Part Details for M29W160EB70ZA6F by Micron Technology Inc
Results Overview of M29W160EB70ZA6F by Micron Technology Inc
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (7 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (3 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Internet of Things (IoT)
Environmental Monitoring
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Automotive
Education and Research
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Entertainment and Gaming
M29W160EB70ZA6F Information
M29W160EB70ZA6F by Micron Technology Inc is a Flash Memory.
Flash Memories are under the broader part category of Memory Components.
Memory components are essential in electronics for computer processing. They can be volatile or non-volatile, depending on the desired function. Read more about Memory Components on our Memory part category page.
Part Details for M29W160EB70ZA6F
M29W160EB70ZA6F CAD Models
M29W160EB70ZA6F Part Data Attributes
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M29W160EB70ZA6F
Micron Technology Inc
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Datasheet
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M29W160EB70ZA6F
Micron Technology Inc
Flash, 1MX16, 70ns, PBGA48, TFBGA-48
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | MICRON TECHNOLOGY INC | |
| Part Package Code | BGA | |
| Package Description | TFBGA-48 | |
| Pin Count | 48 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.51 | |
| Access Time-Max | 70 ns | |
| Additional Feature | BOTTOM BOOT BLOCK | |
| Alternate Memory Width | 8 | |
| Boot Block | BOTTOM | |
| Command User Interface | YES | |
| Common Flash Interface | YES | |
| Data Polling | YES | |
| JESD-30 Code | R-PBGA-B48 | |
| JESD-609 Code | e1 | |
| Length | 8 mm | |
| Memory Density | 16777216 bit | |
| Memory IC Type | FLASH | |
| Memory Width | 16 | |
| Number of Functions | 1 | |
| Number of Sectors/Size | 1,2,1,31 | |
| Number of Terminals | 48 | |
| Number of Words | 1048576 words | |
| Number of Words Code | 1000000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 1MX16 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TFBGA | |
| Package Equivalence Code | BGA48,6X8,32 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
| Parallel/Serial | PARALLEL | |
| Peak Reflow Temperature (Cel) | 260 | |
| Programming Voltage | 3 V | |
| Qualification Status | Not Qualified | |
| Ready/Busy | YES | |
| Seated Height-Max | 1.2 mm | |
| Sector Size | 16K,8K,32K,64K | |
| Standby Current-Max | 0.0001 A | |
| Supply Current-Max | 0.02 mA | |
| Supply Voltage-Max (Vsup) | 3.6 V | |
| Supply Voltage-Min (Vsup) | 2.7 V | |
| Supply Voltage-Nom (Vsup) | 3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Toggle Bit | YES | |
| Type | NOR TYPE | |
| Width | 6 mm |
Alternate Parts for M29W160EB70ZA6F
This table gives cross-reference parts and alternative options found for M29W160EB70ZA6F. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of M29W160EB70ZA6F, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Manufacturer | Composite Price | Description | Compare |
|---|---|---|---|---|
| M29W160FB7AZA6F6 | Numonyx Memory Solutions | Check for Price | Flash, 1MX16, 70ns, PBGA48, 6 X 8 MM, 0.80 MM PITCH, ROHS COMPLIANT, TFBGA-48 | M29W160EB70ZA6F vs M29W160FB7AZA6F6 |
| M29W160FB7AZA6E6 | Numonyx Memory Solutions | Check for Price | Flash, 1MX16, 70ns, PBGA48, 6 X 8 MM, 0.80 MM PITCH, ROHS COMPLIANT, TFBGA-48 | M29W160EB70ZA6F vs M29W160FB7AZA6E6 |
| M29W160EB7AZA6T | Micron Technology Inc | Check for Price | Flash, 1MX16, 70ns, PBGA48, 6 X 8 MM, 0.80 MM PITCH, TFBGA-48 | M29W160EB70ZA6F vs M29W160EB7AZA6T |
| M29W160EB70ZA6F | STMicroelectronics | Check for Price | 1MX16 FLASH 3V PROM, 70ns, PBGA48, 6 X 8 MM, 0.80 MM PITCH, TFBGA-48 | M29W160EB70ZA6F vs M29W160EB70ZA6F |
| M29W160EB70ZA6E | Numonyx Memory Solutions | Check for Price | Flash, 1MX16, 70ns, PBGA48, 6 X 8 MM, 0.80 MM PITCH, ROHS COMPLIANT, TFBGA-48 | M29W160EB70ZA6F vs M29W160EB70ZA6E |
| M29W160EB70ZA6E | STMicroelectronics | Check for Price | 1MX16 FLASH 3V PROM, 70ns, PBGA48, 6 X 8 MM, 0.80 MM PITCH, TFBGA-48 | M29W160EB70ZA6F vs M29W160EB70ZA6E |
| M29W160EB70ZA6T | Numonyx Memory Solutions | Check for Price | Flash, 1MX16, 70ns, PBGA48, 6 X 8 MM, 0.80 MM PITCH, TFBGA-48 | M29W160EB70ZA6F vs M29W160EB70ZA6T |
M29W160EB70ZA6F Frequently Asked Questions (FAQ)
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Micron provides a reference PCB layout and thermal management guidelines in their application notes (e.g., AN985) and technical notes (e.g., TN-00-01). It's essential to follow these guidelines to ensure reliable operation and prevent overheating.
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The power-up sequence should follow the recommended procedure in the datasheet, which includes a gradual voltage ramp-up and a delay before accessing the device. For power-down, ensure that all inputs are at a valid logic level, and then reduce the voltage supply. Consult the datasheet for specific timing requirements.
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Micron provides additional documentation and support for high-reliability and safety-critical applications, such as the 'Micron Component Reliability Handbook' and 'Micron Failure Mode Effects and Criticality Analysis (FMECA) Report'. Engineers should consult these resources and work closely with Micron's technical support team to ensure the chip meets the required standards and regulations.
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The M29W160EB70ZA6F has built-in Error-Correcting Code (ECC) capabilities. Engineers should use the chip's ECC features in conjunction with their own error detection and correction mechanisms, such as checksums or cyclic redundancy checks (CRCs), to ensure data integrity and reliability.
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When using the M29W160EB70ZA6F in a multi-chip package or SiP design, engineers should consider thermal management, signal integrity, and power distribution. They should also consult Micron's documentation on package-level reliability and thermal modeling to ensure the chip operates within its specified limits.