Part Details for MPC8572EVTATLE by NXP Semiconductors
Results Overview of MPC8572EVTATLE by NXP Semiconductors
- Distributor Offerings: (3 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Healthcare
MPC8572EVTATLE Information
MPC8572EVTATLE by NXP Semiconductors is a Microprocessor.
Microprocessors are under the broader part category of Microcontrollers and Processors.
Microcontrollers (MCUs) are small, low-power integrated circuits used to control embedded systems. Microcontrollers are primarily used to automate and control devices. Read more about Microcontrollers and Processors on our Microcontrollers and Processors part category page.
Price & Stock for MPC8572EVTATLE
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
VN5:3623_17821365
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Arrow Electronics | MPU PowerQUICC III MPC85xx Processor RISC 32bit 0.09um 1.2GHz 1.8V/2.5V/3.3V 1023-Pin FCBGA Tray Min Qty: 1 Package Multiple: 1 Lead time: 110 Weeks Date Code: 1336 | Americas - 500 |
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$36.8700 / $129.8900 | Buy Now |
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DISTI #
89491206
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Verical | MPU PowerQUICC III MPC85xx Processor RISC 32bit 0.09um 1.2GHz 1.8V/2.5V/3.3V 1023-Pin FCBGA Tray Min Qty: 2 Package Multiple: 1 Date Code: 1301 | Americas - 22 |
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$250.4375 / $284.5875 | Buy Now |
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Flip Electronics | Stock | 1483 |
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RFQ |
Part Details for MPC8572EVTATLE
MPC8572EVTATLE CAD Models
MPC8572EVTATLE Part Data Attributes
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MPC8572EVTATLE
NXP Semiconductors
Buy Now
Datasheet
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MPC8572EVTATLE
NXP Semiconductors
RISC PROCESSOR
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| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | NXP SEMICONDUCTORS | |
| Package Description | 33 X 33 MM, 1 MM PITCH, ROHS COMPLIANT, PLASTIC, FCBGA-1023 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 5A002 | |
| HTS Code | 8542.31.00.01 | |
| Factory Lead Time | 4 Weeks | |
| Date Of Intro | 2016-03-01 | |
| Address Bus Width | 16 | |
| Bit Size | 32 | |
| Boundary Scan | YES | |
| Clock Frequency-Max | 133 MHz | |
| External Data Bus Width | 64 | |
| Format | FLOATING POINT | |
| Integrated Cache | YES | |
| JESD-30 Code | S-PBGA-B1023 | |
| JESD-609 Code | e2 | |
| Length | 33 mm | |
| Low Power Mode | YES | |
| Moisture Sensitivity Level | 3 | |
| Number of Terminals | 1023 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | HBGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, HEAT SINK/SLUG | |
| Peak Reflow Temperature (Cel) | 245 | |
| Seated Height-Max | 3.38 mm | |
| Speed | 1200 MHz | |
| Supply Voltage-Max | 1.155 V | |
| Supply Voltage-Min | 1.045 V | |
| Supply Voltage-Nom | 1.1 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Terminal Finish | TIN SILVER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 33 mm | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC |
MPC8572EVTATLE Frequently Asked Questions (FAQ)
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The recommended power-up sequence is to apply power to the VDD_CORE and VDD_MPLL simultaneously, followed by VDD_DDR and VDD_IO. This ensures proper initialization of the processor and peripherals.
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The DDR memory interface can be configured using the DDR Controller registers. The configuration involves setting the memory type, clock frequency, and timing parameters. Refer to the MPC8572EVTATLE Reference Manual for detailed information.
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The maximum operating frequency of the e500 core on the MPC8572EVTATLE is 1.5 GHz. However, the actual frequency may vary depending on the specific application and thermal conditions.
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Secure boot on the MPC8572EVTATLE can be implemented using the Boot ROM and the Secure Boot mechanism. This involves generating a secure boot image, storing it in the boot ROM, and configuring the Secure Boot registers. Refer to the MPC8572EVTATLE Security Reference Manual for detailed information.
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The MPC8572EVTATLE has several thermal management options, including thermal sensors, thermal interrupts, and dynamic voltage and frequency scaling. These features can be used to monitor and control the temperature of the device, ensuring reliable operation and preventing overheating.