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6-Bit, 1-of-2 Mux/Demux with 240 MHz Bandwidth 24-BGA MICROSTAR JUNIOR -40 to 85
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
TS3A27518EZQSR by Texas Instruments is a Multiplexer or Switch.
Multiplexers or Switches are under the broader part category of Signal Circuits.
A signal is an electronic means of transmitting information, either as an analog signal with continuous values or a digital signal with discrete values. Signals are used in various systems and networks. Read more about Signal Circuits on our Signal Circuits part category page.
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
86294067
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Verical | Analog Multiplexer Hex 1:2 24-Pin BGA MICROSTAR JUNIOR T/R RoHS: Compliant Min Qty: 312 Package Multiple: 1 Date Code: 1001 | Americas - 96358 |
|
$0.7474 / $1.2055 | Buy Now |
|
Bristol Electronics | 1148 |
|
RFQ | ||
|
Bristol Electronics | 22 |
|
RFQ | ||
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Rochester Electronics | TS3A27518E 6-Bit, 1-of-2 Mux/Demux with 240 MHz Bandwidth RoHS: Compliant Status: Obsolete Min Qty: 1 | 96358 |
|
$0.5979 / $0.9644 | Buy Now |
|
Vyrian | Other Function Semiconductors | 97977 |
|
RFQ | |
|
Win Source Electronics | IC MUX/DEMUX 6X1 24BGA | 80600 |
|
$0.6202 / $0.9309 | Buy Now |
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TS3A27518EZQSR
Texas Instruments
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Datasheet
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TS3A27518EZQSR
Texas Instruments
6-Bit, 1-of-2 Mux/Demux with 240 MHz Bandwidth 24-BGA MICROSTAR JUNIOR -40 to 85
|
Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | TEXAS INSTRUMENTS INC | |
Part Package Code | BGA | |
Package Description | BGA-24 | |
Pin Count | 24 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 | |
Samacsys Manufacturer | Texas Instruments | |
Analog IC - Other Type | SINGLE-ENDED MULTIPLEXER | |
Bandwidth-Nom | 240 MHz | |
Input Voltage-Max | 3.6 V | |
Input Voltage-Min | ||
JESD-30 Code | S-PBGA-B24 | |
JESD-609 Code | e1 | |
Length | 3 mm | |
Moisture Sensitivity Level | 1 | |
Normal Position | NO | |
Number of Channels | 1 | |
Number of Functions | 1 | |
Number of Terminals | 24 | |
Off-state Isolation-Nom | 60 dB | |
On-state Resistance Match-Nom | 0.3 Ω | |
On-state Resistance-Max (Ron) | 14.4 Ω | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Output | SEPARATE OUTPUT | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | VFBGA | |
Package Equivalence Code | BGA24,5X5,20 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | |
Peak Reflow Temperature (Cel) | 260 | |
Qualification Status | Not Qualified | |
Seated Height-Max | 1 mm | |
Signal Current-Max | 0.05 A | |
Supply Current-Max (Isup) | 0.005 mA | |
Supply Voltage-Max (Vsup) | 3.6 V | |
Supply Voltage-Min (Vsup) | 1.65 V | |
Supply Voltage-Nom (Vsup) | 1.8 V | |
Surface Mount | YES | |
Switch-off Time-Max | 31.2 ns | |
Switch-on Time-Max | 56.7 ns | |
Switching | BREAK-BEFORE-MAKE | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
Terminal Form | BALL | |
Terminal Pitch | 0.5 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Width | 3 mm |
A good PCB layout for the TS3A27518EZQSR involves keeping the signal traces short and away from noise sources, using a solid ground plane, and placing decoupling capacitors close to the device. TI provides a recommended PCB layout in the datasheet and application notes.
The TS3A27518EZQSR requires a single 1.8V power supply. Ensure that the power supply is clean and well-regulated. Power sequencing is not critical, but it's recommended to power up the device after the power supply has stabilized. TI recommends a power-up sequence of VCC followed by VREF.
The TS3A27518EZQSR supports data rates up to 5.9 Gbps. However, the actual data rate achievable depends on the system design, PCB layout, and signal integrity. TI recommends following the datasheet guidelines and application notes for optimal performance.
The TS3A27518EZQSR has a maximum junction temperature of 125°C. Ensure good airflow around the device, and consider using a heat sink or thermal pad if the device is expected to operate in high-temperature environments. TI provides thermal management guidelines in the datasheet.
The TS3A27518EZQSR has built-in ESD protection, but it's still important to follow proper ESD handling procedures during assembly and testing. Latch-up prevention can be achieved by following the recommended PCB layout and signal routing guidelines in the datasheet.