Findchips: Parametric Search Results for 70v3589s166bfg8


Select Parts		Part Number

		IDT70V3589S166BFG8 Integrated Device Technology Inc
		70V3589S166BFG8 Renesas Electronics Corporation
		70V3589S166BFG8 Integrated Device Technology Inc

				Most Relevant						Technical																	Compliance			Operating Conditions				Physical											Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Memory Density	Memory Width	Organization	Supply Voltage-Nom (Vsup)	Access Time-Max	Clock Frequency-Max (fCLK)	Memory IC Type	Additional Feature	I/O Type	Number of Functions	Number of Ports	Number of Words Code	Number of Words	Operating Mode	Output Characteristics	Parallel/Serial	Standby Current-Max	Standby Voltage-Min	Supply Current-Max	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Technology	Temperature Grade	JESD-30 Code	Qualification Status	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Length	Width	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Reach Compliance Code	ECCN Code	HTS Code	Manufacturer Package Code	Samacsys Manufacturer

Check for Price Buy

Yes

Transferred

2.3593 Mbit

64KX36

3.3 V

12 ns

166 MHz

MULTI-PORT SRAM

PIPELINED OR FLOW-THROUGH ARCHITECTURE

COMMON

64000

65.536 k

SYNCHRONOUS

3-STATE

PARALLEL

30 mA

3.15 V

500 µA

3.45 V

3.15 V

CMOS

COMMERCIAL

S-PBGA-B208

Not Qualified

70 °C

260

208

PLASTIC/EPOXY

LFBGA

BGA208,17X17,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

YES

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

800 µm

BOTTOM

1.7 mm

15 mm

INTEGRATED DEVICE TECHNOLOGY INC

BGA

LFBGA, BGA208,17X17,32

208

compliant

3A991.B.2.A

8542.32.00.41

Check for Price Buy

Yes

Obsolete

2.3593 Mbit

64KX36

3.3 V

12 ns

166 MHz

MULTI-PORT SRAM

PIPELINED OR FLOW-THROUGH ARCHITECTURE

COMMON

64000

65.536 k

SYNCHRONOUS

3-STATE

PARALLEL

30 mA

3.15 V

500 µA

3.45 V

3.15 V

CMOS

COMMERCIAL

S-PBGA-B208

Not Qualified

70 °C

260

208

PLASTIC/EPOXY

LFBGA

BGA208,17X17,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

YES

TIN SILVER COPPER

BALL

800 µm

BOTTOM

1.7 mm

15 mm

RENESAS ELECTRONICS CORP

CABGA

208

compliant

NLR

8542320041

BFG208

Renesas Electronics

Check for Price Buy

Yes

Transferred

2.3593 Mbit

64KX36

3.3 V

12 ns

166 MHz

MULTI-PORT SRAM

PIPELINED OR FLOW-THROUGH ARCHITECTURE

COMMON

64000

65.536 k

SYNCHRONOUS

3-STATE

PARALLEL

30 mA

3.15 V

500 µA

3.45 V

3.15 V

CMOS

COMMERCIAL

S-PBGA-B208

Not Qualified

70 °C

260

208

PLASTIC/EPOXY

LFBGA

BGA208,17X17,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

YES

TIN SILVER COPPER

BALL

800 µm

BOTTOM

1.7 mm

15 mm

INTEGRATED DEVICE TECHNOLOGY INC

CABGA

15 X 15 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, GREEN, FBGA-208

208

compliant

3A991.B.2.A

8542.32.00.41

BFG208

Compare

IDT70V3589S166BFG8

Integrated Device Technology Inc

Check for Price Buy

Yes

Transferred

2.3593 Mbit

64KX36

3.3 V

12 ns

166 MHz

MULTI-PORT SRAM

PIPELINED OR FLOW-THROUGH ARCHITECTURE

COMMON

64000

65.536 k

SYNCHRONOUS

3-STATE

PARALLEL

30 mA

3.15 V

500 µA

3.45 V

3.15 V

CMOS

COMMERCIAL

S-PBGA-B208

Not Qualified

70 °C

260

208

PLASTIC/EPOXY

LFBGA

BGA208,17X17,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

YES

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

800 µm

BOTTOM

1.7 mm

15 mm

INTEGRATED DEVICE TECHNOLOGY INC

BGA

LFBGA, BGA208,17X17,32

208

compliant

3A991.B.2.A

8542.32.00.41

70V3589S166BFG8

Renesas Electronics Corporation

Check for Price Buy

Yes

Obsolete

2.3593 Mbit

64KX36

3.3 V

12 ns

166 MHz

MULTI-PORT SRAM

PIPELINED OR FLOW-THROUGH ARCHITECTURE

COMMON

64000

65.536 k

SYNCHRONOUS

3-STATE

PARALLEL

30 mA

3.15 V

500 µA

3.45 V

3.15 V

CMOS

COMMERCIAL

S-PBGA-B208

Not Qualified

70 °C

260

208

PLASTIC/EPOXY

LFBGA

BGA208,17X17,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

YES

TIN SILVER COPPER

BALL

800 µm

BOTTOM

1.7 mm

15 mm

RENESAS ELECTRONICS CORP

CABGA

208

compliant

NLR

8542320041

BFG208

Renesas Electronics

70V3589S166BFG8

Integrated Device Technology Inc

Check for Price Buy

Yes

Transferred

2.3593 Mbit

64KX36

3.3 V

12 ns

166 MHz

MULTI-PORT SRAM

PIPELINED OR FLOW-THROUGH ARCHITECTURE

COMMON

64000

65.536 k

SYNCHRONOUS

3-STATE

PARALLEL

30 mA

3.15 V

500 µA

3.45 V

3.15 V

CMOS

COMMERCIAL

S-PBGA-B208

Not Qualified

70 °C

260

208

PLASTIC/EPOXY

LFBGA

BGA208,17X17,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

YES

TIN SILVER COPPER

BALL

800 µm

BOTTOM

1.7 mm

15 mm

INTEGRATED DEVICE TECHNOLOGY INC

CABGA

15 X 15 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, GREEN, FBGA-208

208

compliant

3A991.B.2.A

8542.32.00.41

BFG208

Parametric results for: 70v3589s166bfg8 under SRAMs