Part Details for SLR-322MCT32 by ROHM Semiconductor

ROHM recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended, and the thermal pad should be connected to a ground plane to reduce thermal resistance.

To ensure reliable operation in high-temperature environments, it's essential to follow proper thermal design and layout guidelines. Additionally, consider using a heat sink or thermal interface material to reduce the junction temperature. ROHM also recommends derating the device's power consumption at high temperatures to prevent overheating.

ROHM recommends a soldering profile with a peak temperature of 260°C (500°F) for a maximum of 10 seconds. The device should be soldered using a no-clean flux, and the soldering iron should be set to a temperature of 350°C (662°F) to 380°C (716°F).

ROHM recommends using ESD protection devices, such as TVS diodes or ESD arrays, on the input and output pins to prevent damage from electrostatic discharge. Additionally, follow proper handling and storage procedures to prevent ESD damage during manufacturing and assembly.

ROHM recommends storing the SLR-322MCT32 in a dry, cool place with a temperature range of 5°C to 30°C (41°F to 86°F) and a relative humidity of 60% or less. The device should be stored in its original packaging or in a shielded bag to prevent ESD damage.