Datasheets
MC7448HX1267ND by:

32-BIT, 1267MHz, RISC PROCESSOR, CBGA360

Part Details for MC7448HX1267ND by NXP Semiconductors

Results Overview of MC7448HX1267ND by NXP Semiconductors

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MC7448HX1267ND Information

MC7448HX1267ND by NXP Semiconductors is a Microprocessor.
Microprocessors are under the broader part category of Microcontrollers and Processors.

Microcontrollers (MCUs) are small, low-power integrated circuits used to control embedded systems. Microcontrollers are primarily used to automate and control devices. Read more about Microcontrollers and Processors on our Microcontrollers and Processors part category page.

Price & Stock for MC7448HX1267ND

Part # Distributor Description Stock Price Buy
DISTI # 22M7806
Newark Ic, microprocessor,32-Bit, cmos, bga,360Pin, ceramic Rohs Compliant: Yes |Nxp MC7448HX1267ND RoHS: Compliant Min Qty: 44 Package Multiple: 1 Date Code: 0 Container: Bulk 0
  • 25 $662.3200
$662.3200 Buy Now
Rochester Electronics MPC7448 - 32-Bit Power Architecture MPU RoHS: Not Compliant Status: Obsolete Min Qty: 1 218
  • 1 $604.7700
  • 25 $586.6300
  • 100 $568.4800
  • 500 $550.3400
  • 1,000 $532.2000
$532.2000 / $604.7700 Buy Now
DISTI # MC7448HX1267ND
Avnet Silica MPU MPC74xx RISC 64Bit 90nm 1267GHz 360Pin FCCBGA Tray (Alt: MC7448HX1267ND) RoHS: Not Compliant Min Qty: 44 Package Multiple: 44 Silica - 0
Buy Now
DISTI # MC7448HX1267ND
EBV Elektronik MPU MPC74xx RISC 64Bit 90nm 1267GHz 360Pin FCCBGA Tray (Alt: MC7448HX1267ND) RoHS: Not Compliant Min Qty: 44 Package Multiple: 44 EBV - 0
Buy Now
Flip Electronics Stock 13000
RFQ

Part Details for MC7448HX1267ND

MC7448HX1267ND Part Data Attributes

MC7448HX1267ND NXP Semiconductors
Buy Now Datasheet
Compare Parts:
MC7448HX1267ND NXP Semiconductors 32-BIT, 1267MHz, RISC PROCESSOR, CBGA360
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS
Package Description 25 X 25 MM, 2.20 MM HEIGHT, 1.27 MM PITCH, HCTE, CERAMIC, BGA-360
Reach Compliance Code unknown
ECCN Code 3A991.A.1
HTS Code 8542.31.00.01
Samacsys Manufacturer NXP
Address Bus Width
Bit Size 32
Boundary Scan NO
Clock Frequency-Max 1267 MHz
External Data Bus Width
Format FIXED POINT
Integrated Cache NO
JESD-30 Code S-CBGA-B360
JESD-609 Code e0
Length 25 mm
Low Power Mode YES
Moisture Sensitivity Level 1
Number of Terminals 360
Operating Temperature-Max 105 °C
Operating Temperature-Min
Package Body Material CERAMIC, METAL-SEALED COFIRED
Package Code BGA
Package Equivalence Code BGA360,19X19,50
Package Shape SQUARE
Package Style GRID ARRAY
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified
Seated Height-Max 2.8 mm
Speed 1267 MHz
Supply Voltage-Max 1.1 V
Supply Voltage-Min 1 V
Supply Voltage-Nom 1.05 V
Surface Mount YES
Technology CMOS
Temperature Grade OTHER
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form BALL
Terminal Pitch 1.27 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) 40
Width 25 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC

Alternate Parts for MC7448HX1267ND

This table gives cross-reference parts and alternative options found for MC7448HX1267ND. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of MC7448HX1267ND, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Manufacturer Composite Price Description Compare
MC7448VU1267ND Freescale Semiconductor Check for Price 32-BIT, 1267MHz, RISC PROCESSOR, CLGA360, 25 X 25 MM, 2.20 MM HEIGHT, 1.27 MM PITCH, ROHS COMPLIANT, HCTE, CERAMIC, LGA-360 MC7448HX1267ND vs MC7448VU1267ND
PPC7448HX1267ND Freescale Semiconductor Check for Price 32-BIT, 1267MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 2.20 MM HEIGHT, 1.27 MM PITCH, HCTE, CERAMIC, BGA-360 MC7448HX1267ND vs PPC7448HX1267ND
PPC7448VS1267ND NXP Semiconductors Check for Price 32-BIT, 1267MHz, RISC PROCESSOR, CLGA360 MC7448HX1267ND vs PPC7448VS1267ND
MC7448HX1267ND Freescale Semiconductor Check for Price 32-Bit Power Architecture MPU, 1.267GHz, 1MB L2, AltiVec, MPX/60x Bus MC7448HX1267ND vs MC7448HX1267ND
MC7448VS1267ND Freescale Semiconductor Check for Price 32-BIT, 1267 MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 2.20 MM HEIGHT, 1.27 MM PITCH, ROHS COMPLIANT, HCTE, CERAMIC, LGA-360 MC7448HX1267ND vs MC7448VS1267ND
PPC7448VU1267ND Freescale Semiconductor Check for Price 32-BIT, 1267MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 2.20 MM HEIGHT, 1.27 MM PITCH, ROHS COMPLIANT, HCTE, CERAMIC, LGA-360 MC7448HX1267ND vs PPC7448VU1267ND
Part Number Manufacturer Composite Price Description Compare
MC7448VU1267ND NXP Semiconductors $506.3569 32-BIT, 1267MHz, RISC PROCESSOR, CLGA360 MC7448HX1267ND vs MC7448VU1267ND
PC755VGU350LE Atmel Corporation Check for Price RISC Microprocessor, 32-Bit, 350MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 MC7448HX1267ND vs PC755VGU350LE
PC7447VGU1000LC Atmel Corporation Check for Price RISC Microprocessor, 32-Bit, 1000MHz, CMOS, CBGA360, 25 X 25 MM, 1.27 MM PITCH, CERAMIC, BGA-360 MC7448HX1267ND vs PC7447VGU1000LC
PC7447MGU1000NB Teledyne e2v Check for Price RISC Microprocessor, 32-Bit, 1000MHz, CMOS, CBGA360, 25 X 25 MM, 3.24 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 MC7448HX1267ND vs PC7447MGU1000NB
TSXC750AVGU8LE Thales Group Check for Price RISC Microprocessor, 32-Bit, 200MHz, CMOS, CBGA360, CERAMIC, BGA-360 MC7448HX1267ND vs TSXC750AVGU8LE
TSPC750AMGU/T10LE Atmel Corporation Check for Price RISC Microprocessor, 32-Bit, 233MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 MC7448HX1267ND vs TSPC750AMGU/T10LE
PPC7448VS867NC Freescale Semiconductor Check for Price 32-BIT, 867MHz, RISC PROCESSOR, CLGA360, 25 X 25 MM, 2.20 MM HEIGHT, 1.27 MM PITCH, ROHS COMPLIANT, HCTE, CERAMIC, LGA-360 MC7448HX1267ND vs PPC7448VS867NC
TSPC750AVGSU8LE Atmel Corporation Check for Price RISC Microprocessor, 32-Bit, 200MHz, CMOS, CBGA360, COLUMN INTERPOSER, CERAMIC, CGA-360 MC7448HX1267ND vs TSPC750AVGSU8LE
IBM25PPC750-DB0M2660 IBM Check for Price RISC Microprocessor, 32-Bit, 266MHz, CMOS, CBGA360, 25 X 25 MM, 1.27 MM PITCH, CERAMIC, BGA-360 MC7448HX1267ND vs IBM25PPC750-DB0M2660
MC7448VS800ND Freescale Semiconductor Check for Price 32-BIT, 800MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 2.20 MM HEIGHT, 1.27 MM PITCH, ROHS COMPLIANT, HCTE, CERAMIC, LGA-360 MC7448HX1267ND vs MC7448VS800ND

MC7448HX1267ND Related Parts

MC7448HX1267ND Frequently Asked Questions (FAQ)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1 oz copper thickness and a thermal relief pattern under the package.

  • Implement a robust thermal management system, including a heat sink and thermal interface material. Ensure proper airflow and avoid thermal hotspots.

  • Critical timing parameters include tCK (clock cycle time), tRAS (RAS to CAS delay), tRCD (RAS to CAS delay), tRP (RAS precharge time), and tWR (write recovery time). Refer to the DDR3 specification for detailed timing requirements.

  • Implement power gating, dynamic voltage and frequency scaling, and use low-power modes when possible. Optimize clock frequencies and disable unused peripherals to minimize power consumption.

  • Use 0.1 μF to 1 μF decoupling capacitors with a voltage rating of 2.5 V or higher. Place them as close as possible to the power pins, with a maximum distance of 1 cm.

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