Part Details for MC7447RX733NB by Rochester Electronics LLC
Results Overview of MC7447RX733NB by Rochester Electronics LLC
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- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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MC7447RX733NB Information
MC7447RX733NB by Rochester Electronics LLC is a Microprocessor.
Microprocessors are under the broader part category of Microcontrollers and Processors.
Microcontrollers (MCUs) are small, low-power integrated circuits used to control embedded systems. Microcontrollers are primarily used to automate and control devices. Read more about Microcontrollers and Processors on our Microcontrollers and Processors part category page.
Part Details for MC7447RX733NB
MC7447RX733NB CAD Models
MC7447RX733NB Part Data Attributes
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MC7447RX733NB
Rochester Electronics LLC
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Datasheet
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MC7447RX733NB
Rochester Electronics LLC
32-BIT, 733MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, FLIP CHIP, BGA-360
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| Pbfree Code | No | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | ROCHESTER ELECTRONICS LLC | |
| Part Package Code | BGA | |
| Package Description | 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, FLIP CHIP, BGA-360 | |
| Pin Count | 360 | |
| Reach Compliance Code | unknown | |
| Address Bus Width | 36 | |
| Bit Size | 32 | |
| Boundary Scan | YES | |
| External Data Bus Width | 64 | |
| Format | FLOATING POINT | |
| Integrated Cache | YES | |
| JESD-30 Code | S-CBGA-B360 | |
| Length | 25 mm | |
| Low Power Mode | YES | |
| Moisture Sensitivity Level | 1 | |
| Number of Terminals | 360 | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | BGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Peak Reflow Temperature (Cel) | 225 | |
| Qualification Status | COMMERCIAL | |
| Seated Height-Max | 3.2 mm | |
| Speed | 733 MHz | |
| Supply Voltage-Max | 1.15 V | |
| Supply Voltage-Min | 1.05 V | |
| Supply Voltage-Nom | 1.1 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Terminal Finish | NOT SPECIFIED | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Width | 25 mm | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC |