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MCF5471ZP200
NXP Semiconductors
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$1.0000 | No | Not Recommended | 32 | 200 MHz | 32 | 32 | 66.66 MHz | YES | 1.5 V | MICROPROCESSOR, RISC | CMOS | YES | FLOATING POINT | YES | YES | 1.58 V | 1.43 V | COMMERCIAL | S-PBGA-B388 | Not Qualified | e0 | 3 | 70 °C | 260 | 40 | 388 | PLASTIC/EPOXY | BGA | SQUARE | GRID ARRAY | Tin/Lead (Sn/Pb) | BALL | 1 mm | BOTTOM | 2.55 mm | 27 mm | 27 mm | NXP SEMICONDUCTORS | 27 X 27 MM, MS-034AAL-1, PBGA-388 | unknown | 5A002.A.1 | 8542.31.00.01 | NXP | ||||||||||||
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MIMXRT555SFFOCR
NXP Semiconductors
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$1.0000 | Yes | Active | MICROPROCESSOR, RISC | 3 | 260 | 40 | NXP SEMICONDUCTORS | compliant | NXP | ||||||||||||||||||||||||||||||||||||||||||||||
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MPC8306SVMADDCA
NXP Semiconductors
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$1.0000 | Yes | Obsolete | 32 | 266 MHz | 66.67 MHz | YES | 1 V | MICROPROCESSOR, RISC | CMOS | YES | FLOATING POINT | YES | YES | 1.05 V | 950 mV | OTHER | S-PBGA-B369 | Not Qualified | e2 | 3 | 105 °C | 260 | 40 | 369 | PLASTIC/EPOXY | LFBGA | BGA369,23X23,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Tin/Silver (Sn/Ag) | BALL | 800 µm | BOTTOM | 1.61 mm | 19 mm | 19 mm | NXP SEMICONDUCTORS | 19 X 19 MM, 1.61 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, MAPBGA-369 | compliant | 3A991.A.2 | 8542.31.00.01 | NXP | |||||||||||||
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SAM9X75-I/4PB
Microchip Technology Inc
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$1.0000 | Active | 32 | 800 MHz | 69632 | 16 | 23 | 50 MHz | YES | 1.15 V | MICROPROCESSOR, RISC | CMOS | YES | FIXED POINT | YES | YES | 16 | 1 | 16 | 8 | 3 mA | 1.21 V | 1.12 V | S-PBGA-B240 | 85 °C | -40 °C | 240 | PLASTIC/EPOXY | LFBGA | BGA240,16X16,25 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | BALL | 650 µm | BOTTOM | 1.217 mm | 11 mm | 11 mm | MICROCHIP TECHNOLOGY INC | unknown | 3A991.A.2 | 8542.31.00.01 | Microchip | |||||||||||||
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DS28S60Q+
Maxim Integrated Products
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$1.6273 | Yes | Transferred | YES | 3.3 V | CRYPTOGRAPHIC AUTHENTICATOR | CMOS | 3.63 V | 1.62 V | INDUSTRIAL | S-PDSO-N12 | e3 | 1 | 105 °C | -40 °C | 260 | 30 | 12 | PLASTIC/EPOXY | HVSON | SOLCC12,.12,20 | SQUARE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | MATTE TIN | NO LEAD | 500 µm | DUAL | 800 µm | 3 mm | 3 mm | MAXIM INTEGRATED PRODUCTS INC | TDFN-12 | compliant | 8542.31.00.01 | 2020-06-18 | |||||||||||||||||||||
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EFR32MG22C224F512IM32-C
Silicon Laboratories Inc
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$2.0265 | Yes | Active | SoC | e3 | 2 | 260 | 40 | TFQFP | MATTE TIN | SILICON LABORATORIES INC | unknown | 8542.31.00.01 | |||||||||||||||||||||||||||||||||||||||||||
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EFR32FG22C121F512GM40-C
Silicon Laboratories Inc
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$2.0625 | Yes | Active | MICROPROCESSOR, RISC | e3 | 2 | 260 | 40 | Matte Tin (Sn) | SILICON LABORATORIES INC | unknown | 8542.31.00.01 | ||||||||||||||||||||||||||||||||||||||||||||
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AT91SAM9G20B-CU-999
Microchip Technology Inc
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$2.1456 | Yes | Active | 32 | 400 MHz | 32768 | 32 | 26 | 50 MHz | YES | 1 V | MICROPROCESSOR, RISC | CMOS | YES | FIXED POINT | YES | YES | 24 | 3 | 1 | 8 | 1.1 V | 900 mV | INDUSTRIAL | S-PBGA-B217 | 85 °C | -40 °C | NOT SPECIFIED | TS 16949 | NOT SPECIFIED | 217 | PLASTIC/EPOXY | LFBGA | BGA217,17X17,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | BALL | 800 µm | BOTTOM | 1.4 mm | 15 mm | 15 mm | MICROCHIP TECHNOLOGY INC | LFBGA-217 | compliant | 3A991.A.2 | 8542.31.00.01 | Microchip | ||||||||
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EFR32FG22C121F512GM32-C
Silicon Laboratories Inc
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$2.4272 | Active | MICROPROCESSOR, RISC | SILICON LABORATORIES INC | unknown | 8542.31.00.01 | ||||||||||||||||||||||||||||||||||||||||||||||||||
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EFR32MG22C224F512GN32-C
Silicon Laboratories Inc
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$2.5924 | Yes | Active | SoC | e4 | 2 | 260 | 40 | TFQFP | NICKEL PALLADIUM GOLD | SILICON LABORATORIES INC | unknown | 8542.31.00.01 |