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Parametric » Telecommunication Circuits » Cordless Telephone ICs

Parametric results for: TEA1118AT under Cordless Telephone ICs

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UPC8002GR-E1
 NEC Electronics Group 		Check for Price Buy No Obsolete 3 V BIPOLAR CORDLESS TELEPHONE SUPPORT CIRCUIT 1 2.2 mA OTHER R-PDSO-G20 e0 Not Qualified 85 °C -30 °C 20 PLASTIC/EPOXY LSSOP RECTANGULAR SMALL OUTLINE, LOW PROFILE, SHRINK PITCH YES TIN LEAD GULL WING 650 µm DUAL 4.4 mm 7 mm 1.45 mm NEC ELECTRONICS CORP SSOP LSSOP, 20 compliant 8542.39.00.01
U2761B
 Atmel Corporation 		Check for Price Buy No Obsolete 3 V BIPOLAR CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT 1 OTHER R-PDSO-G28 e0 Not Qualified 85 °C -25 °C 28 PLASTIC/EPOXY SSOP SSOP28,.25 RECTANGULAR SMALL OUTLINE, SHRINK PITCH YES TIN LEAD GULL WING 650 µm DUAL 4.4 mm 9.055 mm 1.45 mm ATMEL CORP SOIC SSOP, SSOP28,.25 28 unknown 8542.39.00.01
TA31136FG
 Toshiba America Electronic Components 		Check for Price Buy Active 2 V BIPOLAR CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT 1 4.6 mA OTHER R-PDSO-G16 e2 Not Qualified 85 °C -30 °C 16 PLASTIC/EPOXY SSOP SOP16,.25,40 RECTANGULAR SMALL OUTLINE, SHRINK PITCH YES TIN SILVER GULL WING 1 mm DUAL 4.6 mm 8.2 mm 1.9 mm TOSHIBA CORP SOIC SSOP, SOP16,.25,40 16 unknown 8542.39.00.01
TK10665QCMG
 TOKO Inc 		Check for Price Buy Obsolete 2.6 V CORDLESS TELEPHONE SCRAMBLER/DESCRAMBLER 1 COMMERCIAL EXTENDED S-PQFP-G48 Not Qualified 75 °C -10 °C 48 PLASTIC/EPOXY LFQFP SQUARE FLATPACK, LOW PROFILE, FINE PITCH YES GULL WING 500 µm QUAD 7 mm 7 mm 1.7 mm TOKO INC LFQFP, unknown 8542.39.00.01
UAA2067G-T
 NXP Semiconductors 		Check for Price Buy Obsolete 3.6 V BICMOS CORDLESS TELEPHONE SUPPORT CIRCUIT 1 OTHER S-PQFP-G32 Not Qualified 85 °C -30 °C 32 PLASTIC/EPOXY LFQFP SQUARE FLATPACK, LOW PROFILE, FINE PITCH YES GULL WING 500 µm QUAD 5 mm 5 mm 1.6 mm NXP SEMICONDUCTORS LFQFP, unknown 8542.39.00.01
TA31136FN-TP1
 Toshiba America Electronic Components 		Check for Price Buy Active 2 V BIPOLAR CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT 1 4.6 mA OTHER R-PDSO-G16 Not Qualified 85 °C -30 °C 16 PLASTIC/EPOXY LSSOP RECTANGULAR SMALL OUTLINE, LOW PROFILE, SHRINK PITCH YES GULL WING 650 µm DUAL 4.4 mm 5 mm 1.6 mm TOSHIBA CORP SOIC LSSOP, 16 unknown 8542.39.00.01
TA31132FN-TP1
 Toshiba America Electronic Components 		Check for Price Buy No No Active 3.5 V CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT 1 5 mA OTHER R-PDSO-G24 e0 Not Qualified 85 °C -30 °C 24 PLASTIC/EPOXY LSSOP RECTANGULAR SMALL OUTLINE, LOW PROFILE, SHRINK PITCH YES TIN LEAD GULL WING 650 µm DUAL 5.6 mm 7.8 mm 1.6 mm TOSHIBA CORP SSOP LSSOP, 24 unknown 8542.39.00.01
BU8241F-DXE1
 ROHM Semiconductor 		Check for Price Buy Active CORDLESS TELEPHONE SUPPORT CIRCUIT 1 R-PDSO-G24 Not Qualified 24 PLASTIC/EPOXY SOP RECTANGULAR SMALL OUTLINE YES GULL WING 1.27 mm DUAL 5.4 mm 15 mm 2.01 mm ROHM CO LTD SOIC SOP, 24 compliant 8542.39.00.01
UBA1706TS
 NXP Semiconductors 		Check for Price Buy Obsolete 3.3 V BICMOS CORDLESS TELEPHONE SUPPORT CIRCUIT 1 3.2 µA COMMERCIAL EXTENDED R-PDSO-G24 e4 Not Qualified 75 °C -25 °C 24 PLASTIC/EPOXY SSOP SSOP24,.3 RECTANGULAR SMALL OUTLINE, SHRINK PITCH YES NICKEL PALLADIUM GOLD GULL WING 650 µm DUAL 5.3 mm 8.2 mm 2 mm NXP SEMICONDUCTORS SSOP SSOP, SSOP24,.3 24 compliant 8542.39.00.01
TB31262F
 Toshiba America Electronic Components 		Check for Price Buy No No Active 3.6 V BICMOS CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT 1 84 mA COMMERCIAL S-PQFP-G52 Not Qualified 70 °C -20 °C NOT SPECIFIED NOT SPECIFIED 52 PLASTIC/EPOXY QFP SQUARE FLATPACK YES GULL WING 650 µm QUAD 10 mm 10 mm 2.45 mm TOSHIBA CORP QFP QFP, 52 unknown 8542.39.00.01
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