Datasheets
NLV17SZ04DFT2G by: onsemi

Single Inverter Automotive Device, SC-88A (SC-70-5 / SOT-353), 3000-REEL, Automotive Qualified

Part Details for NLV17SZ04DFT2G by onsemi

Results Overview of NLV17SZ04DFT2G by onsemi

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NLV17SZ04DFT2G Information

NLV17SZ04DFT2G by onsemi is a Gate.
Gates are under the broader part category of Logic Components.

Digital logic governs the behavior of signals in electronic circuits, enabling complex decisions based on simple binary inputs (yes/no). Logic components perform operations from these signals. Read more about Logic Components on our Logic part category page.

Price & Stock for NLV17SZ04DFT2G

Part # Distributor Description Stock Price Buy
DISTI # 51Y0543
Newark Log Inverter/Reel |Onsemi NLV17SZ04DFT2G RoHS: Not Compliant Min Qty: 6000 Package Multiple: 1 Date Code: 0 Container: Reel 0
  • 6,000 $0.0470
  • 12,000 $0.0420
  • 18,000 $0.0380
  • 30,000 $0.0350
$0.0350 / $0.0470 Buy Now
DISTI # NLV17SZ04DFT2G
Avnet Silica Inverter Single 1 Input 5 Pins SC88A NLV17SZ04 (Alt: NLV17SZ04DFT2G) RoHS: Compliant Min Qty: 21000 Package Multiple: 3000 Lead time: 143 Weeks, 0 Days Silica - 0
Buy Now
DISTI # NLV17SZ04DFT2G
EBV Elektronik Inverter Single 1 Input 5 Pins SC88A NLV17SZ04 (Alt: NLV17SZ04DFT2G) RoHS: Compliant Min Qty: 3000 Package Multiple: 3000 Lead time: 143 Weeks, 0 Days EBV - 0
Buy Now
Win Source Electronics IC INVERTER 1CH 1-INP SC88A 80000
  • 60 $0.9946
  • 125 $0.9305
  • 195 $0.8984
  • 280 $0.8343
  • 360 $0.8022
  • 450 $0.7701
$0.7701 / $0.9946 Buy Now

Part Details for NLV17SZ04DFT2G

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NLV17SZ04DFT2G Part Data Attributes

NLV17SZ04DFT2G onsemi
Buy Now Datasheet
Compare Parts:
NLV17SZ04DFT2G onsemi Single Inverter Automotive Device, SC-88A (SC-70-5 / SOT-353), 3000-REEL, Automotive Qualified
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Obsolete
Ihs Manufacturer ONSEMI
Part Package Code SC-88A (SC-70-5 / SOT-353)
Pin Count 5
Manufacturer Package Code 419A-02
Reach Compliance Code compliant
HTS Code 8542.39.00.01
Samacsys Manufacturer onsemi
Family LVC/LCX/Z
JESD-30 Code R-PDSO-G5
JESD-609 Code e3
Length 2 mm
Load Capacitance (CL) 50 pF
Logic IC Type INVERTER
Max I(ol) 0.024 A
Moisture Sensitivity Level 1
Number of Functions 1
Number of Inputs 1
Number of Terminals 5
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Package Body Material PLASTIC/EPOXY
Package Code TSSOP
Package Equivalence Code TSSOP5/6,.08
Package Shape RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Packing Method TR
Peak Reflow Temperature (Cel) NOT SPECIFIED
Power Supply Current-Max (ICC) 0.01 mA
Prop. Delay@Nom-Sup 5.2 ns
Propagation Delay (tpd) 12 ns
Qualification Status Not Qualified
Schmitt Trigger NO
Screening Level AEC-Q100
Seated Height-Max 1.1 mm
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 1.65 V
Supply Voltage-Nom (Vsup) 1.8 V
Surface Mount YES
Technology CMOS
Temperature Grade MILITARY
Terminal Finish Matte Tin (Sn) - annealed
Terminal Form GULL WING
Terminal Pitch 0.65 mm
Terminal Position DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 1.25 mm

NLV17SZ04DFT2G Related Parts

NLV17SZ04DFT2G Frequently Asked Questions (FAQ)

  • A good PCB layout for NLV17SZ04DFT2G involves keeping the input and output traces short and wide, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated power plane and a solid ground plane is recommended.

  • To ensure proper power-up and power-down of NLV17SZ04DFT2G, it is recommended to follow a slow power ramp-up and ramp-down sequence, with a maximum slew rate of 10mV/μs. This helps prevent latch-up and ensures reliable operation.

  • NLV17SZ04DFT2G has a thermal pad that must be connected to a solid ground plane to ensure effective heat dissipation. A thermal interface material (TIM) can be used to improve thermal conductivity. Additionally, a heat sink or a thermal management system can be used to keep the junction temperature below 150°C.

  • NLV17SZ04DFT2G has built-in ESD protection, but it is still recommended to follow proper ESD handling procedures during assembly and testing. This includes using ESD-safe materials, grounding straps, and wrist straps, and minimizing the handling of devices during assembly.

  • For high-reliability applications, it is recommended to follow a rigorous testing and validation process, including environmental testing, burn-in, and accelerated life testing. Additionally, a thorough analysis of the device's failure modes and effects should be performed to ensure the device meets the required reliability standards.

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