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24LC256-E/ST
Microchip Technology Inc
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$0.8886 Buy | Yes | Yes | Active | 262.144 kbit | 8 | 32KX8 | 4.5 V | 400 kHz | EEPROM | 200 | 1000000 Write/Erase Cycles | 1010DDDR | 1 | 1 | 32000 | 32.768 k | SYNCHRONOUS | OPEN-DRAIN | SERIAL | 4.5 V | NO | I2C | 5 µA | 3 µA | 5.5 V | 2.5 V | CMOS | AUTOMOTIVE | 5 ms | HARDWARE | R-PDSO-G8 | Not Qualified | e3 | 1 | 125 °C | -40 °C | 260 | AEC-Q100 | 40 | 8 | PLASTIC/EPOXY | TSSOP | TSSOP8,.25 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | MATTE TIN | GULL WING | 650 µm | DUAL | 1.2 mm | 4.4 mm | 3 mm | MICROCHIP TECHNOLOGY INC | SOIC | 8 | compliant | EAR99 | 8542.32.00.51 | Microchip | ||||
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24LC256-E/STRVE
Microchip Technology Inc
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Check for Price Buy | Yes | Active | 262.144 kbit | 8 | 32KX8 | 4.5 V | 400 kHz | EEPROM | 200 | 1000000 Write/Erase Cycles | 1010DDDR | 1 | 1 | 32000 | 32.768 k | SYNCHRONOUS | OPEN-DRAIN | SERIAL | 1.7 V | NO | I2C | 5 µA | 3 µA | 5.5 V | 2.5 V | CMOS | AUTOMOTIVE | 5 ms | HARDWARE | R-PDSO-G8 | e3 | 125 °C | -40 °C | AEC-Q100 | 8 | PLASTIC/EPOXY | TSSOP | TSSOP8,.25 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | MATTE TIN | GULL WING | 650 µm | DUAL | 1.2 mm | 4.4 mm | 3 mm | MICROCHIP TECHNOLOGY INC | compliant | EAR99 | 8542.32.00.51 | TSSOP-8 | |||||||||||
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24LC256-E/ST16KVXX
Microchip Technology Inc
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Check for Price Buy | Yes | Active | 262.144 kbit | 8 | 32KX8 | 4.5 V | 400 kHz | EEPROM | 200 | 1000000 Write/Erase Cycles | 1010DDDR | 1 | 32000 | 32.768 k | SYNCHRONOUS | OPEN-DRAIN | SERIAL | 4.5 V | I2C | 5 µA | 3 µA | 5.5 V | 2.5 V | CMOS | 5 ms | HARDWARE | R-PDSO-G8 | 125 °C | -40 °C | AEC-Q100 | 8 | PLASTIC/EPOXY | TSSOP | TSSOP8,.25 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | GULL WING | 650 µm | DUAL | 1.2 mm | 4.4 mm | 3 mm | MICROCHIP TECHNOLOGY INC | compliant | TSSOP-8 | ||||||||||||||||||
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24LC256-E/ST14
Microchip Technology Inc
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Check for Price Buy | Yes | Yes | Obsolete | 262.144 kbit | 8 | 32KX8 | 3 V | 400 kHz | EEPROM | DATA RETENTION > 200 YEARS; 1,000,000 ERASE/WRITE CYCLES | 200 | 1000000 Write/Erase Cycles | 1010DDDR | 1 | 32000 | 32.768 k | SYNCHRONOUS | SERIAL | I2C | 5 µA | 3 µA | 5.5 V | 2.5 V | CMOS | AUTOMOTIVE | 5 ms | HARDWARE | R-PDSO-G14 | Not Qualified | e3 | 1 | 125 °C | -40 °C | 260 | 14 | PLASTIC/EPOXY | TSSOP | TSSOP14,.25 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | MATTE TIN | GULL WING | 650 µm | DUAL | 1.1 mm | 5 mm | 4.4 mm | MICROCHIP TECHNOLOGY INC | TSSOP | 14 | compliant | EAR99 | 8542.32.00.51 | 4.40 MM, LEAD FREE, PLASTIC, MO-153, TSSOP-14 | |||||||||
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24LC256-E/STG
Microchip Technology Inc
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Check for Price Buy | Yes | Yes | Obsolete | 262.144 kbit | 8 | 32KX8 | 4.5 V | 400 kHz | EEPROM | DATA RETENTION > 200 YEARS; 1,000,000 ERASE/WRITE CYCLES | 200 | 1000000 Write/Erase Cycles | 1010DDDR | 1 | 32000 | 32.768 k | SYNCHRONOUS | SERIAL | I2C | 5 µA | 3 µA | 5.5 V | 2.5 V | CMOS | AUTOMOTIVE | 5 ms | HARDWARE | R-PDSO-G8 | Not Qualified | e3 | 1 | 125 °C | -40 °C | 8 | PLASTIC/EPOXY | TSSOP | TSSOP8,.25 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | MATTE TIN | GULL WING | 650 µm | DUAL | 1.2 mm | 4.4 mm | 3 mm | MICROCHIP TECHNOLOGY INC | SOIC | 8 | compliant | EAR99 | 8542.32.00.51 | 4.40 MM, PLASTIC, TSSOP-8 | ||||||||||
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24LC256-E/ST16KVAO
Microchip Technology Inc
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Check for Price Buy | Yes | Active | 262.144 kbit | 8 | 32KX8 | 4.5 V | 400 kHz | EEPROM | 200 | 1000000 Write/Erase Cycles | 1010DDDR | 1 | 1 | 32000 | 32.768 k | SYNCHRONOUS | OPEN-DRAIN | SERIAL | 4.5 V | NO | I2C | 5 µA | 3 µA | 5.5 V | 2.5 V | CMOS | AUTOMOTIVE | 5 ms | HARDWARE | R-PDSO-G8 | e3 | 125 °C | -40 °C | AEC-Q100 | 8 | PLASTIC/EPOXY | TSSOP | TSSOP8,.25 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | Matte Tin (Sn) | GULL WING | 650 µm | DUAL | 1.2 mm | 4.4 mm | 3 mm | MICROCHIP TECHNOLOGY INC | compliant | EAR99 | 8542.32.00.51 | ||||||||||||
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24LC256-E/ST15KVXX
Microchip Technology Inc
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Check for Price Buy | Yes | Not Recommended | 262.144 kbit | 8 | 32KX8 | 5 V | 400 kHz | EEPROM | 200 | 1000000 Write/Erase Cycles | 1010DDDR | 1 | 32000 | 32.768 k | SYNCHRONOUS | OPEN-DRAIN | SERIAL | 4.5 V | I2C | 5 µA | 3 µA | 5.5 V | 2.5 V | CMOS | 5 ms | HARDWARE | R-PDSO-G8 | 125 °C | -40 °C | AEC-Q100 | 8 | PLASTIC/EPOXY | TSSOP | TSSOP8,.25 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | GULL WING | 650 µm | DUAL | 1.2 mm | 4.4 mm | 3 mm | MICROCHIP TECHNOLOGY INC | compliant | TSSOP-8 | ||||||||||||||||||
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24LC256-E/ST15KVAO
Microchip Technology Inc
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Check for Price Buy | Yes | Not Recommended | 262.144 kbit | 8 | 32KX8 | 5 V | 400 kHz | EEPROM | 200 | 1000000 Write/Erase Cycles | 1010DDDR | 1 | 32000 | 32.768 k | SYNCHRONOUS | OPEN-DRAIN | SERIAL | 4.5 V | I2C | 5 µA | 3 µA | 5.5 V | 2.5 V | CMOS | 5 ms | HARDWARE | R-PDSO-G8 | 125 °C | -40 °C | AEC-Q100 | 8 | PLASTIC/EPOXY | TSSOP | TSSOP8,.25 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | GULL WING | 650 µm | DUAL | 1.2 mm | 4.4 mm | 3 mm | MICROCHIP TECHNOLOGY INC | compliant | TSSOP-8 | ||||||||||||||||||
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24LC256-E/ST14G
Microchip Technology Inc
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Check for Price Buy | Yes | Yes | Obsolete | 262.144 kbit | 8 | 32KX8 | 3 V | 400 kHz | EEPROM | DATA RETENTION > 200 YEARS; 1,000,000 ERASE/WRITE CYCLES | 200 | 1000000 Write/Erase Cycles | 1010DDDR | 1 | 32000 | 32.768 k | SYNCHRONOUS | SERIAL | I2C | 5 µA | 3 µA | 5.5 V | 2.5 V | CMOS | AUTOMOTIVE | 5 ms | HARDWARE | R-PDSO-G14 | Not Qualified | e3 | 1 | 125 °C | -40 °C | 260 | 14 | PLASTIC/EPOXY | TSSOP | TSSOP14,.25 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | YES | MATTE TIN | GULL WING | 650 µm | DUAL | 1.1 mm | 5 mm | 4.4 mm | MICROCHIP TECHNOLOGY INC | TSSOP | 14 | compliant | EAR99 | 8542.32.00.51 | 4.40 MM, LEAD FREE, PLASTIC, MO-153, TSSOP-14 |