Datasheets
MTP2955E by:
Motorola Semiconductor Products

Power Field-Effect Transistor, 12A I(D), 60V, 0.3ohm, 1-Element, P-Channel, Silicon, Metal-oxide Semiconductor FET, TO-220AB

Part Details for MTP2955E by Motorola Semiconductor Products

Results Overview of MTP2955E by Motorola Semiconductor Products

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MTP2955E Information

MTP2955E by Motorola Semiconductor Products is a Power Field-Effect Transistor.
Power Field-Effect Transistors are under the broader part category of Transistors.

A transistor is a small semiconductor device used to amplify, control, or create electrical signals. When selecting a transistor, factors such as voltage, current rating, gain, and power dissipation must be considered, with common types. Read more about Transistors on our Transistors part category page.

Price & Stock for MTP2955E

Part # Distributor Description Stock Price Buy
Bristol Electronics   550
RFQ
Quest Components 12 A, 60 V, 0.3 ohm, P-CHANNEL, Si, POWER, MOSFET, TO-220AB 24
Buy Now
ComSIT USA Electronic Component RoHS: Not Compliant Stock DE - 0
Stock ES - 10
Stock US - 0
Stock MX - 0
Stock CN - 0
Stock HK - 0
RFQ

Part Details for MTP2955E

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MTP2955E Part Data Attributes

MTP2955E Motorola Semiconductor Products
Buy Now Datasheet
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MTP2955E Motorola Semiconductor Products Power Field-Effect Transistor, 12A I(D), 60V, 0.3ohm, 1-Element, P-Channel, Silicon, Metal-oxide Semiconductor FET, TO-220AB
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer MOTOROLA INC
Reach Compliance Code unknown
ECCN Code EAR99
HTS Code 8541.29.00.95
Avalanche Energy Rating (Eas) 216 mJ
Configuration SINGLE WITH BUILT-IN DIODE
DS Breakdown Voltage-Min 60 V
Drain Current-Max (ID) 12 A
Drain-source On Resistance-Max 0.3 Ω
FET Technology METAL-OXIDE SEMICONDUCTOR
Feedback Cap-Max (Crss) 100 pF
JEDEC-95 Code TO-220AB
JESD-30 Code R-PSFM-T3
JESD-609 Code e0
Number of Elements 1
Number of Terminals 3
Operating Mode ENHANCEMENT MODE
Operating Temperature-Max 150 °C
Package Body Material PLASTIC/EPOXY
Package Shape RECTANGULAR
Package Style FLANGE MOUNT
Polarity/Channel Type P-CHANNEL
Power Dissipation Ambient-Max 75 W
Power Dissipation-Max (Abs) 75 W
Pulsed Drain Current-Max (IDM) 36 A
Qualification Status Not Qualified
Surface Mount NO
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE
Terminal Position SINGLE
Transistor Application SWITCHING
Transistor Element Material SILICON
Turn-off Time-Max (toff) 55 ns
Turn-on Time-Max (ton) 100 ns

Alternate Parts for MTP2955E

This table gives cross-reference parts and alternative options found for MTP2955E. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of MTP2955E, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Manufacturer Composite Price Description Compare
MTP2955 Motorola Mobility LLC Check for Price 12A, 60V, 0.3ohm, P-CHANNEL, Si, POWER, MOSFET, TO-220AB MTP2955E vs MTP2955
Part Number Manufacturer Composite Price Description Compare
MTP2955E Motorola Mobility LLC Check for Price 12A, 60V, 0.3ohm, P-CHANNEL, Si, POWER, MOSFET, TO-220AB MTP2955E vs MTP2955E

MTP2955E Related Parts

MTP2955E Frequently Asked Questions (FAQ)

  • The recommended operating temperature range for the MTP2955E is -40°C to 125°C, although it can withstand storage temperatures from -55°C to 150°C.

  • To ensure reliable operation in high-temperature environments, it is recommended to derate the power dissipation of the MTP2955E according to the thermal derating curve provided in the datasheet, and to ensure good thermal conduction to a heat sink or the PCB.

  • The maximum safe operating area (SOA) for the MTP2955E is defined by the voltage and current limits specified in the datasheet. It is recommended to operate the device within these limits to prevent damage or degradation.

  • To protect the MTP2955E from electrostatic discharge (ESD), it is recommended to handle the device with anti-static precautions, such as using an anti-static wrist strap or mat, and to ensure that the device is properly grounded during assembly and testing.

  • The recommended PCB layout and thermal design for the MTP2955E involves using a thermal pad or heat sink to dissipate heat, and ensuring good thermal conduction to the PCB. A minimum of 2 oz copper thickness is recommended for the PCB, and thermal vias should be used to connect the thermal pad to the PCB.

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