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Part Details for ISP1763AETTM by STMicroelectronics
Results Overview of ISP1763AETTM by STMicroelectronics
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Available)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
ISP1763AETTM Information
ISP1763AETTM by STMicroelectronics is a Bus Controller.
Bus Controllers are under the broader part category of Microcontrollers and Processors.
Microcontrollers (MCUs) are small, low-power integrated circuits used to control embedded systems. Microcontrollers are primarily used to automate and control devices. Read more about Microcontrollers and Processors on our Microcontrollers and Processors part category page.
Price & Stock for ISP1763AETTM
| Part # | Distributor | Description | Stock | Price | Buy | |
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Win Source Electronics | Hi-Speed USB OTG controller Rev. 02 — 24 February 2011 | 6000 |
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$8.9224 / $13.3830 | Buy Now |
Part Details for ISP1763AETTM
ISP1763AETTM CAD Models
ISP1763AETTM Part Data Attributes
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ISP1763AETTM
STMicroelectronics
Buy Now
Datasheet
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ISP1763AETTM
STMicroelectronics
Hi-Speed USB OTG controller for portable applications
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| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | STMICROELECTRONICS | |
| Part Package Code | BGA | |
| Package Description | TFBGA-64 | |
| Pin Count | 64 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.31.00.01 | |
| Samacsys Manufacturer | STMicroelectronics | |
| Additional Feature | ALSO OPERATES AT 3.3 V TYP | |
| Address Bus Width | 16 | |
| Clock Frequency-Max | 24 MHz | |
| Data Transfer Rate-Max | 240 MBps | |
| External Data Bus Width | 16 | |
| JESD-30 Code | S-PBGA-B64 | |
| Length | 4 mm | |
| Number of Terminals | 64 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TFBGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Seated Height-Max | 1.1 mm | |
| Supply Voltage-Max | 1.95 V | |
| Supply Voltage-Min | 1.65 V | |
| Supply Voltage-Nom | 1.8 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.4 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Width | 4 mm | |
| uPs/uCs/Peripheral ICs Type | BUS CONTROLLER, UNIVERSAL SERIAL BUS |
ISP1763AETTM Frequently Asked Questions (FAQ)
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STMicroelectronics provides a recommended PCB layout in the ISP1763AETTM evaluation board user manual, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and minimize electromagnetic interference (EMI).
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To configure the ISP1763AETTM for USB 3.0 SuperSpeed operation, you need to set the USB_SPEED_SEL pin to '1' and ensure that the device is powered from a 3.3V supply. Additionally, you may need to adjust the transmission line impedance and termination to meet the USB 3.0 specification requirements.
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The maximum cable length supported by ISP1763AETTM for USB 3.0 SuperSpeed operation is 3 meters, as specified in the USB 3.0 specification. However, the actual cable length may vary depending on the cable quality, signal attenuation, and system design.
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To implement power management in ISP1763AETTM, you can use the device's built-in power management features, such as the low-power mode (LPM) and the suspend mode. You can also use external power management ICs to control the power supply to the device and reduce power consumption.
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The ISP1763AETTM has a maximum junction temperature of 125°C. To ensure reliable operation, you should implement thermal management measures, such as heat sinks, thermal pads, and airflow, to keep the device temperature below 85°C. You should also follow the recommended PCB layout and component placement guidelines to minimize thermal resistance.