Part Details for MCIMX513CJM6C by NXP Semiconductors
Results Overview of MCIMX513CJM6C by NXP Semiconductors
- Distributor Offerings: (9 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Industrial Automation
Healthcare
Renewable Energy
Robotics and Drones
MCIMX513CJM6C Information
MCIMX513CJM6C by NXP Semiconductors is an Other uP/uC/Peripheral IC.
Other uPs/uCs/Peripheral ICs are under the broader part category of Microcontrollers and Processors.
Microcontrollers (MCUs) are small, low-power integrated circuits used to control embedded systems. Microcontrollers are primarily used to automate and control devices. Read more about Microcontrollers and Processors on our Microcontrollers and Processors part category page.
Price & Stock for MCIMX513CJM6C
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
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DISTI #
57R6136
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Newark | I.mx51 32-Bit Mpu, Arm Cortex-A8 Core, 600Mhz, Mapbga 529/ Tray Rohs Compliant: Yes |Nxp MCIMX513CJM6C RoHS: Compliant Min Qty: 420 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
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$47.0000 | Buy Now |
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DISTI #
MCIMX513CJM6C
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Avnet Americas | Processor, Multimedia Applications, No GA, 19x19mm 529-Pin BGA, -40 to+95?C - Trays (Alt: MCIMX513CJM6C) RoHS: Compliant Min Qty: 14 Package Multiple: 1 Lead time: 0 Weeks, 2 Days Container: Tray | 677 Partner Stock |
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$40.9032 / $48.0792 | Buy Now |
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DISTI #
MCIMX513CJM6C
|
Avnet Americas | Processor, Multimedia Applications, No GA, 19x19mm 529-Pin BGA, -40 to+95?C - Trays (Alt: MCIMX513CJM6C) RoHS: Compliant Min Qty: 420 Package Multiple: 420 Lead time: 13 Weeks, 0 Days Container: Tray | 0 |
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$40.8964 / $48.0712 | Buy Now |
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DISTI #
841-MCIMX513CJM6C
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Mouser Electronics | Processors - Application Specialized iMX513 App Processor RoHS: Compliant | 0 |
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$46.8600 | Order Now |
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DISTI #
86015622
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Verical | SOC i.MX51 ARM Cortex A8 0.06um 529-Pin BGA Tray RoHS: Compliant Min Qty: 25 Package Multiple: 1 Date Code: 1801 | Americas - 200 |
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$47.2000 / $59.0000 | Buy Now |
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Rochester Electronics | i.MX51 32-bit MPU, ARM Cortex-A8 core, 600MHz, MAPBGA 529 RoHS: Compliant Status: Active Min Qty: 1 | 200 |
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$37.7600 / $47.2000 | Buy Now |
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DISTI #
MCIMX513CJM6C
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Avnet Silica | Processor Multimedia Applications No GA 19x19mm 529Pin BGA 40 to95C (Alt: MCIMX513CJM6C) RoHS: Compliant Min Qty: 84 Package Multiple: 84 Lead time: 15 Weeks, 0 Days | Silica - 0 |
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Buy Now | |
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DISTI #
MCIMX513CJM6C
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EBV Elektronik | Processor Multimedia Applications No GA 19x19mm 529Pin BGA 40 to95C (Alt: MCIMX513CJM6C) RoHS: Compliant Min Qty: 84 Package Multiple: 84 Lead time: 15 Weeks, 0 Days | EBV - 0 |
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Buy Now | |
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Flip Electronics | Stock, ship today | 677 |
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RFQ |
Part Details for MCIMX513CJM6C
MCIMX513CJM6C CAD Models
MCIMX513CJM6C Part Data Attributes
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MCIMX513CJM6C
NXP Semiconductors
Buy Now
Datasheet
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MCIMX513CJM6C
NXP Semiconductors
SPECIALTY MICROPROCESSOR CIRCUIT, PBGA529
|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | NXP SEMICONDUCTORS | |
| Package Description | MAPBGA-529 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 5A992.C | |
| HTS Code | 8542.31.00.01 | |
| Factory Lead Time | 13 Weeks | |
| Samacsys Manufacturer | NXP | |
| JESD-30 Code | S-PBGA-B529 | |
| JESD-609 Code | e1 | |
| Length | 19 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of Terminals | 529 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -20 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LFBGA | |
| Package Equivalence Code | BGA529,23X23,32 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH | |
| Peak Reflow Temperature (Cel) | 260 | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.6 mm | |
| Supply Voltage-Max | 1.1 V | |
| Supply Voltage-Min | 0.95 V | |
| Supply Voltage-Nom | 1 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | OTHER | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 40 | |
| Width | 19 mm | |
| uPs/uCs/Peripheral ICs Type | SoC |