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32-BIT, 1267MHz, RISC PROCESSOR, CBGA360
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
MC7448HX1267ND by NXP Semiconductors is a Microprocessor.
Microprocessors are under the broader part category of Microcontrollers and Processors.
Microcontrollers (MCUs) are small, low-power integrated circuits used to control embedded systems. Microcontrollers are primarily used to automate and control devices. Read more about Microcontrollers and Processors on our Microcontrollers and Processors part category page.
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
22M7806
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Newark | Ic, microprocessor,32-Bit, cmos, bga,360Pin, ceramic Rohs Compliant: Yes |Nxp MC7448HX1267ND RoHS: Compliant Min Qty: 44 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
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$662.3200 | Buy Now |
|
Rochester Electronics | MPC7448 - 32-Bit Power Architecture MPU RoHS: Not Compliant Status: Obsolete Min Qty: 1 | 218 |
|
$532.2000 / $604.7700 | Buy Now |
DISTI #
MC7448HX1267ND
|
Avnet Silica | MPU MPC74xx RISC 64Bit 90nm 1267GHz 360Pin FCCBGA Tray (Alt: MC7448HX1267ND) RoHS: Not Compliant Min Qty: 44 Package Multiple: 44 | Silica - 0 |
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Buy Now | |
DISTI #
MC7448HX1267ND
|
EBV Elektronik | MPU MPC74xx RISC 64Bit 90nm 1267GHz 360Pin FCCBGA Tray (Alt: MC7448HX1267ND) RoHS: Not Compliant Min Qty: 44 Package Multiple: 44 | EBV - 0 |
|
Buy Now | |
|
Flip Electronics | Stock | 13000 |
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RFQ |
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MC7448HX1267ND
NXP Semiconductors
Buy Now
Datasheet
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Compare Parts:
MC7448HX1267ND
NXP Semiconductors
32-BIT, 1267MHz, RISC PROCESSOR, CBGA360
|
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | NXP SEMICONDUCTORS | |
Package Description | 25 X 25 MM, 2.20 MM HEIGHT, 1.27 MM PITCH, HCTE, CERAMIC, BGA-360 | |
Reach Compliance Code | unknown | |
ECCN Code | 3A991.A.1 | |
HTS Code | 8542.31.00.01 | |
Samacsys Manufacturer | NXP | |
Address Bus Width | ||
Bit Size | 32 | |
Boundary Scan | NO | |
Clock Frequency-Max | 1267 MHz | |
External Data Bus Width | ||
Format | FIXED POINT | |
Integrated Cache | NO | |
JESD-30 Code | S-CBGA-B360 | |
JESD-609 Code | e0 | |
Length | 25 mm | |
Low Power Mode | YES | |
Moisture Sensitivity Level | 1 | |
Number of Terminals | 360 | |
Operating Temperature-Max | 105 °C | |
Operating Temperature-Min | ||
Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
Package Code | BGA | |
Package Equivalence Code | BGA360,19X19,50 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Peak Reflow Temperature (Cel) | 260 | |
Qualification Status | Not Qualified | |
Seated Height-Max | 2.8 mm | |
Speed | 1267 MHz | |
Supply Voltage-Max | 1.1 V | |
Supply Voltage-Min | 1 V | |
Supply Voltage-Nom | 1.05 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | OTHER | |
Terminal Finish | Tin/Lead (Sn/Pb) | |
Terminal Form | BALL | |
Terminal Pitch | 1.27 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 40 | |
Width | 25 mm | |
uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC |
This table gives cross-reference parts and alternative options found for MC7448HX1267ND. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of MC7448HX1267ND, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Manufacturer | Composite Price | Description | Compare |
---|---|---|---|---|
MC7448VU1267ND | Freescale Semiconductor | Check for Price | 32-BIT, 1267MHz, RISC PROCESSOR, CLGA360, 25 X 25 MM, 2.20 MM HEIGHT, 1.27 MM PITCH, ROHS COMPLIANT, HCTE, CERAMIC, LGA-360 | MC7448HX1267ND vs MC7448VU1267ND |
PPC7448HX1267ND | Freescale Semiconductor | Check for Price | 32-BIT, 1267MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 2.20 MM HEIGHT, 1.27 MM PITCH, HCTE, CERAMIC, BGA-360 | MC7448HX1267ND vs PPC7448HX1267ND |
PPC7448VS1267ND | NXP Semiconductors | Check for Price | 32-BIT, 1267MHz, RISC PROCESSOR, CLGA360 | MC7448HX1267ND vs PPC7448VS1267ND |
MC7448HX1267ND | Freescale Semiconductor | Check for Price | 32-Bit Power Architecture MPU, 1.267GHz, 1MB L2, AltiVec, MPX/60x Bus | MC7448HX1267ND vs MC7448HX1267ND |
MC7448VS1267ND | Freescale Semiconductor | Check for Price | 32-BIT, 1267 MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 2.20 MM HEIGHT, 1.27 MM PITCH, ROHS COMPLIANT, HCTE, CERAMIC, LGA-360 | MC7448HX1267ND vs MC7448VS1267ND |
PPC7448VU1267ND | Freescale Semiconductor | Check for Price | 32-BIT, 1267MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 2.20 MM HEIGHT, 1.27 MM PITCH, ROHS COMPLIANT, HCTE, CERAMIC, LGA-360 | MC7448HX1267ND vs PPC7448VU1267ND |
A 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1 oz copper thickness and a thermal relief pattern under the package.
Implement a robust thermal management system, including a heat sink and thermal interface material. Ensure proper airflow and avoid thermal hotspots.
Critical timing parameters include tCK (clock cycle time), tRAS (RAS to CAS delay), tRCD (RAS to CAS delay), tRP (RAS precharge time), and tWR (write recovery time). Refer to the DDR3 specification for detailed timing requirements.
Implement power gating, dynamic voltage and frequency scaling, and use low-power modes when possible. Optimize clock frequencies and disable unused peripherals to minimize power consumption.
Use 0.1 μF to 1 μF decoupling capacitors with a voltage rating of 2.5 V or higher. Place them as close as possible to the power pins, with a maximum distance of 1 cm.