 100 V | 1 | 1 | 200 °C | HI-REL COMPONENTS | unknown |