Part Details for XC6SLX150T-2FG484I by AMD Xilinx
Results Overview of XC6SLX150T-2FG484I by AMD Xilinx
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (2 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Computing and Data Storage
XC6SLX150T-2FG484I Information
XC6SLX150T-2FG484I by AMD Xilinx is a Field Programmable Gate Array.
Field Programmable Gate Arrays are under the broader part category of Programmable Logic Devices.
Programmable Logic Devices (PLDs) are reconfigurable digital components that can be customized for different applications, offering flexibility and improved performance over fixed logic devices. Read more about Programmable Logic Devices on our Programmable Logic part category page.
Part Details for XC6SLX150T-2FG484I
XC6SLX150T-2FG484I CAD Models
XC6SLX150T-2FG484I Part Data Attributes
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XC6SLX150T-2FG484I
AMD Xilinx
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Datasheet
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XC6SLX150T-2FG484I
AMD Xilinx
Field Programmable Gate Array, 11519 CLBs, 667MHz, 147443-Cell, CMOS, PBGA484, 23 X 23 MM, 1 MM PITCH, FBGA-484
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| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | 23 X 23 MM, 1 MM PITCH, FBGA-484 | |
| Pin Count | 484 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A991.D | |
| HTS Code | 8542.39.00.01 | |
| Clock Frequency-Max | 667 MHz | |
| Combinatorial Delay of a CLB-Max | 0.26 ns | |
| JESD-30 Code | S-PBGA-B484 | |
| JESD-609 Code | e0 | |
| Length | 23 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of CLBs | 11519 | |
| Number of Inputs | 296 | |
| Number of Logic Cells | 147443 | |
| Number of Outputs | 296 | |
| Number of Terminals | 484 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 11519 CLBS | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA484,22X22,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Peak Reflow Temperature (Cel) | 225 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 2.6 mm | |
| Supply Voltage-Max | 1.26 V | |
| Supply Voltage-Min | 1.14 V | |
| Supply Voltage-Nom | 1.2 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 23 mm |
Alternate Parts for XC6SLX150T-2FG484I
This table gives cross-reference parts and alternative options found for XC6SLX150T-2FG484I. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of XC6SLX150T-2FG484I, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Manufacturer | Composite Price | Description | Compare |
|---|---|---|---|---|
| XC6SLX150T-2FG484I | AMD | Check for Price | Field Programmable Gate Array, 11519 CLBs, 667MHz, 147443-Cell, CMOS, PBGA484, 23 X 23 MM, 1 MM PITCH, FBGA-484 | XC6SLX150T-2FG484I vs XC6SLX150T-2FG484I |
| XC6SLX150T-2FG484C | AMD Xilinx | Check for Price | Field Programmable Gate Array, 11519 CLBs, 667MHz, 147443-Cell, CMOS, PBGA484, 23 X 23 MM, 1 MM PITCH, FBGA-484 | XC6SLX150T-2FG484I vs XC6SLX150T-2FG484C |
XC6SLX150T-2FG484I Frequently Asked Questions (FAQ)
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The maximum power consumption of XC6SLX150T-2FG484I is approximately 2.5W, but it can vary depending on the design and operating conditions.
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To optimize power consumption, use the Xilinx Power Estimator (XPE) tool, enable power-saving features like clock gating and dynamic voltage and frequency scaling, and optimize the design for low power consumption.
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The maximum operating frequency of XC6SLX150T-2FG484I is 550 MHz, but it can vary depending on the design and operating conditions.
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To implement a DDR3 memory interface, use the Xilinx MIG (Memory Interface Generator) tool to generate a DDR3 controller, and follow the Xilinx guidelines for DDR3 interface implementation.
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The XC6SLX150T-2FG484I has 480 user I/Os, but the maximum number of I/Os that can be used depends on the design and the number of banks used.