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71V65703S75PFG
Integrated Device Technology Inc
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$9.6835 | Yes | Yes | Transferred | 9.4372 Mbit | 36 | 256KX36 | 3.3 V | 7.5 ns | ZBT SRAM | FLOW-THROUGH | 1 | 256000 | 262.144 k | SYNCHRONOUS | PARALLEL | 3.465 V | 3.135 V | CMOS | COMMERCIAL | R-PQFP-G100 | e3 | 3 | 70 °C | 260 | 30 | 100 | PLASTIC/EPOXY | QFP | RECTANGULAR | FLATPACK | YES | MATTE TIN | GULL WING | QUAD | INTEGRATED DEVICE TECHNOLOGY INC | TQFP | TQFP-100 | 100 | PKG100 | compliant | 3A991.B.2.A | 8542.32.00.41 | ||||||||||||||||
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71V65703S75PFI
Rochester Electronics LLC
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Check for Price | No | No | Active | 9.4372 Mbit | 36 | 256KX36 | 3.3 V | 7.5 ns | ZBT SRAM | FLOW-THROUGH ARCHITECTURE | 1 | 256000 | 262.144 k | SYNCHRONOUS | PARALLEL | 3.465 V | 3.135 V | CMOS | INDUSTRIAL | R-PQFP-G100 | COMMERCIAL | e0 | 3 | 85 °C | -40 °C | 240 | 20 | 100 | PLASTIC/EPOXY | LQFP | RECTANGULAR | FLATPACK, LOW PROFILE | YES | TIN LEAD | GULL WING | 650 µm | QUAD | 1.6 mm | 20 mm | 14 mm | ROCHESTER ELECTRONICS LLC | QFP | 14 X 20 MM, 1.40 MM HEIGHT, MO-136DJ, PLASTIC, TQFP-100 | 100 | unknown | |||||||||||||
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71V65703S75PFG
Renesas Electronics Corporation
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Check for Price | Yes | Yes | Obsolete | 9.4372 Mbit | 36 | 256KX36 | 3.3 V | 7.5 ns | ZBT SRAM | FLOW-THROUGH | 1 | 256000 | 262.144 k | SYNCHRONOUS | PARALLEL | 3.465 V | 3.135 V | CMOS | COMMERCIAL | R-PQFP-G100 | e3 | 3 | 70 °C | 260 | 30 | 100 | PLASTIC/EPOXY | QFP | RECTANGULAR | FLATPACK | YES | MATTE TIN | GULL WING | QUAD | RENESAS ELECTRONICS CORP | TQFP | 100 | PKG100 | compliant | NLR | 8542320041 | Renesas Electronics | ||||||||||||||||
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71V65703S75PFG8
Integrated Device Technology Inc
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Check for Price | Yes | Yes | Transferred | 9.4372 Mbit | 36 | 256KX36 | 3.3 V | 7.5 ns | ZBT SRAM | FLOW-THROUGH | 1 | 256000 | 262.144 k | SYNCHRONOUS | PARALLEL | 3.465 V | 3.135 V | CMOS | COMMERCIAL | R-PQFP-G100 | e3 | 3 | 70 °C | 260 | 30 | 100 | PLASTIC/EPOXY | QFP | RECTANGULAR | FLATPACK | YES | MATTE TIN | GULL WING | QUAD | INTEGRATED DEVICE TECHNOLOGY INC | TQFP | TQFP-100 | 100 | PKG100 | compliant | 3A991.B.2.A | 8542.32.00.41 | ||||||||||||||||
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IDT71V65703S75PFG8
Integrated Device Technology Inc
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Check for Price | Yes | Yes | Transferred | 9.4372 Mbit | 36 | 256KX36 | 3.3 V | 7.5 ns | ZBT SRAM | FLOW-THROUGH ARCHITECTURE | 1 | 256000 | 262.144 k | SYNCHRONOUS | PARALLEL | 3.465 V | 3.135 V | CMOS | COMMERCIAL | R-PQFP-G100 | Not Qualified | e3 | 3 | 70 °C | NOT SPECIFIED | NOT SPECIFIED | 100 | PLASTIC/EPOXY | LQFP | RECTANGULAR | FLATPACK, LOW PROFILE | YES | Matte Tin (Sn) | GULL WING | 650 µm | QUAD | 1.6 mm | 20 mm | 14 mm | INTEGRATED DEVICE TECHNOLOGY INC | QFP | LQFP, | 100 | compliant | 3A991.B.2.A | 8542.32.00.41 | ||||||||||||
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71V65703S75PFGI
Integrated Device Technology Inc
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Check for Price | Yes | Yes | Transferred | 9.4372 Mbit | 36 | 256KX36 | 3.3 V | 7.5 ns | ZBT SRAM | FLOW-THROUGH | 1 | 256000 | 262.144 k | SYNCHRONOUS | PARALLEL | 3.465 V | 3.135 V | CMOS | INDUSTRIAL | R-PQFP-G100 | e3 | 3 | 85 °C | -40 °C | 260 | 30 | 100 | PLASTIC/EPOXY | QFP | RECTANGULAR | FLATPACK | YES | MATTE TIN | GULL WING | QUAD | INTEGRATED DEVICE TECHNOLOGY INC | TQFP | TQFP-100 | 100 | PKG100 | compliant | 3A991.B.2.A | 8542.32.00.41 | |||||||||||||||
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IDT71V65703S75PF
Integrated Device Technology Inc
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Check for Price | No | Obsolete | 9.4372 Mbit | 36 | 256KX36 | 3.3 V | 7.5 ns | 100 MHz | ZBT SRAM | FLOW-THROUGH ARCHITECTURE | COMMON | 1 | 256000 | 262.144 k | SYNCHRONOUS | 3-STATE | PARALLEL | 40 mA | 3.14 V | 275 µA | 3.465 V | 3.135 V | CMOS | COMMERCIAL | R-PQFP-G100 | Not Qualified | e0 | 3 | 70 °C | 225 | 20 | 100 | PLASTIC/EPOXY | LQFP | QFP100,.63X.87 | RECTANGULAR | FLATPACK, LOW PROFILE | YES | Tin/Lead (Sn85Pb15) | GULL WING | 650 µm | QUAD | 1.6 mm | 20 mm | 14 mm | INTEGRATED DEVICE TECHNOLOGY INC | QFP | 14 X 20 MM, 1.40 MM HEIGHT, MO-136DJ, PLASTIC, TQFP-100 | 100 | not_compliant | 3A991.B.2.A | 8542.32.00.41 | ||||||
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71V65703S75PFGI8
Integrated Device Technology Inc
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Check for Price | Yes | Yes | Transferred | 9.4372 Mbit | 36 | 256KX36 | 3.3 V | 7.5 ns | 100 MHz | ZBT SRAM | FLOW-THROUGH ARCHITECTURE | COMMON | 1 | 256000 | 262.144 k | SYNCHRONOUS | 3-STATE | PARALLEL | 60 mA | 3.14 V | 295 µA | 3.465 V | 3.135 V | CMOS | INDUSTRIAL | R-PQFP-G100 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 260 | 30 | 100 | PLASTIC/EPOXY | LQFP | QFP100,.63X.87 | RECTANGULAR | FLATPACK, LOW PROFILE | YES | MATTE TIN | GULL WING | 650 µm | QUAD | 1.6 mm | 20 mm | 14 mm | INTEGRATED DEVICE TECHNOLOGY INC | TQFP | 14 X 20 MM, 1.40 MM HEIGHT, GREEN, PLASTIC, MO-136DJ, TQFP-100 | 100 | PKG100 | compliant | 3A991.B.2.A | 8542.32.00.41 | |||
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IDT71V65703S75PFG
Integrated Device Technology Inc
|
Check for Price | Yes | Yes | Transferred | 9.4372 Mbit | 36 | 256KX36 | 3.3 V | 7.5 ns | ZBT SRAM | FLOW-THROUGH ARCHITECTURE | 1 | 256000 | 262.144 k | SYNCHRONOUS | PARALLEL | 3.465 V | 3.135 V | CMOS | COMMERCIAL | R-PQFP-G100 | Not Qualified | e3 | 3 | 70 °C | NOT SPECIFIED | NOT SPECIFIED | 100 | PLASTIC/EPOXY | LQFP | RECTANGULAR | FLATPACK, LOW PROFILE | YES | Matte Tin (Sn) | GULL WING | 650 µm | QUAD | 1.6 mm | 20 mm | 14 mm | INTEGRATED DEVICE TECHNOLOGY INC | QFP | LQFP, | 100 | compliant | 3A991.B.2.A | 8542.32.00.41 | ||||||||||||
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71V65703S75PFI
Integrated Device Technology Inc
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Check for Price | No | No | Obsolete | 9.4372 Mbit | 36 | 256KX36 | 3.3 V | 7.5 ns | 100 MHz | ZBT SRAM | FLOW-THROUGH ARCHITECTURE | COMMON | 1 | 256000 | 262.144 k | SYNCHRONOUS | 3-STATE | PARALLEL | 60 mA | 3.14 V | 295 µA | 3.465 V | 3.135 V | CMOS | INDUSTRIAL | R-PQFP-G100 | Not Qualified | e0 | 3 | 85 °C | -40 °C | 225 | 20 | 100 | PLASTIC/EPOXY | LQFP | QFP100,.63X.87 | RECTANGULAR | FLATPACK, LOW PROFILE | YES | TIN LEAD | GULL WING | 650 µm | QUAD | 1.6 mm | 20 mm | 14 mm | INTEGRATED DEVICE TECHNOLOGY INC | QFP | 14 X 20 MM, 1.40 MM HEIGHT, MO-136DJ, PLASTIC, TQFP-100 | 100 | not_compliant | 3A991.B.2.A | 8542.32.00.41 |