Findchips: Parametric Search Results for 7204L30DB


Select Parts		Part Number

		7204L30DB Renesas Electronics Corporation
		7204L30DB Integrated Device Technology Inc
		IDT7204L30DBG Integrated Device Technology Inc
		7204L30DBG Integrated Device Technology Inc
		IDT7204L30DB Integrated Device Technology Inc

				Most Relevant							Technical															Compliance			Operating Conditions					Physical											Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Memory Density	Memory Width	Organization	Supply Voltage-Nom (Vsup)	Access Time-Max	Clock Frequency-Max (fCLK)	Cycle Time	Memory IC Type	Additional Feature	Number of Functions	Number of Words Code	Number of Words	Operating Mode	Output Characteristics	Output Enable	Parallel/Serial	Standby Current-Max	Supply Current-Max	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Technology	Temperature Grade	JESD-30 Code	Qualification Status	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Screening Level	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Length	Width	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Manufacturer Package Code	Reach Compliance Code	ECCN Code	HTS Code	Samacsys Manufacturer	Date Of Intro

Check for Price

Obsolete

36.864 kbit

4KX9

5 V

30 ns

25 MHz

40 ns

BI-DIRECTIONAL FIFO

RETRANSMIT

4000

4.096 k

ASYNCHRONOUS

PARALLEL

4 mA

150 µA

5.5 V

4.5 V

CMOS

MILITARY

R-CDIP-T28

Not Qualified

125 °C

-55 °C

240

MIL-STD-883 Class B

CERAMIC, METAL-SEALED COFIRED

DIP

DIP28,.6

RECTANGULAR

IN-LINE

Tin/Lead (Sn63Pb37)

THROUGH-HOLE

2.54 mm

DUAL

5.08 mm

37.1475 mm

7.62 mm

RENESAS ELECTRONICS CORP

CDIP

CERAMIC, DIP-28

CD28

not_compliant

NLR

8542320071

Renesas Electronics

Check for Price

Transferred

36.864 kbit

4KX9

5 V

30 ns

25 MHz

40 ns

OTHER FIFO

RETRANSMIT

4000

4.096 k

ASYNCHRONOUS

PARALLEL

4 mA

150 µA

5.5 V

4.5 V

CMOS

MILITARY

R-CDIP-T28

Not Qualified

125 °C

-55 °C

240

MIL-STD-883 Class B

CERAMIC, METAL-SEALED COFIRED

DIP

DIP28,.6

RECTANGULAR

IN-LINE

TIN LEAD

THROUGH-HOLE

2.54 mm

DUAL

5.08 mm

37.1475 mm

7.62 mm

INTEGRATED DEVICE TECHNOLOGY INC

CDIP

CERAMIC, DIP-28

CD28

not_compliant

EAR99

8542.32.00.71

1988-01-01

Check for Price

Yes

Transferred

36.864 kbit

4KX9

5 V

30 ns

40 ns

RETRANSMIT

4000

4.096 k

ASYNCHRONOUS

3-STATE

PARALLEL

5.5 V

4.5 V

CMOS

MILITARY

R-GDIP-T28

Not Qualified

125 °C

-55 °C

MIL-STD-883 Class B

CERAMIC, GLASS-SEALED

DIP

RECTANGULAR

IN-LINE

MATTE TIN

THROUGH-HOLE

2.54 mm

DUAL

5.08 mm

37.1475 mm

7.62 mm

INTEGRATED DEVICE TECHNOLOGY INC

DIP

DIP,

compliant

EAR99

8542.32.00.71

Check for Price

Yes

Transferred

36.864 kbit

4KX9

5 V

30 ns

40 ns

RETRANSMIT

4000

4.096 k

ASYNCHRONOUS

PARALLEL

5.5 V

4.5 V

CMOS

MILITARY

R-GDIP-T28

Not Qualified

125 °C

-55 °C

MIL-STD-883 Class B

CERAMIC, GLASS-SEALED

DIP

RECTANGULAR

IN-LINE

MATTE TIN

THROUGH-HOLE

2.54 mm

DUAL

5.08 mm

37.1475 mm

7.62 mm

INTEGRATED DEVICE TECHNOLOGY INC

DIP

DIP,

compliant

EAR99

8542.32.00.71

Check for Price

Transferred

36.864 kbit

4KX9

5 V

30 ns

25 MHz

40 ns

OTHER FIFO

RETRANSMIT

4000

4.096 k

ASYNCHRONOUS

3-STATE

PARALLEL

4 mA

150 µA

5.5 V

4.5 V

CMOS

MILITARY

R-GDIP-T28

Not Qualified

125 °C

-55 °C

MIL-STD-883 Class B

CERAMIC, GLASS-SEALED

DIP

DIP28,.6

RECTANGULAR

IN-LINE

TIN LEAD

THROUGH-HOLE

2.54 mm

DUAL

5.08 mm

37.1475 mm

7.62 mm

INTEGRATED DEVICE TECHNOLOGY INC

DIP

DIP, DIP28,.6

not_compliant

EAR99

8542.32.00.71

1988-01-01

Compare

7204L30DB

Renesas Electronics Corporation

Check for Price

Obsolete

36.864 kbit

4KX9

5 V

30 ns

25 MHz

40 ns

BI-DIRECTIONAL FIFO

RETRANSMIT

4000

4.096 k

ASYNCHRONOUS

PARALLEL

4 mA

150 µA

5.5 V

4.5 V

CMOS

MILITARY

R-CDIP-T28

Not Qualified

125 °C

-55 °C

240

MIL-STD-883 Class B

CERAMIC, METAL-SEALED COFIRED

DIP

DIP28,.6

RECTANGULAR

IN-LINE

Tin/Lead (Sn63Pb37)

THROUGH-HOLE

2.54 mm

DUAL

5.08 mm

37.1475 mm

7.62 mm

RENESAS ELECTRONICS CORP

CDIP

CERAMIC, DIP-28

CD28

not_compliant

NLR

8542320071

Renesas Electronics

7204L30DB

Integrated Device Technology Inc

Check for Price

Transferred

36.864 kbit

4KX9

5 V

30 ns

25 MHz

40 ns

OTHER FIFO

RETRANSMIT

4000

4.096 k

ASYNCHRONOUS

PARALLEL

4 mA

150 µA

5.5 V

4.5 V

CMOS

MILITARY

R-CDIP-T28

Not Qualified

125 °C

-55 °C

240

MIL-STD-883 Class B

CERAMIC, METAL-SEALED COFIRED

DIP

DIP28,.6

RECTANGULAR

IN-LINE

TIN LEAD

THROUGH-HOLE

2.54 mm

DUAL

5.08 mm

37.1475 mm

7.62 mm

INTEGRATED DEVICE TECHNOLOGY INC

CDIP

CERAMIC, DIP-28

CD28

not_compliant

EAR99

8542.32.00.71

1988-01-01

IDT7204L30DBG

Integrated Device Technology Inc

Check for Price

Yes

Transferred

36.864 kbit

4KX9

5 V

30 ns

40 ns

RETRANSMIT

4000

4.096 k

ASYNCHRONOUS

3-STATE

PARALLEL

5.5 V

4.5 V

CMOS

MILITARY

R-GDIP-T28

Not Qualified

125 °C

-55 °C

MIL-STD-883 Class B

CERAMIC, GLASS-SEALED

DIP

RECTANGULAR

IN-LINE

MATTE TIN

THROUGH-HOLE

2.54 mm

DUAL

5.08 mm

37.1475 mm

7.62 mm

INTEGRATED DEVICE TECHNOLOGY INC

DIP

DIP,

compliant

EAR99

8542.32.00.71

7204L30DBG

Integrated Device Technology Inc

Check for Price

Yes

Transferred

36.864 kbit

4KX9

5 V

30 ns

40 ns

RETRANSMIT

4000

4.096 k

ASYNCHRONOUS

PARALLEL

5.5 V

4.5 V

CMOS

MILITARY

R-GDIP-T28

Not Qualified

125 °C

-55 °C

MIL-STD-883 Class B

CERAMIC, GLASS-SEALED

DIP

RECTANGULAR

IN-LINE

MATTE TIN

THROUGH-HOLE

2.54 mm

DUAL

5.08 mm

37.1475 mm

7.62 mm

INTEGRATED DEVICE TECHNOLOGY INC

DIP

DIP,

compliant

EAR99

8542.32.00.71

IDT7204L30DB

Integrated Device Technology Inc

Check for Price

Transferred

36.864 kbit

4KX9

5 V

30 ns

25 MHz

40 ns

OTHER FIFO

RETRANSMIT

4000

4.096 k

ASYNCHRONOUS

3-STATE

PARALLEL

4 mA

150 µA

5.5 V

4.5 V

CMOS

MILITARY

R-GDIP-T28

Not Qualified

125 °C

-55 °C

MIL-STD-883 Class B

CERAMIC, GLASS-SEALED

DIP

DIP28,.6

RECTANGULAR

IN-LINE

TIN LEAD

THROUGH-HOLE

2.54 mm

DUAL

5.08 mm

37.1475 mm

7.62 mm

INTEGRATED DEVICE TECHNOLOGY INC

DIP

DIP, DIP28,.6

not_compliant

EAR99

8542.32.00.71

1988-01-01

Parametric results for: 7204L30DB under FIFOs