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Parametric results for: FXL2T245L10X under Other Interface ICs

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Select Parts		Part Number

		FXL2T245L10X onsemi
		FXL2T245L10X_NL Fairchild Semiconductor Corporation
		FXL2T245L10X Fairchild Semiconductor Corporation

				Most Relevant	Technical						Compliance			Operating Conditions					Physical										Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Supply Voltage-Nom	Interface IC Type	Number of Functions	Supply Voltage-Max	Supply Voltage-Min	Surface Mount	Temperature Grade	JESD-30 Code	Qualification Status	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Length	Seated Height-Max	Width	Ihs Manufacturer	Part Package Code	Package Description	Manufacturer Package Code	Reach Compliance Code	HTS Code	Samacsys Manufacturer	Pin Count	ECCN Code

$0.4138

Yes

Yes

Active

1.4 V

INTERFACE CIRCUIT

1

3.6 V

1.1 V

YES

INDUSTRIAL

R-XBCC-B10

Not Qualified

e4

1

85 °C

-40 °C

260

30

10

UNSPECIFIED

VBCC

LCC10,.06X.08,20

RECTANGULAR

CHIP CARRIER, VERY THIN PROFILE

Nickel/Palladium/Gold (Ni/Pd/Au)

BUTT

500 µm

BOTTOM

2.1 mm

550 µm

1.6 mm

ONSEMI

UQFN-10

MICRO PAK, 10

523AZ

compliant

8542.39.00.01

onsemi

Check for Price

Obsolete

1.4 V

INTERFACE CIRCUIT

1

3.6 V

1.1 V

YES

INDUSTRIAL

R-XBCC-B10

Not Qualified

e4

85 °C

-40 °C

10

UNSPECIFIED

VBCC

LCC10,.06X.08,20

RECTANGULAR

CHIP CARRIER, VERY THIN PROFILE

NICKEL GOLD

BUTT

500 µm

BOTTOM

2.1 mm

550 µm

1.6 mm

FAIRCHILD SEMICONDUCTOR CORP

QFN

VBCC,

unknown

8542.39.00.01

10

Check for Price

Yes

Yes

Transferred

1.4 V

INTERFACE CIRCUIT

1

3.6 V

1.1 V

YES

INDUSTRIAL

R-XBCC-B10

Not Qualified

e4

1

85 °C

-40 °C

260

30

10

UNSPECIFIED

VBCC

LCC10,.06X.08,20

RECTANGULAR

CHIP CARRIER, VERY THIN PROFILE

NICKEL GOLD

BUTT

500 µm

BOTTOM

2.1 mm

550 µm

1.6 mm

FAIRCHILD SEMICONDUCTOR CORP

MICROPAK MLP

1.60 X 2.10 MM, MO-255, MICRO PAK, 10

10LD,MICROPAK,JEDEC MO255,1.6 X 2.1MM (PREMOLDED)

unknown

8542.39.00.01

10

EAR99

Compare

onsemi

Yes

Yes

Active

1.4 V

INTERFACE CIRCUIT

1

3.6 V

1.1 V

YES

INDUSTRIAL

R-XBCC-B10

Not Qualified

e4

1

85 °C

-40 °C

260

30

10

UNSPECIFIED

VBCC

LCC10,.06X.08,20

RECTANGULAR

CHIP CARRIER, VERY THIN PROFILE

Nickel/Palladium/Gold (Ni/Pd/Au)

BUTT

500 µm

BOTTOM

2.1 mm

550 µm

1.6 mm

ONSEMI

UQFN-10

MICRO PAK, 10

523AZ

compliant

8542.39.00.01

onsemi

Drivers And Interfaces

FXL2T245L10X_NL

Fairchild Semiconductor Corporation

Check for Price

Obsolete

1.4 V

INTERFACE CIRCUIT

1

3.6 V

1.1 V

YES

INDUSTRIAL

R-XBCC-B10

Not Qualified

e4

85 °C

-40 °C

10

UNSPECIFIED

VBCC

LCC10,.06X.08,20

RECTANGULAR

CHIP CARRIER, VERY THIN PROFILE

NICKEL GOLD

BUTT

500 µm

BOTTOM

2.1 mm

550 µm

1.6 mm

FAIRCHILD SEMICONDUCTOR CORP

QFN

VBCC,

unknown

8542.39.00.01

10

Drivers And Interfaces

Fairchild Semiconductor Corporation

Check for Price

Yes

Yes

Transferred

1.4 V

INTERFACE CIRCUIT

1

3.6 V

1.1 V

YES

INDUSTRIAL

R-XBCC-B10

Not Qualified

e4

1

85 °C

-40 °C

260

30

10

UNSPECIFIED

VBCC

LCC10,.06X.08,20

RECTANGULAR

CHIP CARRIER, VERY THIN PROFILE

NICKEL GOLD

BUTT

500 µm

BOTTOM

2.1 mm

550 µm

1.6 mm

FAIRCHILD SEMICONDUCTOR CORP

MICROPAK MLP

1.60 X 2.10 MM, MO-255, MICRO PAK, 10

10LD,MICROPAK,JEDEC MO255,1.6 X 2.1MM (PREMOLDED)

unknown

8542.39.00.01

10

EAR99