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Parametric results for: 25LC256-I/ST under EEPROMs

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Select Parts		Part Number

		25LC256-I/ST Microchip Technology Inc
		25LC256-I/STG Microchip Technology Inc

				Most Relevant					Technical																					Compliance			Operating Conditions						Physical											Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Memory Density	Memory Width	Organization	Supply Voltage-Nom (Vsup)	Clock Frequency-Max (fCLK)	Memory IC Type	Data Retention Time-Min	Endurance	Number of Functions	Number of Ports	Number of Words Code	Number of Words	Operating Mode	Output Characteristics	Parallel/Serial	Programming Voltage	Reverse Pinout	Serial Bus Type	Standby Current-Max	Supply Current-Max	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Technology	Temperature Grade	Write Cycle Time-Max (tWC)	Write Protection	JESD-30 Code	Qualification Status	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Screening Level	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Length	Width	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Reach Compliance Code	ECCN Code	HTS Code	Samacsys Manufacturer

$1.6773

Yes

Yes

Active

262.144 kbit

8

32KX8

5 V

10 MHz

EEPROM

200

1000000 Write/Erase Cycles

1

1

32000

32.768 k

SYNCHRONOUS

3-STATE

SERIAL

2.5 V

NO

SPI

1 µA

6 µA

5.5 V

2.5 V

CMOS

INDUSTRIAL

5 ms

HARDWARE/SOFTWARE

R-PDSO-G8

Not Qualified

e3

1

85 °C

-40 °C

260

AEC-Q100

40

8

PLASTIC/EPOXY

TSSOP

TSSOP8,.25

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

YES

Matte Tin (Sn)

GULL WING

650 µm

DUAL

1.2 mm

4.4 mm

3 mm

MICROCHIP TECHNOLOGY INC

SOIC

4.40 MM, ROHS COMPLIANT, PLASTIC, TSSOP-8

8

compliant

EAR99

8542.32.00.51

Microchip

Check for Price

Yes

Yes

Active

262.144 kbit

8

32KX8

4.5 V

10 MHz

EEPROM

200

1000000 Write/Erase Cycles

1

32000

32.768 k

SYNCHRONOUS

SERIAL

SPI

1 µA

5 µA

5.5 V

2.5 V

CMOS

INDUSTRIAL

5 ms

HARDWARE/SOFTWARE

R-PDSO-G8

Not Qualified

e3

1

85 °C

-40 °C

260

40

8

PLASTIC/EPOXY

TSSOP

TSSOP8,.25

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

YES

Matte Tin (Sn)

GULL WING

650 µm

DUAL

1.1 mm

4.4 mm

3 mm

MICROCHIP TECHNOLOGY INC

TSSOP

4.40 MM, PLASTIC, MO-153, TSSOP-8

8

compliant

EAR99

8542.32.00.51

Microchip

Compare

Microchip Technology Inc

Yes

Yes

Active

262.144 kbit

8

32KX8

5 V

10 MHz

EEPROM

200

1000000 Write/Erase Cycles

1

1

32000

32.768 k

SYNCHRONOUS

3-STATE

SERIAL

2.5 V

NO

SPI

1 µA

6 µA

5.5 V

2.5 V

CMOS

INDUSTRIAL

5 ms

HARDWARE/SOFTWARE

R-PDSO-G8

Not Qualified

e3

1

85 °C

-40 °C

260

AEC-Q100

40

8

PLASTIC/EPOXY

TSSOP

TSSOP8,.25

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

YES

Matte Tin (Sn)

GULL WING

650 µm

DUAL

1.2 mm

4.4 mm

3 mm

MICROCHIP TECHNOLOGY INC

SOIC

4.40 MM, ROHS COMPLIANT, PLASTIC, TSSOP-8

8

compliant

EAR99

8542.32.00.51

Microchip

Microchip Technology Inc

Check for Price

Yes

Yes

Active

262.144 kbit

8

32KX8

4.5 V

10 MHz

EEPROM

200

1000000 Write/Erase Cycles

1

32000

32.768 k

SYNCHRONOUS

SERIAL

SPI

1 µA

5 µA

5.5 V

2.5 V

CMOS

INDUSTRIAL

5 ms

HARDWARE/SOFTWARE

R-PDSO-G8

Not Qualified

e3

1

85 °C

-40 °C

260

40

8

PLASTIC/EPOXY

TSSOP

TSSOP8,.25

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

YES

Matte Tin (Sn)

GULL WING

650 µm

DUAL

1.1 mm

4.4 mm

3 mm

MICROCHIP TECHNOLOGY INC

TSSOP

4.40 MM, PLASTIC, MO-153, TSSOP-8

8

compliant

EAR99

8542.32.00.51

Microchip