Part Details for M58BW32FB4T3F by Micron Technology Inc
Results Overview of M58BW32FB4T3F by Micron Technology Inc
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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M58BW32FB4T3F Information
M58BW32FB4T3F by Micron Technology Inc is a Flash Memory.
Flash Memories are under the broader part category of Memory Components.
Memory components are essential in electronics for computer processing. They can be volatile or non-volatile, depending on the desired function. Read more about Memory Components on our Memory part category page.
Price & Stock for M58BW32FB4T3F
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
M58BW32FB4T3F
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Avnet Silica | (Alt: M58BW32FB4T3F) RoHS: Compliant Min Qty: 500 Package Multiple: 500 Lead time: 143 Weeks, 0 Days | Silica - 0 |
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Buy Now | |
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DISTI #
M58BW32FB4T3F
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EBV Elektronik | (Alt: M58BW32FB4T3F) RoHS: Compliant Min Qty: 500 Package Multiple: 500 | EBV - 0 |
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Buy Now |
Part Details for M58BW32FB4T3F
M58BW32FB4T3F CAD Models
M58BW32FB4T3F Part Data Attributes
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M58BW32FB4T3F
Micron Technology Inc
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Datasheet
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M58BW32FB4T3F
Micron Technology Inc
Flash, 1MX32, 45ns, PQFP80, ROHS COMPLIANT, PLASTIC, QFP-60
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | MICRON TECHNOLOGY INC | |
| Part Package Code | QFP | |
| Package Description | QFP-60 | |
| Pin Count | 80 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.51 | |
| Access Time-Max | 45 ns | |
| Additional Feature | SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE; BOTTOM BOOT BLOCK | |
| Boot Block | BOTTOM | |
| Command User Interface | YES | |
| Common Flash Interface | YES | |
| Data Polling | NO | |
| JESD-30 Code | R-PQFP-G80 | |
| Length | 20 mm | |
| Memory Density | 33554432 bit | |
| Memory IC Type | FLASH | |
| Memory Width | 32 | |
| Number of Functions | 1 | |
| Number of Sectors/Size | 4,8,62 | |
| Number of Terminals | 80 | |
| Number of Words | 1048576 words | |
| Number of Words Code | 1000000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 1MX32 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | QFP | |
| Package Equivalence Code | QFP80,.7X.9,32 | |
| Package Shape | RECTANGULAR | |
| Package Style | FLATPACK | |
| Page Size | 4 words | |
| Parallel/Serial | PARALLEL | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Programming Voltage | 3.3 V | |
| Qualification Status | Not Qualified | |
| Screening Level | AEC-Q100 | |
| Seated Height-Max | 3.4 mm | |
| Sector Size | 4K,2K,16K | |
| Standby Current-Max | 0.00015 A | |
| Supply Current-Max | 0.05 mA | |
| Supply Voltage-Max (Vsup) | 3.6 V | |
| Supply Voltage-Min (Vsup) | 2.7 V | |
| Supply Voltage-Nom (Vsup) | 3.3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | AUTOMOTIVE | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | QUAD | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Toggle Bit | NO | |
| Type | NOR TYPE | |
| Width | 14 mm |
M58BW32FB4T3F Frequently Asked Questions (FAQ)
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The M58BW32FB4T3F has an operating temperature range of 0°C to 85°C, with an extended temperature range of -40°C to 100°C for industrial applications.
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According to Micron's documentation, the power-up sequence should be VCC, then VCCQ, and finally CLK. For power-down, the sequence should be reversed. It's essential to follow the recommended power-up and power-down sequencing to prevent damage to the device.
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Micron provides guidelines for PCB layout and routing in their application notes. Key recommendations include keeping signal traces short and away from power planes, using a solid ground plane, and minimizing vias and layer changes. It's also essential to follow the recommended BGA escape routing and ball-out pattern.
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To ensure clock signal integrity and minimize jitter, it's recommended to use a high-quality clock source, keep clock traces short and shielded, and use a clock buffer or repeater if necessary. Additionally, Micron recommends following the PCIe specification for clock signal requirements.
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Micron recommends using a combination of high-frequency and low-frequency decoupling capacitors for VCC and VCCQ power supplies. The recommended decoupling capacitor values and placement can be found in Micron's application notes and datasheet.