Part Details for NLV17SZ04DFT2G by onsemi
Results Overview of NLV17SZ04DFT2G by onsemi
- Distributor Offerings: (4 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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NLV17SZ04DFT2G Information
NLV17SZ04DFT2G by onsemi is a Gate.
Gates are under the broader part category of Logic Components.
Digital logic governs the behavior of signals in electronic circuits, enabling complex decisions based on simple binary inputs (yes/no). Logic components perform operations from these signals. Read more about Logic Components on our Logic part category page.
Price & Stock for NLV17SZ04DFT2G
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
51Y0543
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Newark | Log Inverter/Reel |Onsemi NLV17SZ04DFT2G RoHS: Not Compliant Min Qty: 6000 Package Multiple: 1 Date Code: 0 Container: Reel | 0 |
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$0.0350 / $0.0470 | Buy Now |
DISTI #
NLV17SZ04DFT2G
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Avnet Silica | Inverter Single 1 Input 5 Pins SC88A NLV17SZ04 (Alt: NLV17SZ04DFT2G) RoHS: Compliant Min Qty: 21000 Package Multiple: 3000 Lead time: 143 Weeks, 0 Days | Silica - 0 |
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Buy Now | |
DISTI #
NLV17SZ04DFT2G
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EBV Elektronik | Inverter Single 1 Input 5 Pins SC88A NLV17SZ04 (Alt: NLV17SZ04DFT2G) RoHS: Compliant Min Qty: 3000 Package Multiple: 3000 Lead time: 143 Weeks, 0 Days | EBV - 0 |
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Buy Now | |
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Win Source Electronics | IC INVERTER 1CH 1-INP SC88A | 80000 |
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$0.7701 / $0.9946 | Buy Now |
Part Details for NLV17SZ04DFT2G
NLV17SZ04DFT2G CAD Models
NLV17SZ04DFT2G Part Data Attributes
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NLV17SZ04DFT2G
onsemi
Buy Now
Datasheet
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NLV17SZ04DFT2G
onsemi
Single Inverter Automotive Device, SC-88A (SC-70-5 / SOT-353), 3000-REEL, Automotive Qualified
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Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | ONSEMI | |
Part Package Code | SC-88A (SC-70-5 / SOT-353) | |
Pin Count | 5 | |
Manufacturer Package Code | 419A-02 | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 | |
Samacsys Manufacturer | onsemi | |
Family | LVC/LCX/Z | |
JESD-30 Code | R-PDSO-G5 | |
JESD-609 Code | e3 | |
Length | 2 mm | |
Load Capacitance (CL) | 50 pF | |
Logic IC Type | INVERTER | |
Max I(ol) | 0.024 A | |
Moisture Sensitivity Level | 1 | |
Number of Functions | 1 | |
Number of Inputs | 1 | |
Number of Terminals | 5 | |
Operating Temperature-Max | 125 °C | |
Operating Temperature-Min | -55 °C | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | TSSOP | |
Package Equivalence Code | TSSOP5/6,.08 | |
Package Shape | RECTANGULAR | |
Package Style | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | |
Packing Method | TR | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Power Supply Current-Max (ICC) | 0.01 mA | |
Prop. Delay@Nom-Sup | 5.2 ns | |
Propagation Delay (tpd) | 12 ns | |
Qualification Status | Not Qualified | |
Schmitt Trigger | NO | |
Screening Level | AEC-Q100 | |
Seated Height-Max | 1.1 mm | |
Supply Voltage-Max (Vsup) | 5.5 V | |
Supply Voltage-Min (Vsup) | 1.65 V | |
Supply Voltage-Nom (Vsup) | 1.8 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | MILITARY | |
Terminal Finish | Matte Tin (Sn) - annealed | |
Terminal Form | GULL WING | |
Terminal Pitch | 0.65 mm | |
Terminal Position | DUAL | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Width | 1.25 mm |
NLV17SZ04DFT2G Frequently Asked Questions (FAQ)
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A good PCB layout for NLV17SZ04DFT2G involves keeping the input and output traces short and wide, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated power plane and a solid ground plane is recommended.
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To ensure proper power-up and power-down of NLV17SZ04DFT2G, it is recommended to follow a slow power ramp-up and ramp-down sequence, with a maximum slew rate of 10mV/μs. This helps prevent latch-up and ensures reliable operation.
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NLV17SZ04DFT2G has a thermal pad that must be connected to a solid ground plane to ensure effective heat dissipation. A thermal interface material (TIM) can be used to improve thermal conductivity. Additionally, a heat sink or a thermal management system can be used to keep the junction temperature below 150°C.
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NLV17SZ04DFT2G has built-in ESD protection, but it is still recommended to follow proper ESD handling procedures during assembly and testing. This includes using ESD-safe materials, grounding straps, and wrist straps, and minimizing the handling of devices during assembly.
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For high-reliability applications, it is recommended to follow a rigorous testing and validation process, including environmental testing, burn-in, and accelerated life testing. Additionally, a thorough analysis of the device's failure modes and effects should be performed to ensure the device meets the required reliability standards.