Part Details for MCIMX513CJM6C by Freescale Semiconductor
Results Overview of MCIMX513CJM6C by Freescale Semiconductor
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Industrial Automation
Healthcare
Renewable Energy
Robotics and Drones
MCIMX513CJM6C Information
MCIMX513CJM6C by Freescale Semiconductor is a Multifunction Peripheral.
Multifunction Peripherals are under the broader part category of Microcontrollers and Processors.
Microcontrollers (MCUs) are small, low-power integrated circuits used to control embedded systems. Microcontrollers are primarily used to automate and control devices. Read more about Microcontrollers and Processors on our Microcontrollers and Processors part category page.
Price & Stock for MCIMX513CJM6C
| Part # | Distributor | Description | Stock | Price | Buy | |
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Rochester Electronics | i.MX51 32-bit MPU, ARM Cortex-A8 core, 600MHz, MAPBGA 529 RoHS: Compliant Status: Active Min Qty: 1 | 1 |
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$37.7600 / $47.2000 | Buy Now |
Part Details for MCIMX513CJM6C
MCIMX513CJM6C CAD Models
MCIMX513CJM6C Part Data Attributes
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MCIMX513CJM6C
Freescale Semiconductor
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Datasheet
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MCIMX513CJM6C
Freescale Semiconductor
i.MX51 32-bit MPU, ARM Cortex-A8 core, 600MHz, MAPBGA 529
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | FREESCALE SEMICONDUCTOR INC | |
| Part Package Code | BGA | |
| Package Description | MAPBGA-529 | |
| Pin Count | 529 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 5A002 | |
| HTS Code | 8542.31.00.01 | |
| JESD-30 Code | S-PBGA-B529 | |
| Length | 19 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of Terminals | 529 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -20 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LFBGA | |
| Package Equivalence Code | BGA529,23X23,32 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH | |
| Peak Reflow Temperature (Cel) | 260 | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.6 mm | |
| Supply Voltage-Max | 1.1 V | |
| Supply Voltage-Min | 0.95 V | |
| Supply Voltage-Nom | 1 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | OTHER | |
| Terminal Finish | TIN SILVER COPPER OVER NICKEL | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 40 | |
| Width | 19 mm | |
| uPs/uCs/Peripheral ICs Type | SoC |