Part Details for TSXPC603RVGU12LC by Atmel Corporation
Results Overview of TSXPC603RVGU12LC by Atmel Corporation
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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TSXPC603RVGU12LC Information
TSXPC603RVGU12LC by Atmel Corporation is a Microprocessor.
Microprocessors are under the broader part category of Microcontrollers and Processors.
Microcontrollers (MCUs) are small, low-power integrated circuits used to control embedded systems. Microcontrollers are primarily used to automate and control devices. Read more about Microcontrollers and Processors on our Microcontrollers and Processors part category page.
Part Details for TSXPC603RVGU12LC
TSXPC603RVGU12LC CAD Models
TSXPC603RVGU12LC Part Data Attributes
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TSXPC603RVGU12LC
Atmel Corporation
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Datasheet
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TSXPC603RVGU12LC
Atmel Corporation
RISC Microprocessor, 32-Bit, 266MHz, CMOS, CBGA255, 21 X 21 MM, 3 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255
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Rohs Code | No | |
Part Life Cycle Code | Transferred | |
Ihs Manufacturer | ATMEL CORP | |
Part Package Code | BGA | |
Package Description | 21 X 21 MM, 3 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255 | |
Pin Count | 255 | |
Reach Compliance Code | compliant | |
ECCN Code | 3A991.A.2 | |
HTS Code | 8542.31.00.01 | |
Address Bus Width | 32 | |
Bit Size | 32 | |
Boundary Scan | YES | |
Clock Frequency-Max | 75 MHz | |
External Data Bus Width | 64 | |
Format | FLOATING POINT | |
Integrated Cache | YES | |
JESD-30 Code | S-CBGA-B255 | |
JESD-609 Code | e0 | |
Length | 21 mm | |
Low Power Mode | YES | |
Number of Terminals | 255 | |
Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
Package Code | BGA | |
Package Equivalence Code | BGA255,16X16,50 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Qualification Status | Not Qualified | |
Seated Height-Max | 3 mm | |
Speed | 266 MHz | |
Supply Voltage-Max | 2.625 V | |
Supply Voltage-Min | 2.375 V | |
Supply Voltage-Nom | 2.5 V | |
Surface Mount | YES | |
Technology | CMOS | |
Terminal Finish | TIN LEAD | |
Terminal Form | BALL | |
Terminal Pitch | 1.27 mm | |
Terminal Position | BOTTOM | |
Width | 21 mm | |
uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC |
Alternate Parts for TSXPC603RVGU12LC
This table gives cross-reference parts and alternative options found for TSXPC603RVGU12LC. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of TSXPC603RVGU12LC, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Manufacturer | Composite Price | Description | Compare |
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TSPC603RVGU12LC | Atmel Corporation | Check for Price | RISC Microprocessor, 32-Bit, 266MHz, CMOS, CBGA255, 21 X 21 MM, 3 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255 | TSXPC603RVGU12LC vs TSPC603RVGU12LC |
XPC603PRX266TX | Freescale Semiconductor | Check for Price | 32-BIT, 266MHz, RISC PROCESSOR, CBGA255, 21 X 21 MM, 1.27 MM PITCH, CERAMIC, BGA-255 | TSXPC603RVGU12LC vs XPC603PRX266TX |
TSXPC603RMGB/Q12LC | Teledyne e2v | Check for Price | RISC Microprocessor, 32-Bit, 266MHz, CMOS, CBGA255, 21 X 21 MM, 3 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255 | TSXPC603RVGU12LC vs TSXPC603RMGB/Q12LC |
TSXPC603RVGB/Q12LC | Teledyne e2v | Check for Price | RISC Microprocessor, 32-Bit, 266MHz, CMOS, CBGA255, 21 X 21 MM, 3 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255 | TSXPC603RVGU12LC vs TSXPC603RVGB/Q12LC |
TSPC603RVGU/T12LC | Teledyne e2v | Check for Price | RISC Microprocessor, 32-Bit, 266MHz, CMOS, CBGA255, 21 X 21 MM, 3 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255 | TSXPC603RVGU12LC vs TSPC603RVGU/T12LC |
TSXPC603RMGB/T12LC | Atmel Corporation | Check for Price | RISC Microprocessor, 32-Bit, 266MHz, CMOS, CBGA255, 21 X 21 MM, 3 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255 | TSXPC603RVGU12LC vs TSXPC603RMGB/T12LC |
TSPC603RVGB/Q12LC | Teledyne e2v | Check for Price | RISC Microprocessor, 32-Bit, 266MHz, CMOS, CBGA255, 21 X 21 MM, 3 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255 | TSXPC603RVGU12LC vs TSPC603RVGB/Q12LC |
TSPC603RMGU/T12LC | Teledyne e2v | Check for Price | RISC Microprocessor, 32-Bit, 266MHz, CMOS, CBGA255, 21 X 21 MM, 3 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255 | TSXPC603RVGU12LC vs TSPC603RMGU/T12LC |
TSPC603RMG12LC | Atmel Corporation | Check for Price | RISC Microprocessor, 32-Bit, 266MHz, CMOS, CBGA255, 21 X 21 MM, 3 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255 | TSXPC603RVGU12LC vs TSPC603RMG12LC |
TSXPC603RMGH12LC | Teledyne e2v | Check for Price | RISC Microprocessor, 32-Bit, 266MHz, CMOS, CBGA255, 21 X 21 MM, 3.08 MM HEIGHT, 1.27 MM PITCH, HITCE, CERAMIC, BGA-255 | TSXPC603RVGU12LC vs TSXPC603RMGH12LC |