Part Details for MPC8536ECVJAQGA by NXP Semiconductors
Results Overview of MPC8536ECVJAQGA by NXP Semiconductors
- Distributor Offerings: (3 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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MPC8536ECVJAQGA Information
MPC8536ECVJAQGA by NXP Semiconductors is a Microprocessor.
Microprocessors are under the broader part category of Microcontrollers and Processors.
Microcontrollers (MCUs) are small, low-power integrated circuits used to control embedded systems. Microcontrollers are primarily used to automate and control devices. Read more about Microcontrollers and Processors on our Microcontrollers and Processors part category page.
Price & Stock for MPC8536ECVJAQGA
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
86128769
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Verical | MPU PowerQUICC III MPC85xx Processor RISC 32bit 0.09um 1.333GHz 1.5V/1.8V/2.5V/3.3V 783-Pin FCBGA Tray RoHS: Compliant Min Qty: 2 Package Multiple: 1 Date Code: 1601 | Americas - 24 |
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$200.2750 / $227.5875 | Buy Now |
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Rochester Electronics | MPC8536 - PowerQUICC, 32 Bit Power Arch SoC RoHS: Compliant Status: Obsolete Min Qty: 1 | 24 |
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$160.2200 / $182.0700 | Buy Now |
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Flip Electronics | Stock | 36 |
|
RFQ |
Part Details for MPC8536ECVJAQGA
MPC8536ECVJAQGA CAD Models
MPC8536ECVJAQGA Part Data Attributes
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MPC8536ECVJAQGA
NXP Semiconductors
Buy Now
Datasheet
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MPC8536ECVJAQGA
NXP Semiconductors
RISC PROCESSOR
|
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | NXP SEMICONDUCTORS | |
Package Description | 29 X 29 MM, 2.80 MM HEIGHT, 1 MM PITCH, LEAD FREE, PLASTIC, FCBGA-783 | |
Reach Compliance Code | compliant | |
ECCN Code | 5A002.A.1 | |
HTS Code | 8542.31.00.01 | |
Samacsys Manufacturer | NXP | |
Address Bus Width | 32 | |
Bit Size | 32 | |
Boundary Scan | YES | |
Clock Frequency-Max | 133 MHz | |
External Data Bus Width | 32 | |
Format | FLOATING POINT | |
Integrated Cache | YES | |
JESD-30 Code | S-PBGA-B783 | |
JESD-609 Code | e2 | |
Length | 29 mm | |
Low Power Mode | YES | |
Moisture Sensitivity Level | 3 | |
Number of Terminals | 783 | |
Operating Temperature-Max | 105 °C | |
Operating Temperature-Min | -40 °C | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | HBGA | |
Package Equivalence Code | BGA783,28X28,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, HEAT SINK/SLUG | |
Peak Reflow Temperature (Cel) | 260 | |
Qualification Status | Not Qualified | |
Seated Height-Max | 2.76 mm | |
Speed | 1000 MHz | |
Supply Voltage-Max | 1.05 V | |
Supply Voltage-Min | 0.95 V | |
Supply Voltage-Nom | 1 V | |
Surface Mount | YES | |
Technology | CMOS | |
Terminal Finish | Tin/Silver (Sn/Ag) | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 40 | |
Width | 29 mm | |
uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC |