Part Details for ST93CS56M1013TR by STMicroelectronics
Results Overview of ST93CS56M1013TR by STMicroelectronics
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (4 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Consumer Electronics
Computing and Data Storage
ST93CS56M1013TR Information
ST93CS56M1013TR by STMicroelectronics is an EEPROM.
EEPROMs are under the broader part category of Memory Components.
Memory components are essential in electronics for computer processing. They can be volatile or non-volatile, depending on the desired function. Read more about Memory Components on our Memory part category page.
Part Details for ST93CS56M1013TR
ST93CS56M1013TR CAD Models
ST93CS56M1013TR Part Data Attributes
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ST93CS56M1013TR
STMicroelectronics
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Datasheet
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ST93CS56M1013TR
STMicroelectronics
128X16 MICROWIRE BUS SERIAL EEPROM, PDSO8, 0.150 INCH, PLASTIC, SO-8
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| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | STMICROELECTRONICS | |
| Part Package Code | SOIC | |
| Package Description | 0.150 INCH, PLASTIC, SO-8 | |
| Pin Count | 8 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.51 | |
| Additional Feature | 1 MILLION ERASE/WRITE CYCLES; 40 YEARS DATA RETENTION | |
| Clock Frequency-Max (fCLK) | 1 MHz | |
| Data Retention Time-Min | 40 | |
| Endurance | 1000000 Write/Erase Cycles | |
| JESD-30 Code | R-PDSO-G8 | |
| JESD-609 Code | e0 | |
| Length | 4.9 mm | |
| Memory Density | 2048 bit | |
| Memory IC Type | EEPROM | |
| Memory Width | 16 | |
| Number of Functions | 1 | |
| Number of Terminals | 8 | |
| Number of Words | 128 words | |
| Number of Words Code | 128 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Organization | 128X16 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | SOP | |
| Package Equivalence Code | SOP8,.25 | |
| Package Shape | RECTANGULAR | |
| Package Style | SMALL OUTLINE | |
| Parallel/Serial | SERIAL | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.75 mm | |
| Serial Bus Type | MICROWIRE | |
| Standby Current-Max | 0.00005 A | |
| Supply Current-Max | 0.003 mA | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 3 V | |
| Supply Voltage-Nom (Vsup) | 3.3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | DUAL | |
| Width | 3.9 mm | |
| Write Cycle Time-Max (tWC) | 10 ms | |
| Write Protection | HARDWARE/SOFTWARE |
Alternate Parts for ST93CS56M1013TR
This table gives cross-reference parts and alternative options found for ST93CS56M1013TR. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of ST93CS56M1013TR, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Manufacturer | Composite Price | Description | Compare |
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| ST93CS56M1 | STMicroelectronics | Check for Price | 128X16 MICROWIRE BUS SERIAL EEPROM, PDSO8, 0.150 INCH, PLASTIC, SO-8 | ST93CS56M1013TR vs ST93CS56M1 |
| NM93CS56M8 | Fairchild Semiconductor Corporation | Check for Price | EEPROM, 128X16, Serial, CMOS, PDSO8, 0.150 INCH, PLASTIC, SO-8 | ST93CS56M1013TR vs NM93CS56M8 |
| M93S56-MN1 | STMicroelectronics | Check for Price | 128X16 MICROWIRE BUS SERIAL EEPROM, PDSO8, 0.150 INCH, PLASTIC, SO-8 | ST93CS56M1013TR vs M93S56-MN1 |
| M93S56-MN1T | STMicroelectronics | Check for Price | 128X16 MICROWIRE BUS SERIAL EEPROM, PDSO8, 0.150 INCH, PLASTIC, SO-8 | ST93CS56M1013TR vs M93S56-MN1T |
ST93CS56M1013TR Frequently Asked Questions (FAQ)
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STMicroelectronics provides a recommended PCB layout in the application note AN2352, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and minimize EMI.
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The ST93CS56M1013TR has a thermal pad that must be connected to a thermal plane on the PCB to dissipate heat. A thermal interface material (TIM) can be used to improve heat transfer. Additionally, ensure good airflow and avoid blocking the airflow around the device.
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The ST93CS56M1013TR has an operating temperature range of -40°C to 125°C, but the maximum junction temperature (TJ) should not exceed 150°C. Ensure proper thermal management to prevent overheating.
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The OTP memory can be programmed using the STMicroelectronics' programming tool, such as the ST93CS56M1013TR Programming Software, which is available on the ST website. Follow the software's instructions and guidelines for programming the OTP memory.
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The recommended power-up sequence is to apply VCC first, followed by VPP, and then the clock signal. For power-down, reverse the sequence: remove the clock signal, then VPP, and finally VCC. This ensures proper device operation and prevents latch-up or damage.