Part Details for STM32W108HBU64 by STMicroelectronics
Results Overview of STM32W108HBU64 by STMicroelectronics
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Consumer Electronics
Internet of Things (IoT)
Smart Cities
STM32W108HBU64 Information
STM32W108HBU64 by STMicroelectronics is an Other uP/uC/Peripheral IC.
Other uPs/uCs/Peripheral ICs are under the broader part category of Microcontrollers and Processors.
Microcontrollers (MCUs) are small, low-power integrated circuits used to control embedded systems. Microcontrollers are primarily used to automate and control devices. Read more about Microcontrollers and Processors on our Microcontrollers and Processors part category page.
Price & Stock for STM32W108HBU64
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
STM32W108HBU64
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Avnet Silica | MCU 32bit STM32 ARM Cortex M3 RISC 128KB Flash 125V18V 40Pin VFQFPN EP Tray (Alt: STM32W108HBU64) RoHS: Compliant Min Qty: 1 Package Multiple: 1 Lead time: 13 Weeks, 0 Days | Silica - 0 |
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Part Details for STM32W108HBU64
STM32W108HBU64 CAD Models
STM32W108HBU64 Part Data Attributes
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STM32W108HBU64
STMicroelectronics
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Datasheet
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STM32W108HBU64
STMicroelectronics
High-performance, IEEE 802.15.4 wireless system-on-chip with 128-Kbyte Flash, QFN40
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| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | STMICROELECTRONICS | |
| Part Package Code | QFN | |
| Package Description | 6 X 6 MM, 0.50 MM PITCH, ROHS COMPLIANT, VFQFPN-40 | |
| Pin Count | 40 | |
| Manufacturer Package Code | VFQFPN | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.31.00.01 | |
| Bit Size | 32 | |
| CPU Family | CORTEX-M3 | |
| JESD-30 Code | S-XQCC-N40 | |
| JESD-609 Code | e3 | |
| Length | 6 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of Terminals | 40 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | UNSPECIFIED | |
| Package Code | HVQCCN | |
| Package Equivalence Code | LCC40,.24SQ,20 | |
| Package Shape | SQUARE | |
| Package Style | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | |
| Peak Reflow Temperature (Cel) | 260 | |
| Qualification Status | Not Qualified | |
| RAM (bytes) | 8192 | |
| ROM (words) | 131072 | |
| ROM Programmability | FLASH | |
| Seated Height-Max | 1 mm | |
| Speed | 24 MHz | |
| Supply Current-Max | 150 mA | |
| Supply Voltage-Max | 1.32 V | |
| Supply Voltage-Min | 1.18 V | |
| Supply Voltage-Nom | 1.25 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | MATTE TIN | |
| Terminal Form | NO LEAD | |
| Terminal Pitch | 0.5 mm | |
| Terminal Position | QUAD | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 6 mm | |
| uPs/uCs/Peripheral ICs Type | Bluetooth SoC |